GB/T 29847-2025Test methods for copper foil used for printed boards (English PDF)

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting.

This document replaces GB/T 29847-2013 "Test methods for copper foil for printed boards". Compared with GB/T 29847-2013, except for the structural adjustment In addition to the integration and editorial changes, the main technical changes are as follows.

a) Added the terms "pinhole" and "penetration point" (see 3.5, 3.6); deleted the term "profile factor" (see 3.1 of the 2013 edition);

The terms "treatment" and "arithmetic mean deviation of profile" are changed to "surface treatment" and "surface roughness" (see 3.1, 3.2, 2013 edition) 3.2, 3.3); the definition of the term "micro roughness" has been changed (see 3.3, 3.4 of the 2013 edition);

b) The sampling method has been changed (see Chapter 5, Chapter 5 of the 2013 edition);

c) The permissible error of magnifying glass or microscope instruments has been changed (see Chapter 6, 6.1.2 of the 2013 edition);

d) Added discoloration points in surface inspection (see 6.1.3.4);

e) The pinhole inspection (penetrant method) has been modified (see Chapter 6, 6.2 of the 2013 edition);

f) Deleted "the total thickness and outline factor of treated or untreated copper foil" in the appearance and size test methods (see 6.3 of the 2013 edition);

g) Increased roughness (laser method) (see 6.7);

h) Deleted bending fatigue and ductility (see 7.2 of the 2013 edition);

i) increased bending resistance (see 7.2);

j) increased flexural resistance (see 7.3);

k) Deleted "Peel strength measurement after thermal stress" (see 7.3.3.3 of the 2013 edition);

l) Deleted "Peel strength measurement after exposure to process solution" (see 7.3.3.4 of the 2013 edition);

m) Added "peel strength after solvent resistance" (see 7.4.3.3);

n) Added "solder heat resistance" (see 7.5);

o) Added "high temperature oxidation resistance" (see 8.7);

p) Deleted "Purity of copper foil or copper plating" (see 9.1 of the 2013 edition);

q) Added “Chemical composition of copper foil” (see 8.8).

Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.

This document was proposed and coordinated by the National Technical Committee for Semiconductor Equipment and Materials Standardization (SAC/TC203).

This document was drafted by: China Electronics Technology Standardization Institute, Sichuan Mingfeng Electronic Materials Technology Co., Ltd., Shanxi Beitong New Materials Technology Co., Ltd., Guangdong Yinghua Electronic Technology Co., Ltd., Jiangsu Mingfeng Electronic Materials Technology Co., Ltd., Chongqing Yulong Optoelectronics Technology Co., Ltd.

Co., Ltd., Shenzhen Huike New Materials Co., Ltd., Lingbao Jinyuan Chaohui Copper Co., Ltd., Junxuan New Materials (Hangzhou) Co., Ltd., Shaanxi Baoyu Technology Industry Co., Ltd., Shenzhen Linghangda Electronics Co., Ltd., and Jiangxi Jiangxi Copper Foil Technology Co., Ltd.

The main drafters of this document are: Cao Kewei, Wang Pengju, Wu Ting, Li Xueping, Zhang Baoshuai, Shi Zeyuan, Ming Zhiyao, Zhao Junsha, Wu Yiran, Xu Jianwei, Zhao Xiaohui, Tang Jianming, Zeng Zhaofeng, Xu Jiaolong, Qian Yan, Chai Shengli, Wang Chunwen, Yu Kemiao.

This document was first published in 2013 and this is the first revision.

1 Scope

This document describes the test methods for the appearance, dimensions, physical properties, processing properties, and other properties of copper foil for printed boards.

This document applies to the testing of copper foil for rigid or flexible printed boards.

2 Normative references

GB/T 2036

GB/T 3131

GB/T 4723

GB/T 5121.1

GB/T 5121.2

GB/T 5121.3

GB/T 5121.4

GB/T 5121.5

GB/T 5121.6

GB/T 5121.7

GB/T 5121.8

GB/T 5121.9

GB/T 5121.10

GB/T 5121.11

GB/T 5121.15

GB/T 5121.16

GB/T 5121.27

GB/T 13557-2017

3 Terms and definitions

The terms and definitions defined in GB/T 2036 and the following apply to this document.