GB/T 28862-2012Method for processing sample of encapsulating material of powdered epoxy (English PDF)

1 Scope

This standard specifies the electronic components with epoxy powder coating material production method properties of cured test sample.

This standard applies to the dry encapsulated ceramic capacitors, varistors, film capacitor, resistor networks and other electronic components with epoxy powder

Encapsulation materials and processing properties of cured test sample.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein

Member. For undated references, the latest edition (including any amendments) applies to this document.

GB/T 28859-2012 Electronic Component Epoxy powder coating material

3 devices and materials

This test applies to prescribed procedures required instruments and equipment are as follows.

1) thermometer, range (0 ~ 300) °C, accurate to 1 °C.

2) tray balance, range 100g, a sense of the amount of 0.1g.

3) the timer.

4) mold a) Phi (100 ± 0.1) mm × (0.6 ± 0.1) mm set;

b) Phi (50 ± 0.1) mm × (2 ± 0.1) mm set;

c) (125 ± 0.1) mm × (13 ± 0.1) mm × (2 ± 0.1) mm a;

d) (75 ± 0.1) mm × (50 ± 0.1) mm × (2 ± 0.1) mm a.

5) steel a) (170 ± 1.2) mm × (50 ± 0.8) mm × (3 ± 0.3) mm steel plate 2;

b) (150 ± 1.2) mm × (150 ± 1.2) mm × (3 ± 0.3) mm steel plate 2.

6) pressing machine, 250kN.

7) a medicine spoon.

8) polypropylene film, thickness 25µm.

9) blade.

10) electric heated blast oven, can control the temperature ± 2 °C.

4 Sample

Epoxy powder encapsulation materials 200g.

5 processing steps