GB/T 4937.201-2018Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (English PDF)

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents".

Drafting.

This document is Part 20-1 of GB/T 4937 "Mechanical and Climatic Test Methods for Semiconductor Devices". GB/T 4937 has been published.

The following parts were included.

---Part 1.General Provisions;

---Part 2.Low Pressure;

---Part 3.External Visual Inspection;

---Part 4.Highly Accelerated Steady-State Damp Heat Test (HAST);

---Part 8.Sealing;

---Part 9.Marking Durability;

---Part 10.Mechanical Impact Devices and Components;

---Part 11.Rapid Temperature Change in Two-Liquid Tank Method;

---Part 12.Sweep Frequency Vibration;

---Part 13.Salt Spray;

---Part 14.Lead Strength (Lead Wire Secureness);

---Part 15.Solder Heat Resistance of Through-Hole Mounting Devices;

---Part 16.Particle Collision Noise Detection (PIND);

---Part 17.Neutron Irradiation;

---Part 18.Ionizing Radiation (Total Dose);

---Part 19.Chip Shear Strength;

---Part 20.Combined effects of moisture and soldering heat on molded surface mount devices;

---Part 20-1.Handling, Packaging, Marking, and Shipping of Surface Mount Devices Sensitive to the Combined Effects of Moisture and Solder Heat;

---Part 21.Solderability;

---Part 22.Bond Strength;

---Part 23.High-Temperature Operating Life;

---Part 24.Accelerated Moisture Resistance Test with Unbiased Strong Accelerated Stress;

---Part 25.Temperature Cycling;

---Part 26.Electrostatic Discharge (ESD) Sensitivity Testing Human Model (HBM);

---Part 27.Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM);

---Part 28.Electrostatic Discharge (ESD) Sensitivity Testing of Charged Device Models (CDMs) at the Device Level;

---Part 29.Latch Test;

---Part 30.Pretreatment of Unsealed Surface Mount Devices Prior to Reliability Testing;

---Part 31.Flammability of Molded Devices (Internal Causes);

---Part 32.Flammability of Molded Devices (Externally Caused);

---Part 33.Accelerated Moisture-Resistant, Non-Biased High-Pressure Cooking;

---Part 34.Power Cycling;

---Part 35.Acoustic Microscopy Inspection of Plastic-Encapsulated Electronic Components;

---Part 36.Steady-state acceleration;

---Part 37.Plate drop test method using accelerometers;

---Part 38.Soft Fault Testing Methods for Semiconductor Devices with Storage;

---Part 39.Measurement of moisture diffusivity and water solubility of organic materials for semiconductor devices;

---Part 40.Plate Drop Test Method Using Strain Gauges;

---Part 41.Test methods for the reliability of non-volatile memory;

---Part 42.Temperature and Humidity Storage;

---Part 44.Test methods for single-event effects (SEE) by neutron irradiation on semiconductor devices.

This document replaces GB/T 4937.201-2018 "Mechanical and Climatic Testing Methods for Semiconductor Devices - Part 20-1.Tests for Mechanical and Climatic Effects on Devices in Moisture and..."

"Operation, Packaging, Marking and Transportation of Surface Mount Devices Sensitive to the Comprehensive Effects of Welding Heat" Compared with GB/T 4937.201-2018, except for the junction...

Aside from structural adjustments and editorial changes, the main technical changes are as follows.

---The term "batch reflow soldering" has been changed to "batch reflow soldering" (see 3.3,.2018 edition), and "in-package life" has been changed to "shelf life".

"Lifespan" (see 3.11,.2018 edition), "reflow soldering" changed to "reflow soldering" (see 3.13,.2018 edition);

---A water rinsing process has been added (see 4.1.5);

---Added requirements for some materials inside dry packaging (see 5.3.2);

---Added dry packaging precautions (see 5.3.5);

---Added conditions for resetting or pausing "Workshop Life" at the user site (see 6.1);

---A test method for humidity indicator cards used in electronic component packaging has been added (see Appendix C).

This document is equivalent to IEC 60749-20-1.2019 "Semiconductor devices - Mechanical and climatic testing methods - Part 20-1.Exposure to moisture"

The combined effects of welding heat and the handling, packaging, marking, and transportation of surface mount devices are all sensitive to these factors.

