GB/T 29505-2013Test method for measuring surface roughness on planar surfaces of silicon wafer (English PDF)
硅片平坦表面的表面粗糙度测量方法
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Issued by
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China; Standardization Administration of China
Level / Type
National · Recommended
Issue date
May 9, 2013
Implementation date
February 1, 2014
Scope
GB/T 29505-2013 is the English-translated version of 硅片平坦表面的表面粗糙度测量方法.
GB/T 29505-2013 is the Chinese national standard test method for measuring the surface roughness of planar surfaces of silicon wafers.
It describes the measurement principles, apparatus and procedures of the three methods commonly used - profilometers, interferometers and scatterometers - and specifies standard scan patterns for partial or whole-surface roughness measurement, the regions measured and the abbreviations used.
It applies to roughness measurement on planar silicon wafer surfaces and can also be used for other planar wafer materials, but not for the edge region of the wafer, and not for instruments whose spatial wavelength bandwidth is 10 nm or less.
It defines terms such as the autocorrelation function and length, the bidirectional reflectance distribution function (BRDF), the Nyquist criterion and the power spectral density (PSD) function, and its annexes give the roughness measurement specifications and outputs and, from SEMI M40, wafer test and roughness distribution models.
Issued on 9 May 2013 by AQSIQ and SAC, it has been in force since 1 February 2014. Classification: ICS 29.045, CCS H 80.
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Document preview — GB/T 29505-2013
National Standard of the People's Republic of China
- ICS
- 29.045
- Classification
- H 80
Issued by: General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China; Standardization Administration of China
Contents
- ForewordIII
- 1 Scope1
- 2 Normative references1
- 3 Terms and definitions1
- 4 Summary of methods2
- 5 Interferences3
- 6 Apparatus3
- 7 Roughness measurement procedure5
- 8 Report8
- Annex A (normative) Roughness measurement specifications and related outputs9
- Annex B (informative) Wafer testing and roughness distribution models (from the appendix of SEMI M40)11
- Bibliography25
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
This standard is under the jurisdiction of the National Technical Committee on Semiconductor Equipment and Materials of Standardization Administration of China (SAC/TC 203) and its subcommittee on materials.
Drafting organizations: GRINM Semiconductor Materials Co., Ltd., China Nonferrous Metals Industry Institute of Standards, Metrology and Quality.
1 Scope
This standard describes the measurement principles, apparatus and procedures of three methods commonly used to measure the surface roughness of silicon wafers - profilometers, interferometers and scatterometers - and specifies standard scan patterns for measuring the roughness of a local area or of the whole wafer surface, together with the definitions of the areas and their abbreviations.
This standard applies to roughness measurement on planar silicon wafer surfaces. It can also be used for other types of planar wafer material, but not for roughness measurement in the edge region of the wafer.
This standard does not apply to measuring instruments with a spatial wavelength bandwidth of 10 nm or less.
2 Normative references
The following documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
GB/T 14264, Semiconductor materials - Terms and definitions
3 Terms and definitions
For the purposes of this document, the terms and definitions given in GB/T 14264 and the following apply.
3.1 autocorrelation function: the Fourier transform of the power spectral density function. It expresses the self-similarity between the surface profile and the same profile shifted laterally.
3.2 autocorrelation length: the lateral shift required for the autocorrelation function to fall to 1/e of its value at zero shift. Values of 10% or 0 are sometimes used instead of 1/e.
3.3 bi-directional reflectance distribution function; BRDF: a description of how light scattered from a surface is distributed in direction, defined as the scattered radiance normalized by the incident irradiance; it is approximated by the scattered power per unit projected solid angle divided by the incident power.
3.4 Nyquist criterion: the shortest detectable spatial wavelength, equal to twice the sampling interval.
3.5 one-dimensional grating equation: in its most common form, the expression giving the positions of the diffraction orders produced by a one-dimensional sinusoidal grating.
3.6 power spectral density (PSD) function: a function describing surface features, given by the squared magnitude of the Fourier transform coefficients of the surface profile per unit spatial frequency.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 25 pages — is available in the English PDF.
Referenced standards
Normative references
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