GB/T 3131-2020Tin-lead solder (English PDF)

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009.

This standard replaces GB/T 3131-2001 "Tin-Lead Solder". Compared with GB/T 3131-2001, the main technology except for editorial changes The changes are as follows.

---Modified the impurity element content in the AA grade tin-lead solder grades, the Sb content was revised from <=0.05% to <=0.030%, and the Fe content Modified from <=0.02% to <=0.010%, As content from <=0.015% to <=0.010%, Cu content from <=0.03% <=0.020% (see Table 3, Table 3 of the 2001 edition);

---Modified the silver content in some grades: the silver content in S-Sn5PbAgAA was changed from 1.0%~2.0% to 2.3%~ 2.7%; the silver content in the grade S-Sn63PbAgAA was revised from 1.5%~2.5% to 1.8%~2.2% (see Table 3, 2001 Edition of Table 3);

---Deleted the grades "S-Sn65PbAA, S-Sn65PbA, S-Sn65PbB" (see Table 3, Table 4, Table 5, Table 3, 2001 edition Table 4, Table 5);

--- Deleted the "summary of impurities except Sb, Bi, Cu" in all grades (see Table 3, Table 4, Table 5, 2001 edition of the table 3, Table 4, Table 5);

---Added the brands S-Sn43PbBiAA, S-Sn43PbBiA, S-Sn43PbBiB, S-Sn58PbAgAA, S-Sn58PbAgA, S-Sn58PbAgB, Sn55PbBiAA (see Table 3, Table 4, Table 5);

---Modified the number of writing digits for the limit value of each element content, and all the effective digits are written (see Table 3, Table 4, Table 5, 2001 edition Table 3, Table 4, Table 5);

---Modified the S content: the S content in the grade A tin-lead solder grade was changed from <=0.015% to <=0.012%; the grade B tin-lead solder grade The content of S in the medium is changed from <=0.020% to <=0.015% (see Table 4 and Table 5, and Table 4 and Table 5 in the 2001 edition);

---Modified the Sn content range in the grade B tin-lead solder grades to ±1% (see Table 5, Table 5 of the 2001 edition);

---Increase the allowable deviation of the diameter of < 0.3mm tin wire (see Table 6);

---Deleted the regulation of rosin in flux (see 3.5.1 of 2001 edition);

---Modified the content of resin core flux (see Table 7, Table 7 of the 2001 edition);

---Modified the characteristics of the flux (see 4.3.2, 3.5.3 of the 2001 edition).

The previous versions of the standard replaced by this standard are as follows.

---GB/T 3131-1988, GB/T 3131-2001.

1 Scope

This standard specifies the classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage and quality of tin-lead solder. Quantity certificate and purchase order (or contract) content.

This standard applies to tin-lead solder used for welding in electrical and electronic equipment, communication equipment and other machinery manufacturing.

2 Normative references

The following documents are indispensable for the application of this document. For dated reference documents, only the dated version applies to this document. For undated references, the latest version (including all amendments) applies to this document.

GB/T 2828.1 Sampling inspection procedure by attributes Part 1: Batch inspection sampling plan retrieved by acceptance quality limit (AQL)

GB/T 8170 Numerical rounding rules and the expression and determination of limit values

GB/T 10574.1-2003 Tin-lead solder chemical analysis method Determination of tin content

GB/T 10574.2-2003 Tin-lead solder chemical analysis method Determination of antimony content

GB/T 10574.3-2003 Tin-lead solder chemical analysis method Determination of bismuth content

GB/T 10574.4-2003 Tin-lead solder chemical analysis method Determination of iron content

GB/T 10574.5-2003 Tin-lead solder chemical analysis method Determination of arsenic content

GB/T 10574.6-2003 Tin-lead solder chemical analysis method determination of copper content

GB/T 10574.7-2017 Tin-lead solder chemical analysis methods Part 7: Determination of silver content Flame atomic absorption spectrometry and Potassium thiocyanate potentiometric titration

GB/T 10574.8-2017 Tin-lead solder chemical analysis methods Part 8: Determination of zinc content Flame atomic absorption spectrometry

GB/T 10574.9-2017 Tin-lead solder chemical analysis methods Part 9: Determination of aluminum content Electrothermal atomic absorption spectrometry

GB/T 10574.10-2017 Tin-lead solder chemical analysis methods Part 10: Determination of cadmium content Flame atomic absorption spectrometry And Na2EDTA titration

GB/T 10574.11-2017 Tin-lead solder chemical analysis methods Part 11: Determination of phosphorus content Crystal violet-phosphovanadium molybdenum heteropoly acid Spectrophotometry

GB/T 10574.12-2017 Tin-lead solder chemical analysis method Part 12: Determination of sulfur content High frequency combustion infrared absorption light Spectroscopy

GB/T 10574.13-2017 Tin-lead solder chemical analysis methods Part 13: Antimony, bismuth, iron, arsenic, copper, silver, zinc, aluminum, cadmium, phosphorus And gold content determination inductively coupled plasma atomic emission spectrometry

GB/T 10574.14-2017 Tin-lead solder chemical analysis methods Part 14: Tin, lead, antimony, bismuth, silver, copper, zinc, cadmium and arsenic content Photoemission spectrometry

GB/T 15829 Flux classification and performance requirements