GB/T 4937.30-2018Semiconductor devices -- Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (English PDF)

1 Scope

This part of GB/T 4937 specifies the standard procedures for the pre-treatment of non-sealed surface mount devices (SMDs) prior to reliability testing.

This section specifies the pre-processing of SMDs.

SMDs are required to perform appropriate procedures in accordance with the procedures specified in this section before performing the specified indoor reliability test (identification/reliability monitoring).

Pretreatment to evaluate the long-term reliability of the device (affected by weld stress).

Note. GB/T 4937.20 and the moisture-induced stress sensitivity conditions [or moisture sensitivity level (MSL)] in this section and the actual reflow conditions

The relationship between them depends on the temperature measurement of the semiconductor device manufacturer. Therefore, it is recommended to monitor the moisture sensitivity of the highest temperature in real time during the assembly process.

The temperature of the top surface of the SMD package ensures that its temperature does not exceed the component evaluation temperature.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article.

Pieces. For undated references, the latest edition (including all amendments) applies to this document.

GB/T 4937.20-2018 Methods of mechanical and climatic testing of semiconductor devices - Part 20

Combined effects of wet and welding heat (IEC 60749-20.2008, IDT)

Semiconductors - Mechanical and climatic test methods - Part 4. Strong accelerated steady-state damp heat test (HAST)

[Semiconductordevices-Mechanicalandclimatictestmethods-Part 4.Dampheat,steadystate,

Highlyacceleratedstresstest(HAST)]

Methods of mechanical and climatic test methods for semiconductor devices - Part 5. Steady temperature and humidity bias life test (Semi- conductordevices-Mechanicalandclimatictestmethods-Part 5.Steady-statetemperaturehumidity

Biaslifetest)

Methods of mechanical and climatic test methods for semiconductor devices - Part 11. s.

conductordevices-Mechanicalandclimatictestmethods-Part 11.Rapidchangeoftemperature-

Two-fluid-bathmethod)

Methods of mechanical and climatic test methods for semiconductor devices - Part 24. Accelerated

Test (Semiconductordevices-Mechanicalandclimatictestmethods-Part 24.Acceleratedmethisturere- sistance-UnbiasedHAST)

Semiconductors - Mechanical and climatic test methods - Part 25. Temperature cycling (Semiconductor devices-Mechanicalandclimatictestmethods-Part 25.Temperaturecycling)

IEC 60749-33. Mechanical and climatic test methods for semiconductor devices - Part 33 (Semiconductordevices-Mechanicalandclimatictestmethods-Part 33.Acceleratedmoistureresist- ance-Unbiasedautoclave)

3 General

The welding heat test will increase the pressure of moisture in the SMDs (the SMDs are absorbed during storage), which will cause the SMDs plastic package to break. […]