GB/T 4937.11-2018Semiconductor devices -- Mechanical and climatic test methods -- Part 11: Rapid change of temperature -- Two-fluid-bath method (English PDF)
半导体器件 机械和气候试验方法 第11部分：快速温度变化 双液槽法
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Issued by
State Administration for Market Regulation, China National Standardization Administration
Level / Type
National · Recommended
Issue date
September 17, 2018
Implementation date
January 1, 2019
Scope
GB/T 4937.11-2018 is the English-translated version of 半导体器件 机械和气候试验方法 第11部分：快速温度变化 双液槽法.
GB/T 4937.11-2018 is the Chinese standard "Semiconductor devices -- Mechanical and climatic test methods -- Part 11: Rapid change of temperature -- Two-fluid-bath method".
Its scope clause reads: This part of GB/T 4937 specifies the test method for rapid temperature change---two-tank method. When device identification can be used The gas-air temperature cycle can also be measured by rapid temperature change---the two-tank method, the air-air temperature cycle test is preferred.
This test can also use a small number of cycles (5 times ~ 10 times) to simulate the effect of the heating liquid of the cleaning device on the device. This test is applicable to all semiconductor devices.
This test is considered to be destructive unless otherwise stated in the relevant specifications. This test is basically the same as GB/T 2423.22-2002, but in view of the special requirements of semiconductor devices, the terms of this part are adopted. Its clauses include terms and definitions.
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Document preview — GB/T 4937.11-2018
National Standard of the People's Republic of China
- ICS
- 31.080.01
- Classification
- L 40
Issued by: State Administration for Market Regulation, China National Standardization Administration
Contents
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- 3.1 Load
- 3.2 Monitoring sensor
- 3.3 Worst case load temperature
- 3.4 Sample specimen
- 3.5 Transfer time
1 Scope
This part of GB/T 4937 specifies the test method for rapid temperature change---two-tank method. When device identification can be used
The gas-air temperature cycle can also be measured by rapid temperature change---the two-tank method, the air-air temperature cycle test is preferred.
This test can also use a small number of cycles (5 times ~ 10 times) to simulate the effect of the heating liquid of the cleaning device on the device.
This test is applicable to all semiconductor devices. This test is considered to be destructive unless otherwise stated in the relevant specifications.
This test is basically the same as GB/T 2423.22-2002, but in view of the special requirements of semiconductor devices, the terms of this part are adopted.
2 Normative references
The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article.
Pieces. For undated references, the latest edition (including all amendments) applies to this document.
GB/T 2423.22-2002 Environmental testing of electric and electronic products - Part 2. Test method Test N. Temperature change (IEC 60068-2-14. 1984, IDT)
Methods of mechanical and climatic test methods for semiconductor devices - Part 3. External visual inspection (Semiconductor devices -
Mechanicalandclimatictestmethods-Part 3.Externalvisualmethods)
3 Terms and definitions
The following terms and definitions apply to this document.
3.1 Load
The load consists of the test sample and the fixture used to fix the sample during the test.
Note. The maximum load is the maximum mass of the sample and fixture that can be placed in the tank's working area and that meets the specified temperature and time.
3.2 Monitoring sensor
Calibrated and installed in a suitable position to indicate the same temperature as the worst-case location of the sample.
Note. The worst case sample position is determined by the period characteristic of the worst case load temperature.
3.3 Worst case load temperature
Insert the temperature of the sample indicated by the thermocouple at the center of the load.
3.4 Sample specimen
Test device or individual.
3.5 Transfer time
The time it takes for the load to be removed from one tank to the other. […]
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 11 pages — is available in the English PDF.
Referenced standards
Normative references
IEC 60068
Cited by
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- GB/T 42836-2023Microwave semiconductor integrated circuits—Frequency mixer
- GB/T 42837-2023Microwave semiconductor integrated circuits—Amplifier
- GB/T 42839-2023Semiconductor integrated circuits - Analog digital (AD) converter
- GB/T 42973-2023Semiconductor integrated circuits—Digital-analog (DA) converter
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