GB/T 4937.37-2025Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (English PDF)

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents".

Drafting.

This document is Part 37 of GB/T 4937, "Mechanical and Climatic Test Methods for Semiconductor Devices". GB/T 4937 has been published.

The following section.

---Part 1: General Provisions;

---Part 2: Low Pressure;

---Part 3: External Visual Inspection;

---Part 4: Highly Accelerated Steady-State Damp Heat Test (HAST);

---Part 8: Sealing;

---Part 10: Mechanical Impact Devices and Components;

---Part 11: Rapid Temperature Change in Two-Liquid Tank Method;

---Part 12: Sweep Frequency Vibration;

---Part 13: Salt Spray;

---Part 14: Lead Strength (Lead Wire Secureness);

---Part 15: Solder Heat Resistance of Through-Hole Mounting Devices;

---Part 16: Particle Collision Noise Detection (PIND);

---Part 17: Neutron Irradiation;

---Part 18: Ionizing Radiation (Total Dose);

---Part 19: Chip Shear Strength;

---Part 20: Combined effects of moisture and soldering heat on molded surface mount devices;

---Part 20-1.Handling, Packaging, Marking, and Shipping of Surface Mount Devices Sensitive to the Combined Effects of Moisture and Solder Heat;

---Part 21: Solderability;

---Part 22: Bond Strength;

---Part 23: High-Temperature Operating Life;

---Part 24: Accelerated Moisture Resistance Test with Unbiased Strong Accelerated Stress;

---Part 25: Temperature Cycling;

---Part 26: Electrostatic Discharge (ESD) Sensitivity Testing Human Model (HBM);

---Part 27: Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM);

---Part 29: Latch Test;

---Part 30: Pretreatment of Unsealed Surface Mount Devices Prior to Reliability Testing;

---Part 31: Flammability of Molded Devices (Internal Causes);

---Part 32: Flammability of Molded Devices (Externally Caused);

---Part 33: Accelerated Moisture-Resistant, Non-Biased High-Pressure Cooking;

---Part 34: Power Cycling;

---Part 35: Acoustic Microscopy Inspection of Plastic-Encapsulated Electronic Components;

---Part 36: Steady-state acceleration;

---Part 37: Plate Drop Test Method Using Accelerometers;

---Part 38: Soft Fault Testing Methods for Semiconductor Devices with Storage;

---Part 39: Measurement of moisture diffusivity and water solubility of organic materials for semiconductor devices;

---Part 40: Plate Drop Test Method Using Strain Gauges;

---Part 42: Temperature and Humidity Storage;

---Part 44: Test methods for single-event effects (SEE) by neutron irradiation on semiconductor devices.

This document is equivalent to IEC 60749-37:2022 "Mechanical and climatic testing methods for semiconductor devices – Part 37: Testing with acceleration".

The method for designing plate drop tests.

Please note that some content in this document may involve patents. The issuing organization of this document assumes no responsibility for identifying patents.

This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.

This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78).

Introduction

Semiconductor devices are general-purpose basic products in the electronics industry chain and are the most basic units in electronic systems. GB/T 4937 "Semiconductor Devices" the "Mechanical and Climate Test Methods for Semiconductor Devices" is a fundamental and universal standard for testing semiconductor devices, used for evaluating and assessing semiconductors.

The quality and reliability of the device play a crucial role. It is planned to consist of 44 parts.

---Part 1: General Principles. The purpose is to establish general guidelines for mechanical and climatic testing methods for semiconductor devices.

---Part 2: Low Pressure. The purpose is to determine the ability of components and materials to avoid electrical breakdown failure.

---Part 3: External Visual Inspection. The purpose is to verify whether the materials, design, structure, markings, and manufacturing processes of semiconductor devices meet the required standards.

Requirements for procurement documents.

---Part 4: Strong Accelerated Steady-State Damp Heat Test (HAST). The purpose is to specify the Strong Accelerated Steady-State Damp Heat Test (HAST) to evaluate...

The reliability of non-hermetic-sealed semiconductor devices in humid environments.

---Part 5: Steady-State Temperature and Humidity Offset Lifetime Test. The purpose is to specify the steady-state temperature and humidity offset lifetime test to evaluate non-hermetic systems.

Reliability of packaged semiconductor devices in humid environments.

---Part 6: High-Temperature Storage. The aim is to determine the effects of high-temperature storage on semiconductor devices without applying electrical stress.

---Part 7: Internal Moisture Measurement and Other Residual Gas Analysis. The purpose is to assess the quality of the packaging process and provide information on the gas content.

Information on the long-term chemical stability of the substance within the shell.

---Part 8: Sealing. The purpose is to detect the leakage rate of semiconductor devices.

---Part 9: Marking Durability. The purpose is to test and verify the marking durability on semiconductor devices.

---Part 10: Mechanical Shock. The purpose is to determine the adaptability of semiconductor devices and printed circuit board assemblies to moderate levels of shock.

ability.

