GB/T 43799-2024Sectional specification for high density interconnect printed boards (English PDF)

高密度互连印制板分规范

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

March 15, 2024

Implementation date

July 1, 2024

Scope

GB/T 43799-2024 is the English-translated version of 高密度互连印制板分规范.

GB/T 43799-2024 is the Chinese national standard covering sectional specification for high density interconnect printed boards. Issued on 15 March 2024, it has been in force since 1 July 2024.

Document preview — GB/T 43799-2024

National Standard of the People's Republic of China

ICS: 31.180
Classification: L 30

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Preface
1 Scope
2 Normative references
3 Terms and Definitions
4 Application Level
5 Categories
6 Requirement
6.1 General requirements
6.2 Priority
6.3 Materials
6.4 Design
6.5 Appearance and size
6.6 Structural integrity
6.7 Chemical properties
6.8 Physical properties
6.9 Electrical performance
6.10 Environmental performance
6.11 Rework
7 Quality Assurance Regulations23
7.1 General
7.2 Quality Assessment
7.3 Test conditions
7.4 Capability Approval
7.5 Approval of identification
7.6 Quality consistency inspection
8 Delivery Requirements27

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting.

Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.

This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.

This document is under the jurisdiction of the National Printed Circuit Standardization Technical Committee (SAC/TC47).

This document was drafted by: China Electronics Technology Group Corporation No. 15 Research Institute, Putian Hanjiang District Yiton Multilayer Circuit Co., Ltd., Guangzhou Guanghe Technology Co., Ltd., China Electronics Technology Standardization Institute, and Xiamen Bolian Technology Co., Ltd.

The main drafters of this document are: Guo Xiaoyu, Liu Shengxian, Peng Jinghui, Tang Ruifang, Tian Ling, Zeng Hong, Chen Changsheng, Lou Yafen, Cao Yi, and Wu Yongjin.

Sectional specification for high density interconnect printed boards

1 Scope

This document specifies application classes, performance requirements, quality assurance specifications, and delivery requirements for high density interconnect printed boards.

This document applies to high density interconnect printed boards with microvias.

2 Normative references

GB/T 2036

GB/T 4588.4-2017

GB/T 4677-2002

GB/T 16261-2017

GB/T 18334

GB/T 18335

3 Terms and definitions

The terms and definitions defined in GB/T 2036 and SJ/T 10668 and the following apply to this document.

3.1 <=0.15mm, minimum wire width and spacing <=100µm

An interconnected circuit with an average of not less than 20 electrical connections per square centimeter on one or both sides of a printed circuit board.

Note. High-density interconnected printed boards are usually produced using a build-up process, with microvias and/or vias used for electrical interconnection between layers. The minimum aperture is

3.2 Microvia

The ratio of hole depth (X) to hole diameter (Y) is not greater than 1, and the distance from the capture pad to the target pad (same hole depth) does not exceed 0.25mm Blind hole. Note. As shown in Figure 1.

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 28 pages — is available in the English PDF.

Referenced standards

Normative references

GB/T 2036 · GB/T 4677-2002 · GB/T 18335

Editions of GB/T 43799

Edition	Title	Revision	Status
GB/T 43799-2024	Sectional specification for high density interconnect printed boards	current edition	Current

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