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GB/T 28859-2025Epoxy powder encapsulation material for electronic packaging (English PDF)

电子封装用环氧粉末包封料

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

August 1, 2025

Implementation date

February 1, 2026

Scope

GB/T 28859-2025 is the English-translated version of 电子封装用环氧粉末包封料.

GB/T 28859-2025 is the Chinese standard "Epoxy powder encapsulation material for electronic packaging". Its scope clause reads: This document specifies the product classification, requirements, inspection rules and packaging of epoxy powder encapsulants for electronic packaging (hereinafter referred to as "encapsulants").

It also describes the requirements for packaging, labeling, storage and transportation, and the corresponding test methods. This document applies to electronic components such as ceramic capacitors, varistors, film capacitors, resistor networks, thermistors, etc. Encapsulation is done with epoxy powder encapsulant. Its clauses include terms and definitions.

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Document preview — GB/T 28859-2025

National Standard of the People's Republic of China

ICS: 31.030
Classification: L 90
Replacing: GB/T 28859-2012

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Foreword
5.1.3);
5.1.6, Chapter 5 to Chapter 8 of GB/T 28861-2012);

1 Scope

This document specifies the product classification, requirements, inspection rules and packaging of epoxy powder encapsulants for electronic packaging (hereinafter referred to as "encapsulants").

It also describes the requirements for packaging, labeling, storage and transportation, and the corresponding test methods.

This document applies to electronic components such as ceramic capacitors, varistors, film capacitors, resistor networks, thermistors, etc.

Encapsulation is done with epoxy powder encapsulant.

2 Normative references

The contents of the following documents constitute the essential clauses of this document through normative references in this document.

For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to

This document.

GB/T 1034-2008 Determination of water absorption of plastics

GB/T 1408.1 Test methods for electric strength of insulating materials Part 1.Tests at power frequency

GB/T 1409-2006 Measurement of permittivity and dielectric loss of electrical insulating materials at power frequency, audio frequency and high frequency (including meter wave wavelength)

Recommended method for loss factor

GB/T 1636 Plastics - Determination of apparent density of materials capable of flowing from a specified funnel

GB/T 2411 Plastics and hard rubber - Determination of indentation hardness (Shore hardness) using a durometer

GB/T 3139 Test method for thermal conductivity of fiber reinforced plastics

GB/T 4207-2022 Determination of tracking resistance index and relative tracking index of solid insulating materials

GB/T 4722-2017 Test methods for rigid copper-clad laminates for printed circuits

GB/T 5169.16-2017 Fire hazard tests for electric and electronic products Part 16.Test flame 50W horizontal and vertical flame

Test methods

GB/T 6003.1 Technical requirements and inspection of test sieves Part 1.Wire mesh test sieves

GB/T 9341 Determination of flexural properties of plastics

GB/T 21782.9 Powder coatings Part 9.Sampling

GB/T 26572 Limit requirements for restricted substances in electrical and electronic products

GB/T 28858-2012 Phenolic encapsulant for electronic components

GB/T 28860 Determination of gelling time of epoxy powder encapsulants

GB/T 28862 Epoxy powder encapsulant sample processing method

GB/T 31838.2 Dielectric and resistive properties of solid insulating materials Part 2.Resistance properties (DC method) Volume resistance and

Volume resistivity

GB/T 31838.4 Dielectric and resistive properties of solid insulating materials Part 4.Resistance characteristics (DC method) Insulation resistance

GB/T 36800.2 Thermomechanical analysis of plastics (TMA) Part 2.Coefficient of linear thermal expansion and glass transition temperature

Determination

GB/T 40564-2021 Test methods for epoxy molding compounds for electronic packaging

3 Terms and Definitions

There are no terms or definitions that require definition in this document. […]

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.

Referenced standards

Normative references

Editions of GB/T 28859

Edition	Title	Revision	Status
GB/T 28859-2025	Epoxy powder encapsulation material for electronic packaging	current edition	Current
GB/T 28859-2012	Encapsulating material of powdered epoxy for electronic components	previous edition	In force

This page sells the current edition, GB/T 28859-2025. Earlier editions are listed for reference only.

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