---Part 11: Rapid Temperature Change Two-Batter Method. The purpose is to define the rapid temperature change (two-batter method) for semiconductor devices.

The test procedures, failure criteria, and other related content.

---Part 12: Sweep Frequency Vibration. The purpose is to determine the effect of vibration on semiconductor devices within a specified frequency range.

---Part 13: Salt Spray. The purpose is to determine the corrosion resistance of semiconductor devices.

---Part 14: Lead Strength (Wire Bonding). The purpose is to determine the bonding strength of semiconductor device lead/package interfaces and leads.

Solid.

---Part 15: Solder Heat Resistance of Through-Hole Mounted Devices. The aim is to determine the solder heat resistance of through-hole mounted solid-state packaged semiconductor devices.

The ability to withstand the thermal stress generated by peak soldering or soldering leads with a soldering iron.

---Part 16: Particle Collision Noise Detection (PIND). The purpose is to specify a method for detecting free particles within cavity devices.

---Part 17: Neutron Irradiation. The aim is to determine the susceptibility of semiconductor devices to performance degradation in a neutron environment.

---Part 18: Ionizing Radiation (Total Dose). The purpose is to provide an assessment method for the effects of low-dose-rate ionizing radiation on semiconductor devices.

Accelerated annealing test method.

---Part 19: Chip Shear Strength. The purpose is to determine the materials and processes used in mounting semiconductor chips onto sockets or substrates.

The completeness of the process steps.

---Part 20: Combined Effects of Moisture and Soldering Heat on Molded Surface Mount Devices. The aim is to simulate storage conditions in warehouses or dry environments.

The moisture absorbed by surface-mounted semiconductor devices in a dry packaging environment was determined, and their soldering heat resistance was evaluated.

---Part 20-1.Handling, Packaging, Marking, and Shipping of Surface Mount Devices Sensitive to the Combined Effects of Moisture and Solder Heat. Purpose the aim is to provide operating and packaging solutions for manufacturers and users of molded surface mount semiconductor devices that are sensitive to the combined effects of moisture and soldering heat.

Methods of loading, transporting and using.

---Part 21: Solderability. This section specifies the solderability of component package leads that can be soldered using lead-tin solder or lead-free solder.

Solderability test procedure.

---Part 22: Bond Strength. The purpose is to measure bond strength or determine whether the bond strength meets the specified requirements.

---Part 23: High-Temperature Operating Life. The purpose is to specify the effects of bias conditions and temperature on solid-state devices over time.

Experimental methods.

---Part 24: Accelerated Moisture Resistance Test with No Bias. The purpose is to evaluate the performance of non-hermetic solid-state devices in humid environments.

Reliability under certain conditions.

---Part 25: Temperature Cycling. The purpose is to determine the ability of semiconductor devices, components, and circuit board assemblies to withstand extreme high temperatures and extreme...

The ability of low-temperature alternating forces to induce mechanical stress.

---Part 26: Human Model (HBM) for Electrostatic Discharge (ESD) Sensitivity Testing. The aim is to establish a reproducible...

A test method for HBM failure is proposed to provide reliable and repeatable HBMESD test results.

---Part 27: Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM). The aim is to establish a model capable of reproducing the MM.

Failure testing methods to provide reliable and repeatable MMESD test results.

---Part 28: Electrostatic Discharge (ESD) Sensitivity Testing of Charged Device Models (CDMs) at the Device Level. The aim is to establish a...

A test method capable of reproducing CDM failures to provide reliable and repeatable CDMESD test results.

---Part 29: Latch-up Testing. The aim is to establish a method for assessing the latch-up characteristics of integrated circuits and to define latch-up failure criteria.

Criteria.

---Part 30: Pre-treatment of Unsealed Surface Mount Devices Prior to Reliability Testing. The purpose is to specify the pre-treatment procedures for unsealed surface mount devices.

The standard procedure for pre-processing components before reliability testing.

---Part 31: Flammability of Molded Devices (Internal Cause). The purpose is to determine whether internal flammability of the molded device is caused by overload.

The part heats up and burns.

---Part 32: Flammability of Molded Devices (Externally Caused). The purpose is to determine whether the flammability of the molded device is caused by external heat.

combustion.

---Part 33: Accelerated Moisture-Resistant, Bias-Free High-Pressure Cooking. The aim is to confirm the internal failure mechanism of semiconductor device packages.

---Part 34: Power Cycling. The purpose is to determine the power cycling by applying cyclic power losses to the chips and connectors inside semiconductor devices.

Determine the heat resistance and mechanical stress resistance of semiconductor devices.

---Part 35: Acoustic Microscopy Inspection of Plastic-Encapsulated Electronic Components. The aim is to provide a method for inspecting plastic-encapsulated electronic components using an acoustic microscope.

Methods for detecting defects (delamination, cracks, voids, etc.) in sub-components.

---Part 36: Steady-State Acceleration. The purpose is to specify the test method for the steady-state acceleration of cavity semiconductor devices in order to detect their structural properties.

