GB/T 5230-2020Electrodeposited copper foil for printed board (English PDF)

3.1 elongation

ratio (expressed by percent) of the distance increment between the effective part markers of the specimen to that between the initial markers when the specimen breaks under tensile load

[GB/T 31471-2015, Definition 3.1]

3.2 foil profile

unevenness of a copper foil surface caused by processing and/or enhanced bonding treatment

[GB/T 31471-2015, Definition 3.4]

3.3 arithmetical mean deviation of the profile

Ra arithmetic mean of the absolute distances from the center line to the rough profile within the measured length

[GB/T 31471-2015, Definition 3.5]

3.4 ten point height of irregularities

Rz sum of the 5 largest profile peak height averages and the 5 largest profile valley depth averages within the sampled length

3.5 smooth side

cathode surface, i.e. the side of an electrodeposited copper foil close to the cathode roll

[GB/T 31471-2015, Definition 3.7]

3.6 matte side

the other side corresponding to the smooth side of an electrodeposited copper foil

[GB/T 31471-2015, Definition 3.8]

3.7 treatment transfer

enhancing binder transferred from the copper foil roughening treatment surface to the laminate substrate

3.8 carrier

support medium used to make thin or soft copper foils easy to process and use

3.9 copper foil with releasable carrier

copper foil produced by electrodeposition method using a carrier as a cathode

Note: copper foils with releasable carrier are mainly classified into etchable ones and detachable ones.

3.10 pinhole

light-transmitting micro holes through a copper foil

3.11 penetrating point

opaque pores

3.12 warpage

degree of bending of a copper foil specimen relative to the horizontal surface, characterized by the maximum vertical distance (mm) between the warped surface and the horizontal surface

4.1 Classification

Copper foils are classified into 5 types by their characteristics, and their models and characteristics are shown in Table 1.

Table 1 Models and characteristics of copper foils

Model Characteristic

E-01 Standard electrodeposited copper foil

E-02 High-elongation electrodeposited copper foil

E-03 High-temperature-elongation electrodeposited copper foil

E-04 Annealable electrodeposited copper foil

E-05 Low-temperature-annealable electrodeposited copper foil

Note: the comparison table of electrodeposited copper foil models between this standard and foreign standards is detailed in Annex A.

4.2 Designation

4.2.1 Types of enhancing bonding treatment for copper foils

The types of enhancing bonding treatments for copper foils may include:

a) non-enhancing bonding treatment without anti-oxidation treatment, denoted by N;

b) non-enhancing bonding treatment with dual-side anti-oxidation treatment, denoted by P;

c) enhancing bonding treatment of matte side (anodic side) with dual-side anti-oxidation treatment, denoted by A;

d) enhancing bonding treatment of both sides with dual-side anti-oxidation treatment, denoted by D;

e) enhancing bonding treatment of smooth side (cathode side) with dual-side anti-oxidation treatment, denoted by R.