GB/T 4937.10-2025Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly (English PDF)

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents".

Drafting.

This document is Part 10 of GB/T 4937, "Mechanical and Climatic Test Methods for Semiconductor Devices". GB/T 4937 has been published as follows.

The lower part.

---Part 1: General Provisions;

---Part 2: Low Pressure;

---Part 3: External Visual Inspection;

---Part 4: Highly Accelerated Steady-State Damp Heat Test (HAST);

---Part 8: Sealing;

---Part 10: Mechanical Impact Devices and Components;

---Part 11: Rapid Temperature Change in Two-Liquid Tank Method;

---Part 12: Sweep Frequency Vibration;

---Part 13: Salt Spray;

---Part 14: Lead Strength (Lead Wire Secureness);

---Part 15: Solder Heat Resistance of Through-Hole Mounting Devices;

---Part 16: Particle Collision Noise Detection (PIND);

---Part 17: Neutron Irradiation;

---Part 18: Ionizing Radiation (Total Dose);

---Part 19: Chip Shear Strength;

---Part 20: Combined effects of moisture and soldering heat on molded surface mount devices;

---Part 20-1.Handling, Packaging, Marking, and Shipping of Surface Mount Devices Sensitive to the Combined Effects of Moisture and Solder Heat;

---Part 21: Solderability;

---Part 22: Bond Strength;

---Part 23: High-Temperature Operating Life;

---Part 24: Accelerated Moisture Resistance Test with Unbiased Strong Accelerated Stress;

---Part 25: Temperature Cycling;

---Part 26: Electrostatic Discharge (ESD) Sensitivity Testing Human Model (HBM);

---Part 27: Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM);

---Part 29: Latch Test;

---Part 30: Pretreatment of Unsealed Surface Mount Devices Prior to Reliability Testing;

---Part 31: Flammability of Molded Devices (Internal Causes);

---Part 32: Flammability of Molded Devices (Externally Caused);

---Part 33: Accelerated Moisture-Resistant, Non-Biased High-Pressure Cooking;

---Part 34: Power Cycling;

---Part 35: Acoustic Microscopy Inspection of Plastic-Encapsulated Electronic Components;

---Part 36: Steady-state acceleration;

---Part 37: Plate Drop Test Method Using Accelerometers;

---Part 38: Soft Fault Testing Methods for Semiconductor Devices with Storage;

---Part 39: Measurement of moisture diffusivity and water solubility of organic materials for semiconductor devices;

---Part 40: Plate Drop Test Method Using Strain Gauges;

---Part 42: Temperature and Humidity Storage;

---Part 44: Test methods for single-event effects (SEE) by neutron irradiation on semiconductor devices.

This document is equivalent to IEC 60749-10:2022 "Semiconductor devices - Mechanical and climatic testing methods - Part 10: Mechanical shocks".

Components and parts.

This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.

This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78).

Introduction

Semiconductor devices are general-purpose basic products in the electronics industry chain and are the most basic units in electronic systems. GB/T 4937 "Semiconductor Devices" the "Mechanical and Climate Test Methods for Semiconductor Devices" is a fundamental and universal standard for testing semiconductor devices, used for evaluating and assessing semiconductor devices.

The quality and reliability of the components play a crucial role. It is planned to consist of 44 parts.

---Part 1: General Principles. The purpose is to establish general guidelines for mechanical and climatic testing methods for semiconductor devices.

---Part 2: Low Pressure. The purpose is to test the ability of components and materials to avoid electrical breakdown failure.

---Part 3: External Visual Inspection. The purpose is to inspect whether the materials, design, structure, markings, and manufacturing processes of semiconductor devices meet the required standards.

Requirements for procurement documents.

---Part 4: Strong Accelerated Steady-State Damp Heat Test (HAST). The purpose is to specify the Strong Accelerated Steady-State Damp Heat Test (HAST) to detect...

To test the reliability of non-hermetically sealed semiconductor devices in humid environments.

---Part 5: Steady-State Temperature and Humidity Offset Lifetime Test. The purpose is to specify the steady-state temperature and humidity offset lifetime test to detect non-hermetic leaks.

Reliability of packaged semiconductor devices in humid environments.

---Part 6: High-Temperature Storage. The purpose is to investigate the effects of high-temperature storage on semiconductor devices without applying electrical stress.

---Part 7: Internal Moisture Measurement and Other Residual Gas Analysis. The purpose is to assess the quality of the packaging process and provide information on the gas content.

Information on the long-term chemical stability of the substance within the shell.

