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GB/T 36476-2018General specification for metal base copper-clad laminates for printed circuits (English PDF)

印制电路用金属基覆铜箔层压板通用规范

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

June 7, 2018

Implementation date

January 1, 2019

Scope

GB/T 36476-2018 is the English-translated version of 印制电路用金属基覆铜箔层压板通用规范.

GB/T 36476-2018 is the general specification for metal base copper-clad laminates for printed circuits, with aluminium or copper as the base.

It covers models, naming, identification and codes, the structure and materials of the laminates, and requirements for appearance, dimensions and performance, from thermal conductivity of the insulating layer, thermal impedance and peel strength to flammability, solderability, dielectric properties, electrical strength, comparative tracking index, arc resistance and withstand voltage.

It also sets inspection rules, test methods, packaging, marking, transport, storage and ordering information, with normative annexes on thermal conductivity and thermal impedance testing and on the dielectric withstand voltage test.

It does not apply to iron-based laminates, while other metal-based laminates and those for microwave circuits may refer to it. It was issued on 7 June 2018 and has applied since 1 January 2019.

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Document preview — GB/T 36476-2018

National Standard of the People's Republic of China

ICS: 31.180
Classification: L 30

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Foreword
1 Scope
2 Normative references
3 Terms and Definitions
4 model, naming, identification and code
4.1 Model
4.2 Name
4.3 Identification and Code
5 Structures and materials
5.1 Structure
5.2 Material
6 Requirements
6.1 General
6.2 Appearance
6.3 size
6.4 Performance Requirements
7 Inspection rules
7.1 Inspection classification
7.2 Material Inspection
7.3 Identification test
7.4 Quality consistency test
8 Test method
8.1 Sample Preparation
8.2 Appearance
8.3 Size
8.4 Thermal Conductivity (Insulator Layer)
8.5 Thermal impedance
8.6 Peel strength
8.7 Water absorption rate
8.8 Copper foil surface cleanability
8.9 Thermal stress
8.10 Chemical resistance
8.11 Glass transition temperature (Tg)
8.12 Flammability
8.13 Copper etchability
8.14 Solderability
8.15 Dielectric constant and loss factor
8.16 Volume resistivity and surface resistivity
8.17 Electrical strength (perpendicular to the surface of the board)
8.18 compared to the tracking index
8.19 Arc resistance
8.20 withstand voltage
9 Packaging, marking, transportation and storage
9.1 Packing
9.2 Mark
9.3 Transportation
9.4 Storage
10 Order Information
Appendix A (Normative) Thermal Conductivity and Thermal Impedance Test Method
Appendix B (Normative) Media withstand voltage test (high voltage test)

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009.

1 Scope

This standard specifies the structure and material of metal-based (aluminum-based, copper-based) copper-clad laminates for printed circuits (hereinafter referred to as metal-based copper-clad laminates).

Materials, requirements, inspection rules, inspection methods, packaging, marking, transportation and storage.

This standard applies to metal-based (aluminum-based, copper-based) copper clad laminates for printed circuits, and is not suitable for iron-based copper clad laminates for printed circuits. Printed circuit Other metal-based copper clad laminates and metal-based copper clad laminates for microwave circuits can be referred to.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this document. For undated references, the latest edition (including all amendments) applies to this document.

GB/T 2036 printed circuit terminology

GB/T 2040 copper and copper alloy sheet

GB/T 2059 copper and copper alloy strip

GB/T 3198 aluminum and aluminum alloy foil

GB/T 3880 General industrial aluminum and aluminum alloy plates and strips

GB/T 4722-2017 Test method for rigid copper clad laminate for printed circuits

GB/T 4957-2003 Non-conductive coating on non-magnetic base metal, thickness measurement, eddy current method

GB/T 5230 electrolytic copper foil

SJ20780-2000 Flame Retardant Aluminum-based Copper Clad Laminate Specification

3 Terms and definitions

The following terms and definitions as defined in GB/T 2036 apply to this document.

3.1 Thermal conductivity

The ratio of heat flux density to temperature gradient under steady-state heat conduction, in watts per meter Kelvin [W/(m·K)].

Note: The thermal conductivity of a material varies with temperature, so the average temperature of the material at which the thermal conductivity is measured is also given.

3.2 Thermal impedance; apparent thermal resistance

The temperature difference (delta t) between the two isothermal interfaces is divided by the heat flux density (q) through the two isothermal surfaces, in units of Kelvin square meters per watt (K·m2/W).

3.3 Heat flux density

The amount of heat (Q) transmitted per unit area (A) per unit time is called heat flux density and is expressed by q=Q/A. The unit is watts per square meter (W/m2).

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 24 pages — is available in the English PDF.

Referenced standards

Normative references

GB/T 3880 · SJ20780-2000

Similar standards

GB/T 18334-2025|GB/T 4588-2025|GB/T 46696-2025|GB/T 43799-2024|GB/T 43059-2023|GB/T 4725-2022

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