Defects in structure and mechanical type.

---Part 37: Plate Drop Test Method Using Accelerometers. The purpose is to specify the plate drop test method using accelerometers.

The method allows for repeatable evaluation of drop tests on surface-mount devices, while also reproducing common failure modes encountered during product-level testing.

---Part 38: Soft Error Testing Methods for Semiconductor Devices with Storage. The aim is to establish the testing methods for semiconductor devices with storage.

Experimental methods for assessing soft error sensitivity in high-energy particle environments (such as alpha radiation).

---Part 39: Measurement of Moisture Diffusivity and Water Solubility of Organic Materials for Semiconductor Devices. The aim is to establish the standards for measuring the moisture diffusivity and water solubility of organic materials used in semiconductor devices.

Methods for measuring the moisture diffusivity and water solubility of organic materials used in the packaging of conductor devices.

---Part 40: Plate Drop Test Method Using Strain Gauges. The purpose is to specify the method for plate drop tests using strain gauges.

This method allows for repeated evaluation of drop tests on surface-mount devices, while also reproducing common failure modes encountered during product-level testing.

---Part 41: Reliability Testing Methods for Non-Volatile Memory. The purpose is to systematically specify the effective reliability testing methods for non-volatile memory.

Requirements for durability, data retention, and temperature cycling testing.

---Part 42: Temperature and Humidity Storage. The purpose is to specify test methods for evaluating the ability of semiconductor devices to withstand high temperature and humidity environments.

---Part 44: Experimental Methods for Neutron Irradiation Single-Event Effects (SEE) in Semiconductor Devices. The aim is to establish a method for measuring high...

Experimental method for single event effect (SEE) of density integrated circuits.

GB/T 4937 (all parts) corresponds one-to-one with IEC 60749 (all parts) to ensure that the test methods for semiconductor devices are in line with international standards.

This will ensure consistency with international standards, aligning semiconductor device testing methods, reliability evaluation, and quality levels with international practices. This series of standards will be developed to achieve this goal.

Accuracy is crucial for determining standardized test methods and stresses, evaluating the environmental adaptability of semiconductor devices, and influencing the research, production, and...

Testing and use are of great significance, and at the same time, they supplement and improve the semiconductor device standard system, playing a role in the development of the semiconductor device industry.

Guiding role.

Mechanical and Climate Testing Methods for Semiconductor Devices Part 37: Plate Drop with Accelerometer Test methods

1 Scope

This document describes a test method for evaluating and comparing the drop performance of surface-mount devices in handheld electronic products in an accelerated testing environment.

According to the law, excessive bending of the circuit board during drop testing can cause electronic products to fail. The purpose of this document is to ensure the correct testing circuit board and testing methods.

Standardization provides repeatable evaluation of drop tests on surface mount devices, enabling the same failure modes to be obtained in product-level testing.

This document specifies a standard test method and reporting requirements. This document is related to device qualification testing and the determination of the conformity of handheld electronic products.

The difference between system-level drop testing and vibration testing simulating the transport and handling of devices or printed circuit board assemblies, for example...

GB/T 4937.10-2025 specifies the method requirements for these tests. This method is applicable to surface-mount packages with quad leads.

Encapsulation.

This test method uses an accelerometer to measure the duration and amplitude of a mechanical shock, with the amplitude compared to a given device mounted on a standard plate.

The magnitude of the force is proportional. IEC 60749-40 describes a test method for measuring the strain and strain rate of a circuit board surrounding a device using a strain gauge.

Test methods. Detailed specifications specify the test methods used.

2 Normative references

The contents of the following documents, through normative references within the text, constitute essential provisions of this document. Dated citations are not included.

For references to documents, only the version corresponding to that date applies to this document; for undated references, the latest version (including all amendments) applies.

This document.

GB/T 4937.10-2025 Semiconductor devices - Mechanical and climatic testing methods - Part 10: Mechanical shock devices and assemblies (IEC 60749-10:2022, IDT) IEC 60749-20 Semiconductor devices – Mechanical and climatic testing methods – Part 20: Molded surface mount devices – Resistance to moisture and soldering Note. GB/T 4937.20-2018 Semiconductor Devices - Mechanical and Climate Test Methods - Part 20: Resistance to Moisture and Solder Thermal Synthesis of Molded Surface Mount Devices Combined impact (IEC 60749-20:2008, IDT) IEC 60749-20-1 Mechanical and climatic testing methods for semiconductor devices – Part 20-1.Sensitivity to the combined effects of humidity and soldering heat Note. GB/T 4937.201-2018 Mechanical and Climatic Testing Methods for Semiconductor Devices - Part 20-1.Devices Sensitive to the Combined Effects of Humidity and Soldering Heat Handling, packaging, marking and transport of surface mount devices (IEC 60749-20-1:2009, IDT)

3 Terms and Definitions

The following terms and definitions apply to this document.