---Part 8: Sealing. The purpose is to detect the leakage rate of semiconductor devices.

---Part 9: Marking Durability. The purpose is to test the durability of markings on semiconductor devices.

---Part 10: Mechanical Shock Devices and Components. The purpose is to test semiconductor devices and printed circuit board assemblies against moderate stress.

The ability to adapt to shocks.

---Part 11: Rapid Temperature Change Two-Batter Method. The purpose is to define the rapid temperature change (two-batter method) for semiconductor devices.

The test procedures, failure criteria, and other related content.

---Part 12: Sweep Frequency Vibration. The purpose is to detect the effect of vibration on semiconductor devices within a specified frequency range.

---Part 13: Salt Spray. The purpose is to test the corrosion resistance of semiconductor devices.

---Part 14: Lead Strength (Lead Bonding). The purpose is to test the bonding strength of semiconductor device lead/package interfaces and leads.

Solid.

---Part 15: Solder Heat Resistance of Through-Hole Mounted Devices. The purpose is to test the solder heat resistance of through-hole mounted solid-state packaged semiconductor devices.

The ability to withstand the thermal stress generated by wave soldering or soldering leads.

---Part 16: Particle Collision Noise Detection (PIND). The purpose is to define the detection of free particles within cavity devices.

method.

---Part 17: Neutron Irradiation. The purpose is to detect the susceptibility of semiconductor devices to performance degradation in a neutron environment.

---Part 18: Ionizing Radiation (Total Dose). The purpose is to define the criteria for assessing the effects of low-dose-rate ionizing radiation on semiconductor devices.

Accelerated annealing test method.

---Part 19: Chip Shear Strength. The purpose is to test the materials used in mounting semiconductor chips onto sockets or substrates and...

Completeness of process steps.

---Part 20: Combined Effects of Moisture and Soldering Heat on Molded Surface Mount Devices. The aim is to simulate storage conditions in warehouses or...

The moisture absorbed by the plastic-sealed surface of semiconductor devices in a dry packaging environment is then evaluated to assess their resistance to soldering heat.

---Part 20-1.Handling, Packaging, Marking, and Shipping of Surface Mount Devices Sensitive to the Combined Effects of Moisture and Solder Heat. Purpose the regulations govern the handling, packaging, transportation, and use of surface-mount semiconductor devices in plastic packages that are sensitive to the combined effects of moisture and soldering heat.

method.

---Part 21: Solderability. The purpose is to specify the solderability of component package leads that can be soldered using lead-tin solder or lead-free solder.

Solderability test procedures.

---Part 22: Bond Strength. The purpose is to test the bond strength of semiconductor devices.

---Part 23: High-Temperature Operating Life. The purpose is to specify the effects of bias conditions and temperature on solid-state devices over time.

Experimental methods.

---Part 24: Accelerated Moisture Resistance Test with No Bias. The purpose is to test the performance of non-hermetic solid-state devices in humid environments.

Reliability under certain conditions.

---Part 25: Temperature Cycling. The purpose is to test the ability of semiconductor devices, components, and circuit board assemblies to withstand extreme high temperatures and extreme...

The ability of low-temperature alternating forces to induce mechanical stress.

---Part 26: Human Model (HBM) for Electrostatic Discharge (ESD) Sensitivity Testing. The aim is to specify reliable and repeatable...

HBMESD testing method.

---Part 27: Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM). The purpose is to specify reliable and repeatable MMs.

ESD testing methods.

---Part 28: Electrostatic Discharge (ESD) Sensitivity Testing of Charged Device Models (CDMs) at the Device Level. The purpose is to specify reliable...

A repeatable CDMESD testing method.

---Part 29: Latch-up Testing. The purpose is to specify methods for testing the latch-up characteristics of integrated circuits and criteria for latch-up failure.

---Part 30: Pre-treatment of unsealed surface mount devices prior to reliability testing. The purpose is to specify the pre-treatment procedures for unsealed surface mount devices.

Standard procedures for pre-processing devices before reliability testing.

---Part 31: Flammability of Molded Devices (Internal Causes). The purpose is to test whether flammability of molded devices is caused by overload.

It burns due to internal heat.

---Part 32: Flammability of Molded Devices (Externally Caused). The purpose is to test whether flammability of molded devices is caused by external heat.

It burns.

---Part 33: Accelerated Moisture-Resistant, Bias-Free High-Pressure Cooking. The aim is to confirm the internal failure mechanism of semiconductor device packages.

---Part 34: Power Cycling. The aim is to achieve power cycling by applying cyclic power losses to the chips and connectors inside semiconductor devices.

