GB/T 9491-2021Flux for tin soldering (English PDF)

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009.

This standard replaces GB/T 9491-2002 "Liquid Flux for Soldering (Rosin Type)". Compared with GB/T 9491-2002, except for editorial The main technical changes outside the modification are as follows:

---Added the classification of flux, such as rosin type, resin type, organic type, inorganic type, and classified liquid (L), solid state by form (S), paste (P) (see Chapter 4, Chapter 3 of the 2002 edition);

--- Increased requirements and test methods for viscosity (see 5.4, 6.5);

--- Increased requirements and test methods for electrochemical migration (ECM) (see 5.13, 6.14);

--- Increased the requirements and test methods for ion residues on PCB boards (see 5.15, 6.16);

--- Increased splash requirements and test methods (see 5.16, 6.17);

--- Delete the mold growth requirements and test methods (see 5.13 of the 2002 edition).

1 Scope

This standard specifies the classification, technical requirements, test methods, inspection rules and identification, packaging, transportation and storage of soldering fluxes.

This standard applies to soldering flux for electronic products.

2 Normative references

The following documents are essential for the application of this document. For dated references, only the dated version applies to this document. For undated references, the latest edition (including all amendments) applies to this document.

GB/T 2040-2017 Copper and copper alloy sheet

GB/T 2828.1-2012 Counting Sampling Inspection Procedures Part 1. Lot-by-Lot Inspection Sampling Retrieved by Acceptance Quality Limit (AQL) plan

GB/T 2829-2002 Periodic Inspection Counting Sampling Procedure and Table (Applicable to Inspection of Process Stability)

GB/T 3131-2020 Tin-lead solder

GB/T 4677-2002 Test methods for printed boards

GB/T 8145-2003 Gum Rosin

3 Terms and Definitions

The following terms and definitions apply to this document.

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