Valid

GB/T 40564-2021Test method of epoxy molding compound for electronic packaging (English PDF)

电子封装用环氧塑封料测试方法

Preview PDF

This is a limited preview

Buy now to download the full PDF (41 pages)

Need quotation for your management?

Get a formal quotation for GB/T 40564-2021 in 30 minutes.

Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

October 11, 2021

Implementation date

May 1, 2022

Scope

GB/T 40564-2021 is the English-translated version of 电子封装用环氧塑封料测试方法.

GB/T 40564-2021 sets out the test methods for the epoxy molding compounds used to encapsulate electronic components.

It covers appearance, gelation time, spiral flow length, flash, hot hardness, density, thermal conductivity, viscosity, glass transition temperature, the coefficient of linear thermal expansion measured with a TMA probe, water absorption and flame resistance.

Tests on an extracted aqueous solution give conductivity, pH and sodium, chloride and bromide ion contents, and further methods determine bromine, antimony, chlorine, ash and uranium content.

Mechanical and electrical properties are measured as bending strength, impact strength, mold shrinkage, bond strength, volume resistivity, dielectric constant, dielectric loss and breakdown strength.

It applies to compounds for semiconductor discrete devices, integrated circuits and special devices, was issued on 11 October 2021 and has applied since 1 May 2022.

Found what you need?

Document preview — GB/T 40564-2021

National Standard of the People's Republic of China

ICS: 31.030
Classification: L 90

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Environmental conditions
4.2 Sample requirements
4.3 Report
5 Appearance inspection
5.1 Powder epoxy molding compound
5.2 Epoxy molding compound for cake material
6 Physical and chemical performance test
6.1 Gelation time
6.2 Spiral flow length
6.3 Flash
6.4 Hot hardness
6.5 Density
6.6 Thermal conductivity
6.7 Viscosity
6.8 Glass transition temperature
6.9 Coefficient of linear thermal expansion (TMA probe method)
6.10 Water absorption
6.11 Flame resistance
6.12 Conductivity (extracted aqueous solution)
6.13 pH value (extracted aqueous solution)
6.14 Sodium ion content (extracted aqueous solution)
6.15 Chloride ion content, bromide ion content (extracted aqueous solution)
6.16 Bromine content, antimony content, chlorine content
6.17 Ash
6.18 Uranium content
7 Mechanical performance test
7.1 Bending strength
7.2 Impact strength
7.3 Mold shrinkage
7.4 Bond strength
8 Electrical performance test
8.1 Volume resistivity
8.2 Dielectric constant, dielectric loss
8.3 Breakdown strength

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules of Standardization Documents" Drafting.

1 Scope

This document specifies the appearance, gelation time, spiral flow length, flash, thermal hardness, density, and thermal conductivity of epoxy plastic encapsulants for electronic packaging.

Coefficient, viscosity, glass transition temperature, linear thermal expansion coefficient, water absorption, flame retardancy, electrical conductivity, pH value, sodium ion content, chloride ion content Amount, bromide ion content, bromine content, antimony content, chlorine content, ash content, uranium content, bending strength, impact strength, molding shrinkage, bonding strength, body Test methods for product resistivity, dielectric constant, dielectric loss, breakdown strength, etc.

This document is applicable to the performance testing of epoxy plastic packaging materials used for electronic packaging of semiconductor discrete devices, integrated circuits and special devices.

2 Normative references

The content of the following documents constitutes an indispensable clause of this document through normative references in the text. Among them, dated quotations Only the version corresponding to the date is applicable to this document; for undated reference documents, the latest version (including all amendments) is applicable In this document.

GB/T 602-2002 Preparation of standard solutions for impurity determination of chemical reagents

GB/T 1033.1-2008 Determination of the density of plastic non-foam plastics Part 1: Immersion method, liquid pycnometer method and titration method

GB/T 1043.1-2008 Determination of impact properties of plastic simply supported beams Part 1: Non-instrumented impact test

GB/T 1408.1-2016 Insulating material electric strength test method Part 1: Test under power frequency

GB/T 1409-2006 Measure the permittivity and dielectric loss of electrical insulating materials at power frequency, audio frequency, and high frequency (including meter wave wavelength) Recommended method of dissipation factor

GB/T 2408 Determination of the Burning Properties of Plastics by Horizontal Method and Vertical Method

GB/T 2411-2008 Plastic and hard rubber use a durometer to determine the indentation hardness (Shore hardness)

GB/T 3139-2005 Test method for thermal conductivity of fiber reinforced plastics

GB/T 6682-2008 Analytical laboratory water specifications and test methods

GB/T 9723-2007 General Rules of Flame Atomic Absorption Spectrometry for Chemical Reagents

GB/T 9724-2007 General rules for the determination of pH value of chemical reagents

GB/T 16597-2019 General Rules of X-ray Fluorescence Spectrometry for Analysis Methods of Metallurgical Products

3 Terms and definitions

The following terms and definitions apply to this document.

3.1 Flash and bleed

During the molding process, the epoxy molding compound overflows between the mold and the frame joint surface, and remains the remaining material on the frame.

3.2 Post-curing

After the epoxy molding compound is plasticized, put the plasticized material into a hot air circulating oven at 175°C and continue to maintain a constant temperature for a period of time.

The cross-linking reaction will continue, and the curing degree will continue to increase.

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 41 pages — is available in the English PDF.

Referenced standards

Normative references

Cited by

GB/T 28859-2025Epoxy powder encapsulation material for electronic packaging

Similar standards

GB/T 28159-2025|GB/T 28859-2025|GB/T 29846-2025|GB/T 29847-2025|GB/T 31379.1-2025|GB/T 31379.2-2025

How to Download GB/T 40564-2021

1
Add to cart
Click "Download PDF" on this page and choose "Buy this standard". You can add more standards before checkout.
2
Checkout
Enter your email and billing details. Payment is processed securely by Stripe (cards or bank transfer). Prefer bank details? Request a quotation (min. order $300).
3
Instant delivery (0–9 sec)
Delivery is automatic: within seconds of payment you'll receive an email with a secure download link. The link stays valid for 72 hours.
4
Invoice included
A tax invoice is attached to the confirmation email. Need a custom invoice? Contact us.