Test the heat and mechanical stress resistance of semiconductor devices.

---Part 35: Acoustic Microscopy Inspection of Plastic-Encapsulated Electronic Components. The purpose is to specify the acoustic microscopy requirements for plastic-encapsulated electronic components.

Methods for detecting defects (delamination, cracks, voids, etc.) in components.

---Part 36: Steady-State Acceleration. The purpose is to specify the test method for the steady-state acceleration of cavity semiconductor devices in order to detect their structural properties.

Defects in structure and mechanical type.

---Part 37: Plate Drop Test Method Using Accelerometers. The purpose is to specify the plate drop test method using accelerometers.

The method allows for repeated testing of surface-mount devices during drop tests, while also reproducing common failure modes encountered during product-level testing.

---Part 38: Soft Fault Testing Methods for Semiconductor Devices with Storage. The purpose is to specify the testing methods for semiconductor devices with storage.

Experimental methods for assessing soft error sensitivity in high-energy particle environments (such as alpha radiation).

---Part 39: Measurement of Moisture Diffusivity and Water Solubility of Organic Materials for Semiconductor Devices. The purpose is to specify the applications of organic materials in semiconductor devices...

Methods for measuring the moisture diffusivity and water solubility of organic materials used in the packaging of conductor devices.

---Part 40: Plate Drop Test Method Using Strain Gauges. The purpose is to specify the method for plate drop tests using strain gauges.

This method allows for repeated testing of surface-mount devices during drop tests, while also reproducing common failure modes encountered during product-level testing.

---Part 41: Test methods for the reliability of non-volatile memory. The purpose is to specify the effective durability and reliability of non-volatile memory.

According to the requirements of the holding and temperature cycling test.

---Part 42: Temperature and Humidity Storage. The purpose is to specify test methods for assessing the ability of semiconductor devices to withstand high temperature and humidity environments.

---Part 44: Test methods for single-event effects (SEE) under neutron irradiation in semiconductor devices. The purpose is to specify the detection methods for high-density integrated circuits.

Test methods for single-event effect (SEE) in circuits.

GB/T 4937 (all parts) corresponds one-to-one with IEC 60749 (all parts) to ensure that the test methods for semiconductor devices are in line with international standards.

This standard aims to align semiconductor device testing methods, reliability evaluation, and quality levels with international standards. By establishing this standard, unified testing procedures will be defined.

Test methods and stresses, and improve the standard system for semiconductor devices.

Mechanical and Climate Testing Methods for Semiconductor Devices Part 10: Mechanical Impact Devices and Components

1 Scope

This document applies to semiconductor devices in a free state and assembled on printed circuit boards to determine the stresses experienced by the devices and printed circuit board assemblies.

The ability to withstand severe impacts. Printed circuit board assembly is a process of testing the mechanical resistance of devices under operating conditions after assembly onto a printed circuit board.

Methods of assessing impact strength. Mechanical impact is caused by suddenly applied forces, and by sudden forces encountered during loading, unloading, transportation, or on-site operations. This type of impact...

Impacts can damage operating characteristics, especially under repeated impact pulses. This test is applicable to destructive testing for device qualification.

2 Normative references

This document has no normative references.

3 Terms and Definitions

The following terms and definitions apply to this document.

component

A component of a device or sub-component.

Note 1.For example, source and drain are components of a transistor; lead frame and die are components of a packaged integrated circuit; resistors and integrated circuits are...

The components of a printed circuit board include the motherboard (a component of a computer), the LCD screen (a component of a monitor), and complex waveform AC and DC circuits.

The flow part, as well as the loops and algorithms that are components of the software program.

Note 2.Whether it is classified as a device or a component depends on the owner's intention in classifying it.

dead-bug orientation with lead-out end facing upwards the package leads should face upwards.

device

Equipment, apparatus or other entity designed for a particular purpose or to perform a particular function.

Note 1.The term "device" is usually used as an abbreviation for solid-state device type.

Note 2.Whether it is classified as a device or a component depends on the owner's intention in classifying it.

Equivalent drop height Under vacuum and standard gravity, the height at which a stationary object falls freely from this height is measured to obtain the velocity change specified in the test specifications.

The speed of effectiveness.

Note. This is the theoretical height at which a specific velocity change will occur if an impact with zero rebound occurs. This height is for reference only and applies to various test conditions.

free state

The device or printed circuit board assembly is securely mounted on the test equipment, thereby enabling the full specified impact level to be transmitted to the device or printed circuit board.