GB/T 4937.2-2006Semiconductor devices -- Mechanical and climatic test methods -- Part 2: Low air pressure (English PDF)
半导体器件 机械和气候试验方法 第2部分:低气压
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Issued by
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Level / Type
National · Recommended
Issue date
August 23, 2006
Implementation date
February 1, 2007
Scope
GB/T 4937.2-2006 is the English-translated version of 半导体器件 机械和气候试验方法 第2部分:低气压.
GB/T 4937.2-2006 — This standard applies to low pressure testing of semiconductor devices. The purpose of this test is a side fixed components and material ability to prevent electrical breakdown failure, and this failure is due to air pressure decreases, the air insulation and other insulating material weakening caused.
This item applies only to face trial work voltage exceeding 1 000 V devices. This test applies to all air sealing semiconductor devices. This test applies only to military and space fields.
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Document preview — GB/T 4937.2-2006
National Standard of the People's Republic of China
- ICS
- 31.080
- Classification
- L 40
- Replacing
- GB/T 4937-1995 Partial
Issued by: General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Contents
- What this standard covers1
- Document data2
- Standards quoted by this document3
What this standard covers
This standard applies to low pressure testing of semiconductor devices. The purpose of this test is a side fixed components and material ability to prevent electrical breakdown failure, and this failure is due to air pressure decreases, the air insulation and other insulating material weakening caused. This item applies only to face trial work voltage exceeding 1 000 V devices. This test applies to all air sealing semiconductor devices. This test applies only to military and space fields. The term low pressure test methods and IEC 60068-2-13 largely the same, but in view of the special requirements of semiconductor devices, the use of this part of the terms.
Document data
International classification (ICS): 31.080.
Chinese classification (CCS): L40.
Estimated length of the Chinese original: 7,760 words.
Adopted international standard: IEC 60749-2-2002, IDT.
Supersedes the earlier edition GB/T 4937-1995 Partial.
Standards quoted by this document
IEC 60068-2-13
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 5 pages — is available in the English PDF.
Referenced standards
Cited by
- GB/T 46174-2025Space environment - General requirements for space environmental effect simulation tests of aerospace electronic components
- GB/T 46190-2025General requirements of protection for space environmental effects on spacecraft
- GB/T 43366-2023General specification for discrete semiconductor devices of space application
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Related Standards
GB/T 4937.1-2006 — Semiconductor devices -- Mechanical and climatic test methods -- Part 1: General
GB/T 4937.10-2025 — Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
GB/T 4937.11-2018 — Semiconductor devices -- Mechanical and climatic test methods -- Part 11: Rapid change of temperature -- Two-fluid-bath method
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