Please note that some content in this document may involve patents. The issuing organization of this document assumes no responsibility for identifying patents.

This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.

This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78).

Introduction

Semiconductor devices are general-purpose basic products in the electronics industry chain and are the most basic units in electronic systems. GB/T 4937 "Semiconductor Devices"

The "Mechanical and Climate Test Methods for Semiconductor Devices" is a fundamental and universal standard for testing semiconductor devices, used for evaluating and assessing semiconductors.

The quality and reliability of the device play a crucial role, and it is proposed to consist of forty-four parts.

---Part 1.General Principles. The purpose is to establish general guidelines for mechanical and climatic testing methods for semiconductor devices.

---Part 2.Low Pressure. The purpose is to determine the ability of components and materials to avoid electrical breakdown failure.

---Part 3.External Visual Inspection. The purpose is to verify whether the materials, design, structure, markings, and manufacturing processes of semiconductor devices meet the required standards.

Requirements for procurement documents.

---Part 4.Strong Accelerated Steady-State Damp Heat Test (HAST). The purpose is to specify the Strong Accelerated Steady-State Damp Heat Test (HAST) to evaluate...

Reliability of non-hermetic packaged semiconductor devices in humid environments.

---Part 5.Steady-State Temperature and Humidity Offset Lifetime Test. The purpose is to specify the steady-state temperature and humidity offset lifetime test to evaluate non-hermetic systems.

Reliability of packaged semiconductor devices in humid environments.

---Part 6.High-Temperature Storage. The aim is to determine the effects of high-temperature storage on semiconductor devices without applying electrical stress.

---Part 7.Internal Moisture Measurement and Other Residual Gas Analysis. The purpose is to assess the quality of the packaging process and provide information on gas content.

Information on the long-term chemical stability of the substance within the shell.

---Part 8.Sealing. The purpose is to detect the leakage rate of semiconductor devices.

---Part 9.Marking Durability. The purpose is to test and verify the marking durability on semiconductor devices.

---Part 10.Mechanical Shock Devices and Components. The aim is to determine the ability of semiconductor devices and printed circuit board assemblies to withstand moderate levels of stress.

The ability to adapt to shocks.

---Part 11.Rapid Temperature Change Two-Batter Method. The purpose is to define the rapid temperature change (two-batter method) for semiconductor devices.

The test procedures, failure criteria, and other related content.

---Part 12.Sweep Frequency Vibration. The purpose is to determine the effect of vibration on semiconductor devices within a specified frequency range.

---Part 13.Salt Spray. The purpose is to determine the corrosion resistance of semiconductor devices.

---Part 14.Lead Strength (Lead Bonding). The purpose is to determine the bonding strength of semiconductor device lead/packaging interfaces and leads.

Solid.

---Part 15.Solder Heat Resistance of Through-Hole Mounted Devices. The aim is to determine the solder heat resistance of through-hole mounted solid-state packaged semiconductor devices.

The ability to withstand the thermal stress generated by peak soldering or soldering leads with a soldering iron.

---Part 16.Particle Collision Noise Detection (PIND). The purpose is to specify a method for detecting free particles within cavity devices.

---Part 17.Neutron Irradiation. The aim is to determine the susceptibility of semiconductor devices to performance degradation in a neutron environment.

---Part 18.Ionizing Radiation (Total Dose). The purpose is to provide an assessment method for the effects of low-dose-rate ionizing radiation on semiconductor devices.

Accelerated annealing test method.

---Part 19.Chip Shear Strength. The purpose is to determine the materials and processes used in mounting semiconductor chips onto sockets or substrates.

The completeness of the process steps.

---Part 20.Combined Effects of Moisture and Soldering Heat on Molded Surface Mount Devices. The aim is to simulate storage conditions in warehouses or dry environments.

The moisture absorbed by the plastic-sealed surface of semiconductor devices in a dry packaging environment is then evaluated to assess their resistance to soldering heat.

