GB/T 4937.30-2018Semiconductor devices -- Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (English PDF)

Foreword

GB/T 4937 "Mechanical and Climatic Test Methods for Semiconductor Devices" consists of the following components.

--- Part 1. General;

--- Part 2. Low pressure;

--- Part 3. External visual inspection;

--- Part 4. Strongly accelerated steady-state damp heat test (HAST);

---Part 5. Steady-state temperature and humidity bias life test;

---Part 6. High temperature storage;

--- Part 7. Internal water vapor content test and other residual gas analysis;

--- Part 8. Sealing;

---Part 9. Logo durability;

--- Part 10. Mechanical shock;

--- Part 11. rapid temperature change double tank method;

--- Part 12. Sweeping vibration;

--- Part 13. Salt spray;

--- Part 14. Terminal strength (lead robustness);

---Part 15. Resistance to soldering of through-hole mounting devices;

--- Part 16. Particle collision noise detection (PIND);

---Part 17. Neutron irradiation;

---Part 18. Ionizing radiation (total dose);

---Part 19. Chip shear strength;

--- Part 20. The combined effects of moisture-resistant and soldering heat on plastic surface mount devices;

---Part 20-1. Operation, packaging, marking and transport of surface mount devices sensitive to the combined effects of moisture and soldering heat;

---Part 21. Solderability;

---Part 22. Bonding strength;

--- Part 23. High temperature working life;

--- Part 24. Accelerated moisture-resistant and non-biased strong accelerated stress test (HSAT);

---Part 25. Temperature cycling;

--- Part 26. Electrostatic discharge (ESD) sensitivity test human body model (HBM);

--- Part 27. Electrostatic discharge (ESD) sensitivity test mechanical model (MM);

--- Part 28. Electrostatic discharge (ESD) sensitivity test, charged device model (CDM), device level;

---Part 29. Latch test;

--- Part 30. Pre-treatment of unsealed surface mount devices prior to reliability testing;

--- Part 31. Flammability of plastic encapsulated devices (internal);

--- Part 32. Flammability of plastic encapsulated devices (external);

---Part 33. Accelerated moisture resistance without bias high pressure cooking;

--- Part 34. Power cycling;

--- Part 35. Acoustic scanning microscopy of plastic electronic components;

---Part 36. Constant acceleration;

--- Part 37. Plate-level drop test method using accelerometers;

--- Part 38. Soft error test methods for semiconductor memory devices;

--- Part 39. Measurement of moisture diffusivity and water dissolution rate of raw materials for semiconductor components;

--- Part 40. Plate-level drop test method using tension meter;

--- Part 41. Reliability test methods for non-volatile memory devices;

--- Part 42. Storage of temperature and humidity;

--- Part 43. Guide to the reliability identification scheme for integrated circuits (ICs);

--- Part 44. Test method for neutron beam irradiation single particle effect of semiconductor devices.

This part is the 30th part of GB/T 4937.

This part is drafted in accordance with the rules given in GB/T 1.1-2009.

This section uses the translation method equivalent to IEC 60749-30.2011 "Semiconductor device mechanical and climatic test methods Part 30.

Pre-treatment of unsealed surface mount devices prior to reliability testing.

The documents of our country that have a consistent correspondence with the international documents referenced in this part are as follows.

Semiconductors - Mechanical and climatic test methods - Part 4. Strongly accelerated steady-state damp heat test

(IEC 60749-4.2002, IDT).

1 Scope

This part of GB/T 4937 specifies the standard procedures for the pre-treatment of non-sealed surface mount devices (SMDs) prior to reliability testing.

This section specifies the pre-processing of SMDs.

SMDs are required to perform appropriate procedures in accordance with the procedures specified in this section before performing the specified indoor reliability test (identification/reliability monitoring).

Pretreatment to evaluate the long-term reliability of the device (affected by weld stress).

Note. GB/T 4937.20 and the moisture-induced stress sensitivity conditions [or moisture sensitivity level (MSL)] in this section and the actual reflow conditions

The relationship between them depends on the temperature measurement of the semiconductor device manufacturer. Therefore, it is recommended to monitor the moisture sensitivity of the highest temperature in real time during the assembly process.

The temperature of the top surface of the SMD package ensures that its temperature does not exceed the component evaluation temperature.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article.

Pieces. For undated references, the latest edition (including all amendments) applies to this document.

GB/T 4937.20-2018 Methods of mechanical and climatic testing of semiconductor devices - Part 20

Combined effects of wet and welding heat (IEC 60749-20.2008, IDT)

Semiconductors - Mechanical and climatic test methods - Part 4. Strong accelerated steady-state damp heat test (HAST)

[Semiconductordevices-Mechanicalandclimatictestmethods-Part 4.Dampheat,steadystate,

Highlyacceleratedstresstest(HAST)]

Methods of mechanical and climatic test methods for semiconductor devices - Part 5. Steady temperature and humidity bias life test (Semi-

conductordevices-Mechanicalandclimatictestmethods-Part 5.Steady-statetemperaturehumidity

Biaslifetest)

Methods of mechanical and climatic test methods for semiconductor devices - Part 11. s.

conductordevices-Mechanicalandclimatictestmethods-Part 11.Rapidchangeoftemperature-

Two-fluid-bathmethod)

Methods of mechanical and climatic test methods for semiconductor devices - Part 24. Accelerated

Test (Semiconductordevices-Mechanicalandclimatictestmethods-Part 24.Acceleratedmethisturere-

sistance-UnbiasedHAST)

Semiconductors - Mechanical and climatic test methods - Part 25. Temperature cycling (Semiconductor

devices-Mechanicalandclimatictestmethods-Part 25.Temperaturecycling)

IEC 60749-33. Mechanical and climatic test methods for semiconductor devices - Part 33

(Semiconductordevices-Mechanicalandclimatictestmethods-Part 33.Acceleratedmoistureresist-

ance-Unbiasedautoclave)

3 General

The welding heat test will increase the pressure of moisture in the SMDs (the SMDs are absorbed during storage), which will cause the SMDs plastic package to break.