GB/T 4722-2017Test methods for rigid copper clad laminates for printed circuits board (English PDF)

Foreword

This standard is drafted in accordance with the rules given in GB/T 1.1-2009.

This standard replaces GB/T 4722-1992 "Test method for copper clad laminate for printed circuit".

This standard compared with GB/T 4722-1992, in addition to editorial changes in the main technical changes are as follows.

--- name changed to "printed circuit with rigid copper clad laminate test method";

--- This standard refers to the overall classification of the method from the electrical and non-electrical performance test refined into appearance, size, physical and chemical properties, machine Mechanical properties, electrical properties and environmental tests;

Applicable to rigid copper clad laminates (see Chapter 1);

--- normative reference documents added GB/T 6462-2005, removed GB/T 2036 and GB/T 2423.3 (see Chapter 2, Chapter 2 of the 1992 edition);

- increased the temperature requirements of the test conditions and the environmental test chamber (room) (see 3.1);

- Four alternative methods of sample preparation are provided for the selection of ferrous trichloride for arbitration (see 3.3.2 and Appendix A);

- increase the appearance of the insulating substrate after etching (see Chapter 4);

- Removal of the laminated copper foil per unit area mass (etch method) test method, increased the width/length of the test method (see Chapter 5, Chapter 22 of the 1992 edition);

--- increase the diagonal method to measure the vertical, keep the ruler method for the arbitration method (see 5.2);

- an increase in the thickness of the measurement point diagram (see 5.3);

--- bow/distorted result value expressed as a percentage value (see 5.4);

--- increase the metal surface can be clean, chemical resistance, substrate halogen content, glass transition temperature (Tg, deltaTg), Z-axis thermal expansion (Td), X/Y-axis thermal expansion coefficient, thermal stratification time (TMA method), heat resistance, and ultraviolet light transmittance (see Chapter 6);

- increase the vertical combustion method of the test sample pretreatment oven baking conditions, ignition flame height from (19 ± 1) mm to (20 ± 1) mm, increasing the FV-2 combustion judgment level. Increased the combustion formula of horizontal combustion method and FHB combustion (See 6.4);

--- The thermal shock bubble was renamed thermal stress, increased dip welding method, for the arbitration and identification test increased pre-baking conditions, thermal stress temperature The degree and time conditions are subject to the specification of the product (see chapter 6.5, chapter 17 of the 1992 edition);

- Lead-free solders in instruments and materials should be agreed upon by both parties (see 6.6);

--- pull-off rate "to 5 ~ 50N/s force evenly increase the tension" to "select the appropriate pull the file to (50 ± 2) mm/min The speed of the pull lead "(see 7.1, 1992 edition of 15.5.4);

- After removal of dry heat, exposure to solvent vapor, exposure to simulated peel conditions after stripping strength. Increased stripping under acceptance From the strength, increased anti-stripping instrument with automatic recording curve recorder to determine the value of the map, modified the exposure to the process solution under the stripping The width of the strip (see 7.2, 1992, Chapter 16);

--- modified bending strength test test thickness range, the parameter selection to list the form that increased the high temperature of the various resin materials Temperature selection table (see 7.3, 1992, chapter 25);

--- Increased shear board size stability sampling, increased thermal stability under the conditions of drying, dry heat conditions increased from 125 °C to 150 ° C. Modified sampling and positioning diagram. An increase in the value of the numerical processing of the deletion method (see 7.4, 1992 edition Chapter 21);

--- Remove the copper foil resistance test method, surface corrosion test method, edge corrosion test. Increased breakdown voltage (parallel layer), Resistant arcs (see Chapter 8, Chapters 6, 8 and 9 of the 1992 edition);

--- The applicable thickness range for electrical strength is changed from 0.8mm or less to 0.5mm or less. By manual step-by-step boost to automatic boost, Increased electrical strength calculation formula (see 8.2, 1992 edition 13.1);

--- Change the method name surface resistance to surface resistivity. An increase of 96 h after wet heat treatment was retained in a wet box and measured After 20 wet heat cycles, the samples were retained in a humid chamber to measure two treatment test conditions (see 8.3, 1992, section 7 chapter);

--- modified the insulation resistance of the sample size and number and hole spacing. Increased water boil after the measurement (see 8.4, 1992 edition of the 12th chapter);

- a two-fluid tank method with a dielectric constant and dielectric loss tangent test, parallel plate method (see 8.5);

--- modified the pressure vessel thermal stress sample size and sample cooking time, an increase of 5 levels of surface quality rating and schematic diagram (see 9.1, chapter 28 of the 1992 edition);

--- the sample water absorption to the oven in the (105 ~ 110) °C drying 1h. The results are changed from the difference before and after immersion (See 9.2, chapter 27 of the 1992 edition);

--- Added Appendix A CCL Etching Method.

1 Scope

This standard specifies the appearance, size, physical and chemical properties of rigid copper clad laminates for printed circuit boards (hereinafter referred to as CCLs) Mechanical properties, electrical properties, environmental performance of the test method.

This standard applies to rigid copper clad laminates for printed circuits.

2 Normative reference documents

The following documents are indispensable for the application of this document. For dated references, only the dated edition applies to this document. For undated references, the latest edition (including all modifications) applies to this document.

GB/T 1409 measurement of electrical insulation materials in the frequency, audio, high frequency (including the wavelength of meters, etc.), the permittivity and dielectric loss factor Of the recommended method

GB/T 2423.28-2005 Environmental testing for electric and electronic products - Part 2: Test methods - Test T. Soldering

GB/T 4207-2012 Determination of resistance to traceability and comparison of electrical traces for solid insulation materials

Metallic and oxide coatings - Thickness measurement - Microscopy method GB/T

3 General requirements