---Part 20-1.Handling, Packaging, Marking, and Shipping of Surface Mount Devices Sensitive to the Combined Effects of Moisture and Solder Heat. Purpose

The aim is to provide operating and packaging solutions for manufacturers and users of molded surface mount semiconductor devices that are sensitive to the combined effects of moisture and soldering heat.

Methods of loading, transporting and using.

---Part 21.Solderability. The purpose is to specify the solderability of component leads that can be soldered using lead-tin solder or lead-free solder.

Solderability test procedures.

---Part 22.Bond Strength. The purpose is to measure bond strength or determine whether the bond strength meets specified requirements.

---Part 23.High-Temperature Operating Life. The purpose is to specify the effects of bias conditions and temperature on solid-state devices over time.

Experimental methods.

---Part 24.Accelerated Moisture Resistance Test with No Bias. The purpose is to evaluate the performance of non-hermetically packaged solid-state devices in humid environments.

Reliability under certain conditions.

---Part 25.Temperature Cycling. The purpose is to determine the ability of semiconductor devices, components, and circuit board assemblies to withstand extreme high temperatures and extreme...

The ability of low-temperature alternating forces to induce mechanical stress.

---Part 26.Human Model (HBM) for Electrostatic Discharge (ESD) Sensitivity Testing. The aim is to establish a reproducible...

A test method for HBM failure is proposed to provide reliable and repeatable HBMESD test results.

---Part 27.Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM). The aim is to establish a model capable of reproducing the MM.

Failure testing methods to provide reliable and repeatable MMESD test results.

---Part 28.Electrostatic Discharge (ESD) Sensitivity Testing of Charged Device Models (CDMs) at the Device Level. The aim is to establish a...

A test method capable of reproducing CDM failures to provide reliable and repeatable CDMESD test results.

---Part 29.Latch-up Testing. The aim is to establish a method for assessing the latch-up characteristics of integrated circuits and to define latch-up failure criteria.

Criteria.

---Part 30.Pre-treatment of Unsealed Surface Mount Devices Prior to Reliability Testing. The purpose is to specify the pre-treatment procedures for unsealed surface mount devices.

The standard procedure for pre-processing components before reliability testing.

---Part 31.Flammability of Molded Devices (Internal Cause). The purpose is to determine whether internal flammability of the molded device is caused by overload.

The part heats up and burns.

---Part 32.Flammability of Molded Devices (Externally Caused). The purpose is to determine whether the flammability of the molded device is caused by external heat.

combustion.

---Part 33.Accelerated Moisture-Resistant, Bias-Free High-Pressure Cooking. The aim is to confirm the internal failure mechanism of semiconductor device packaging.

---Part 34.Power Cycling. The purpose is to determine the power cycling by applying cyclic power losses to the chips and connectors inside semiconductor devices.

Determine the heat resistance and mechanical stress resistance of semiconductor devices.

---Part 35.Acoustic Microscopy Inspection of Molded Electronic Components. The aim is to provide a method for inspecting molded electronic components using an acoustic microscope.

Methods for detecting defects (delamination, cracks, voids, etc.) in sub-components.

---Part 36.Steady-State Acceleration. The purpose is to specify the test method for the steady-state acceleration of cavity semiconductor devices in order to detect their structural properties.

Defects in structure and mechanical type.

---Part 37.Plate Drop Test Method Using Accelerometers. The purpose is to specify the plate drop test method using accelerometers.

The method allows for repeatable evaluation of drop tests on surface-mount devices, while also reproducing common failure modes encountered during product-level testing.

---Part 38.Soft Error Testing Methods for Semiconductor Devices with Storage. The aim is to establish the testing methods for semiconductor devices with storage.

Experimental methods for assessing soft error sensitivity in high-energy particle environments (such as alpha radiation).

---Part 39.Measurement of Moisture Diffusivity and Water Solubility of Organic Materials for Semiconductor Devices. The aim is to establish the standards for measuring the moisture diffusivity and water solubility of organic materials used in semiconductor devices.

Methods for measuring the moisture diffusivity and water solubility of organic materials used in packaging conductor devices.

---Part 40.Plate Drop Test Method Using Strain Gauges. The purpose is to specify the method for plate drop tests using strain gauges.

