GB/T 18334-2025Specification for flexible multilayer printed boards (English PDF)
挠性多层印制板规范
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
October 31, 2025
Implementation date
May 1, 2026
Scope
GB/T 18334-2025 is the English-translated version of 挠性多层印制板规范.
GB/T 18334-2025 is the Chinese standard "Specification for flexible multilayer printed boards". Its scope clause reads: This document specifies the requirements, quality assurance, and delivery preparation for flexible multilayer printed circuit boards, and describes the corresponding inspection methods.
This document applies to the design, production, and inspection of flexible multilayer printed circuit boards. Its clauses include terms and definitions.
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Document preview — GB/T 18334-2025
National Standard of the People's Republic of China
- ICS
- 31.180
- Classification
- L 30
- Replacing
- GB/T 18334-2001
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Preface
- 1.Scope
- 2 Normative References
- 3.Terms and Definitions
- 4.Application Level
- 5 Requirements
- 5.1 General Rules
- 5.2 File Priority Order
- 5.3 Materials
- 5.4 Design
- 5.5 Appearance and Dimensions
- 5.6 Structural Integrity
- 5.7 Physical Properties
- 5.8 Chemical Properties
- 5.9 Electrical performance
- 5.10 Environmental Performance
- 5.11 Other Requirements
- 6.Quality Assurance Provisions
- 6.1 General Rule
- 6.2 Inspection Conditions
- 6.3 Capability Approval
- 6.4 Approval of the appraisal
- 6.5 Quality Consistency Inspection
- 7.Delivery preparation
- 7.1 Packaging Requirements
- 7.2 Transportation
- 7.3 Storage
1 Scope
This document specifies the requirements, quality assurance, and delivery preparation for flexible multilayer printed circuit boards, and describes the corresponding inspection methods.
This document applies to the design, production, and inspection of flexible multilayer printed circuit boards.
2 Normative references
The contents of the following documents, through normative references within the text, constitute essential provisions of this document. Dated citations are not included.
For references to documents, only the version corresponding to that date applies to this document; for undated references, the latest version (including all amendments) applies.
This document.
GB/T 2036 Printed Circuit Terminology
GB/T 2423.4 Environmental testing of electrical and electronic products - Part 2.Test methods - Test Db. Alternating damp heat (12h) cycle)
GB/T 2423.22 Environmental testing - Part 2.Test methods - Test N. Temperature change
GB/T 2423.58 Environmental testing of electrical and electronic products - Part 2-80.Test methods - Test Fi. Vibration mixed mode
GB/T 2523 Methods for measuring surface roughness, peak count and waviness of cold-rolled sheet and strip metal
GB/T 4588.3 Design and use of printed circuit boards
GB/T 4677-2002 Test Methods for Printed Circuit Boards
GB/T 4725 Copper-clad epoxy fiberglass cloth laminate for printed circuit boards
GB/T 5230 Electrolytic Copper Foil for Printed Circuit Boards
GB/T 13555 Polyimide film copper-clad laminates for flexible printed circuits
GB/T 13556 Copper-clad Polyester Film for Flexible Printed Circuits
GB/T 13557-2017 Test methods for flexible copper-clad foil materials for printed circuits
GB/T 14708 Coated polyester film for flexible printed circuits
GB/T 14709 Coated polyimide films for flexible printed circuits
GB/T 16261-2017 General Specification for Printed Circuit Boards
GB/T 20422 Lead-free solder
GB/T 33015 General Rules for Bonding Sheets for Multilayer Printed Circuit Boards
GB/T 35575 General Technical Requirements for Electromagnetic Shielding Films
SJ/T 10309 Solder resist for printed circuit boards
SJ20810 Printed Circuit Board Dimensions and Tolerances
SJ20828 Test patterns and layout diagrams for qualification assessment
YS/T 421 Aluminum plates, strips, and foils for indirect typesetting printing plates
YS/T 1039 Rolled Copper Foil for Flexible Printed Circuit Boards
3 Terms and Definitions
The terms and definitions defined in GB/T 2036, as well as the following terms and definitions, apply to this document.
GB/T 12631 | GB/T 19405.4 | GB/T 19405.3 | […]
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 36 pages — is available in the English PDF.
Referenced standards
Normative references
- GB/T 2036Terms for printed ciruits
- GB/T 2423.4Environmental testing for electric and electronic products - Part 2: Test method - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
- GB/T 2423.22Environmental testing - Part 2: Test methods - Test N: Change of temperature
- GB/T 2423.58Environmental testing for electric and electronic products - Part 2: Test methods - Test Fi: Vibration - Mixed mode
- GB/T 2523Measuring methods for the surface roughness, peak count and waviness of cold-rolled metal sheet and strip
- GB/T 4588.3Design and use of printed boards
Editions of GB/T 18334
| Edition | Title | Revision | Status |
|---|---|---|---|
| GB/T 18334-2025 | Specification for flexible multilayer printed boards | current edition | Current |
| GB/T 18334-2001 | Specification for flexible multilayer printed boards with through connections | previous edition | In force |
This page sells the current edition, GB/T 18334-2025. Earlier editions are listed for reference only.
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Related Standards
GB/T 13555-2017 — Copper-clad polyimide film laminates for flexible printed circuits
GB/T 13556-2017 — Copper-clad polyester film laminates for flexible printed circuits
GB/T 13557-2017 — Test methods for copper-clad material for flexible printed circuits
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