GB/T 18334-2025Specification for flexible multilayer printed boards (English PDF)
挠性多层印制板规范
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
October 31, 2025
Implementation date
May 1, 2026
Scope
GB/T 18334-2025 is the English-translated version of 挠性多层印制板规范.
GB/T 18334-2025 is the Chinese national standard covering the flexible multilayer board - the base film and adhesive, the conductor and via construction, the bend radius and the flexing endurance, the impedance control, and the acceptance criteria for a board that has to keep working while it is folded inside a phone or a camera. At 23,000 words. It replaces GB/T 18334-2001, a specification twenty-four years old. In force from 1 May 2026. Issued on 31 October 2025, it has been in force since 1 May 2026, replacing GB/T 18334-2001.
Document preview — GB/T 18334-2025
National Standard of the People's Republic of China
- ICS
- 31.180
- Classification
- L 30
- Replacing
- GB/T 18334-2001
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- 1.Scope1
- 2 Normative References1
- 3.Terms and Definitions1
- 4.Application Level2
- 5 Requirements2
- 5.1 General Rules2
- 5.2 File Priority Order2
- 5.3 Materials2
- 5.4 Design4
- 5.5 Appearance and Dimensions4
- 5.6 Structural Integrity11
- 5.7 Physical Properties19
- 5.8 Chemical Properties21
- 5.9 Electrical performance22
- 5.10 Environmental Performance23
- 5.11 Other Requirements23
- 6.Quality Assurance Provisions23
- 6.1 General Rule23
- 6.2 Inspection Conditions24
- 6.3 Capability Approval24
- 6.4 Approval of the appraisal24
- 6.5 Quality Consistency Inspection26
- 7.Delivery preparation32
- 7.1 Packaging Requirements32
- 7.2 Transportation32
- 7.3 Storage32
Foreword
This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part
1.Structure and Drafting Rules of Standardization Documents". Drafting. This document supersedes GB/T 18334-2001 "Specification for Flexible Multilayer Printed Circuit Boards with Through-Connections". This document is consistent with GB/T 18334- Compared to.2001, aside from structural adjustments and editorial changes, the main technical changes are as follows:
---The scope has been changed (see Chapter 1, Chapter 1 of the.2001 edition);
---Added terms and definitions (see Chapter 3);
---Added application levels (see Chapter 4);
---Added the priority order for file selection (see 5.2);
---Materials specifications have been added (see 5.3);
---Design requirements have been added (see 5.4);
---The requirement for simulated rework has been added (see 5.7.8);
---Added cleanliness requirements (see 5.8.2);
---The specification for damp heat insulation resistance has been added (see 5.9.3);
---Vibration specifications have been added (see 5.10.2);
---Added other performance specifications (see 5.11);
---Added quality assurance provisions (see Chapter 6);
1 Scope
GB/T 18334-2025 is the Chinese national standard covering the flexible multilayer board - the base film and adhesive, the conductor and via construction, the bend radius and the flexing endurance, the impedance control, and the acceptance criteria for a board that has to keep working while it is folded inside a phone or a camera. At 23,000 words. It replaces GB/T 18334-2001, a specification twenty-four years old. In force from 1 May 2026. Issued on 31 October 2025, it has been in force since 1 May 2026, replacing GB/T 18334-2001.
This document specifies the requirements, quality assurance, and delivery preparation for flexible multilayer printed circuit boards, and describes the corresponding inspection methods. This document applies to the design, production, and inspection of flexible multilayer printed circuit boards.
2 Normative references
The contents of the following documents, through normative references within the text, constitute essential provisions of this document. Dated citations are not included. For references to documents, only the version corresponding to that date applies to this document; for undated references, the latest version (including all amendments) applies. This document.
GB/T 2036 Printed Circuit Terminology
GB/T 2423.4 Environmental testing of electrical and electronic products - Part
3 Terms and Definitions
The terms and definitions defined in GB/T 2036, as well as the following terms and definitions, apply to this document.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 36 pages — is available in the English PDF.
Referenced standards
Normative references
- GB/T 2423.22Environmental testing - Part 2: Test methods - Test N: Change of temperature
- GB/T 2523Measuring methods for the surface roughness, peak count and waviness of cold-rolled metal sheet and strip
- GB/T 4725Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
- GB/T 5230Electrodeposited copper foil for printed board
- GB/T 13555Copper-clad polyimide film laminates for flexible printed circuits
- GB/T 13556Copper-clad polyester film laminates for flexible printed circuits
GB/T 2036 · GB/T 2423.4 · GB/T 2423.58 · GB/T 4588.3 · GB/T 4677-2002 · GB/T 20422
Editions of GB/T 18334
| Edition | Title | Revision | Status |
|---|---|---|---|
| GB/T 18334-2025 | Specification for flexible multilayer printed boards | current edition | Current |
| GB/T 18334-2001 | Specification for flexible multilayer printed boards with through connections | previous edition | In force |
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Related Standards
GB/T 13555-2017 — Copper-clad polyimide film laminates for flexible printed circuits
GB/T 13556-2017 — Copper-clad polyester film laminates for flexible printed circuits
GB/T 13557-2017 — Test methods for copper-clad material for flexible printed circuits
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