This method allows for repeated evaluation of drop tests on surface-mount devices, while also reproducing common failure modes encountered during product-level testing.

---Part 41.Reliability Testing Methods for Non-Volatile Memory. The purpose is to systematically specify the effective reliability testing methods for non-volatile memory.

Requirements for durability, data retention, and temperature cycling testing.

---Part 42.Temperature and Humidity Storage. The purpose is to specify test methods for evaluating the ability of semiconductor devices to withstand high temperature and humidity environments.

---Part 44.Experimental Methods for Neutron Irradiation Single-Event Effect (SEE) in Semiconductor Devices. The aim is to establish a method for measuring high...

Experimental method for single-event effect (SEE) of density integrated circuits.

GB/T 4937 (all parts) are adopted one-to-one with IEC 60749 (all parts) to ensure that the test methods for semiconductor devices are consistent with national standards.

This standard aligns with international standards, bringing semiconductor device testing methods, reliability evaluation, and quality levels in line with international practices. By establishing this standard, a unified approach is achieved.

The testing methods and stresses, along with the improvement of the semiconductor device standard system, are of great importance to the research, production, inspection, and use of semiconductor devices.

significance.

Mechanical and Climate Testing Methods for Semiconductor Devices

Part 20-1.Comprehensive Analysis of Moisture and Welding Heat

Affects the operation of sensitive surface mount devices

Packaging, labeling and shipping

1 Scope

This document applies to all components undergoing batch reflow soldering processes during printed circuit board (PCB) assembly, including those in plastic packaging and process-sensitive components.

Moisture-sensitive devices and other moisture-sensitive devices made of moisture-permeable materials (epoxy resin, silicone, etc.) that are exposed to the air.

The purpose of this document is to provide surface mount device (SMD) manufacturers and users with guidance on classifying components according to IEC 60749-20.

Standard methods for handling, packaging, shipping, and using moisture- and reflow-sensitive SMD components. These methods are provided to avoid [problems caused by moisture and reflow soldering].

Damage caused by moisture absorption and exposure to the high temperatures of reflow soldering can lead to reduced yield and reliability. Through these processes...

The application of this sequence enables safe and non-destructive reflow soldering. Components are packaged in dry packaging, providing a product that is stored in a sealed, desiccant bag from the date of sealing.

Frame lifespan.

IEC 60749-20 specifies two methods for testing resistance to weld heat. Method A and Method B. Method A assumes protection against water vapor immersion.

The method is specified under the premise that the relative humidity inside the moisture bag is less than 30%. Method B is based on the assumption that the manufacturer's exposure time (MET) does not exceed 24 hours, and

This specification applies only under the premise that the relative humidity inside the moisture-proof bag is less than 10%. In actual operating environments, the SMD (Steam-Moisture Mask) using method A is permitted to absorb moisture.

To achieve a relative humidity of 30%, the SMD using method B is permitted to absorb moisture up to 10% relative humidity. This document specifies the requirements for the above tests.

Operating conditions for SMD under certain conditions.

Note. Hermetically sealed SMDs are not moisture-sensitive devices and do not require moisture-proof treatment.

2 Normative references

The contents of the following documents, through normative references within the text, constitute essential provisions of this document. Dated citations are not included.

For references to documents, only the version corresponding to that date applies to this document; for undated references, the latest version (including all amendments) applies.

This document.

IEC 60749-20 Semiconductor devices – Mechanical and climatic testing methods – Part 20.Molded surface mount devices – Resistance to moisture and soldering

Note. GB/T 4937.20-2018 Semiconductor Devices - Mechanical and Climate Test Methods - Part 20.Molded Surface Mount Devices - Resistance to Moisture and Solder Thermal Synthesis

Combined impact (IEC 60749-20.2008, IDT)

IEC 60749-30 Semiconductor devices – Mechanical and climatic testing methods – Part 30.Reliability testing of unhermised surface mount devices

Note. GB/T 4937.30-2018 Semiconductor Devices - Mechanical and Climate Testing Methods - Part 30.Non-hermetic Surface Mount Devices Before Reliability Testing

Preprocessing (IEC 60749-30.2011, IDT)

3 Terms and Definitions

The following terms and definitions apply to this document.