GB/T 43366-2023General specification for discrete semiconductor devices of space application (English PDF)

1 Scope

This document specifies the general requirements, quality assurance regulations, delivery preparation and instructions for aerospace semiconductor discrete devices (hereinafter referred to as "devices"):

Matters needing attention:

This document applies to the design, production, inspection and sales of semiconductor discrete devices for aerospace use:

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text: Among them, the dated quotations

For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document:

GB/T 4023-2015 Semiconductor devices Discrete devices and integrated circuits Part 2: Rectifier diodes

GB/T 4586-1994 Semiconductor devices Discrete devices Part 8: Field effect transistors

GB/T 4587-1994 Semiconductor discrete devices and integrated circuits Part 7: Bipolar transistors

GB/T 4589:1-2006 Semiconductor discrete devices Part 10: General specifications for discrete devices and integrated circuits

GB/T 4937:2-2006 Mechanical and climatic test methods for semiconductor devices Part 2: Low pressure

GB/T 4937:3-2012 Mechanical and climatic test methods for semiconductor devices Part 3: External visual inspection

GB/T 4937:4-2012 Mechanical and climatic test methods for semiconductor devices Part 4: Strongly accelerated steady-state damp heat test (HAST)

GB/T 4937:11-2018 Mechanical and climatic test methods for semiconductor devices Part 11: Rapid temperature change double liquid slot method

GB/T 4937:12-2018 Mechanical and climatic test methods for semiconductor devices Part 12: Sweeping vibration

GB/T 4937:13-2018 Mechanical and climatic test methods for semiconductor devices Part 13: Salt spray

GB/T 4937:14-2018 Mechanical and climatic test methods for semiconductor devices Part 14: Terminal strength (leads are secure sex)

GB/T 4937:15-2018 Mechanical and climatic test methods for semiconductor devices Part 15: Solder resistance of through-hole mounting devices

Receive heat

GB/T 4937:18-2018 Mechanical and climatic test methods for semiconductor devices Part 18: Ionizing radiation (total dose)

GB/T 4937:19-2018 Mechanical and climatic test methods for semiconductor devices Part 19: Chip shear strength

GB/T 4937:20-2018 Mechanical and climatic test methods for semiconductor devices Part 20: Moisture resistance of plastic-encapsulated surface-mounted devices

Combined effects of moisture and welding heat

GB/T 4937:21-2018 Mechanical and climatic test methods for semiconductor devices Part 21: Solderability

GB/T 4937:22-2018 Mechanical and climatic test methods for semiconductor devices Part 22: Bonding strength

GB/T 4937:30-2018 Mechanical and climatic test methods for semiconductor devices Part 30: Non-sealed surface mount devices in

Preprocessing before reliability test

GB/T 15291-2015 Semiconductor devices Part 6: Thyristors

GB/T 19403:1-2003 Semiconductor device integrated circuits Part 11: Part 1: Internal visual inspection of semiconductor integrated circuits […]