GB/T 43059-2023Requirements of flatness control for printed boards and printed board assemblies (English PDF)
印制板及印制板组装件的平整度控制要求
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
September 7, 2023
Implementation date
April 1, 2024
Scope
GB/T 43059-2023 is the English-translated version of 印制板及印制板组装件的平整度控制要求.
This document specifies the requirements for controlling the flatness of printed boards and printed board assemblies. The document applies to the control of flatness in the design, manufacture and use of rigid printed boards and rigid printed board assemblies.
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Document preview — GB/T 43059-2023
National Standard of the People's Republic of China
- ICS
- 31.180
- Classification
- L 94
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Foreword
- 1 Scope
- 2 Normative reference documents
- 3 Terms and definitions
- 4 General requirements
- 5 Flatness control of rigid copper-clad foil substrate
Foreword
This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents" Drafting.
1 Scope
This document specifies the requirements for flatness control of printed boards and printed board assemblies.
This document applies to the control of flatness in the design, manufacture and use of rigid printed boards and rigid printed board assemblies (assemblies).
2 Normative reference documents
The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document.
GB/T 2036 Printed circuit terminology
GB/T 4722-2017 Test methods for rigid copper-clad laminates for printed circuits
3 Terms and definitions
The terms and definitions defined in GB/T 2036 apply to this document.
4 General requirements
4.1 Design
Designers of rigid printed boards or rigid printed board assemblies should ensure structural balance. For printed board structural balance refers to any way The resin, reinforcement materials and metal foil are evenly distributed towards the central printed board. If there are additional metal layers bonded to the substrate (such as heat sink chip), the metal layer will affect the flatness of the printed board.
Rigid printed board assemblies usually have components mounted on both sides. The location of the components is determined by their size, mass, and pins in contact with the printed board.
Determined by quantity, the position of components directly affects the flatness of the printed board assembly.
4.2 Rigid printed board manufacturing
Manufacturers of rigid printed boards should ensure minimal warpage of the printed boards.
4.3 Assembly
The assembly of rigid printed boards should ensure that the rigid printed boards are not deformed, especially during the entire welding process and manual operation.
4.4 Use
Users should ensure good storage conditions and storage equipment to minimize the possibility of distortion after assembly.
5 Flatness control of rigid copper-clad foil substrate
5.1 Influencing factors
5.1.1 Reinforcement materials
Fiberglass fabrics have the potential to create stress during weaving and handling. Stress of Single Fiberglass Fabric on Laminate Warpage
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
Referenced standards
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