GB/T 4937.1-2006Semiconductor devices -- Mechanical and climatic test methods -- Part 1: General (English PDF)
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Issued by
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Level / Type
National · Recommended
Issue date
August 23, 2006
Implementation date
February 1, 2007
Scope
GB/T 4937.1-2006 (Semiconductor devices -- Mechanical and climatic test methods -- Part 1: General) is available as an English-translated PDF.
GB/T 4937.1-2006 — This standard applies to semiconductor devices (discrete devices and integrated circuits) and to GB/T 4937 series the rest of the establishment of common guidelines.
When the part is too small walk back and forth with the corresponding specification when viewed with spears.
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Document preview — GB/T 4937.1-2006
National Standard of the People's Republic of China
- ICS
- 31.080.1
- Classification
- L 40
- Replacing
- GB/T 4937-1995 Partial
Issued by: General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Contents
- What this standard covers1
- Document data2
- Standards quoted by this document3
What this standard covers
This standard applies to semiconductor devices (discrete devices and integrated circuits) and to GB/T 4937 series the rest of the establishment of common guidelines. When the part is too small walk back and forth with the corresponding specification when viewed with spears. In detail specification shall prevail.
Document data
International classification (ICS): 31.080.1.
Chinese classification (CCS): L40.
Estimated length of the Chinese original: 7,797 words.
Adopted international standard: IEC 60749-1-2002, IDT.
Supersedes the earlier edition GB/T 4937-1995 Partial.
Standards quoted by this document
IEC 60050; IEC 60747; IEC 60748
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 5 pages — is available in the English PDF.
Referenced standards
Cited by
- GB/T 44924-2024Semiconductor integrated circuits - Measuring methods for RF transmitters and receivers
- GB/T 43027-2023Measuring methods of converter modules for high voltage input power supplies
- GB/T 36356-2018Technical specification for power light-emitting diode chips
- GB/T 36357-2018Technical specification for middle power light-emitting diode chips
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Related Standards
GB/T 4937.10-2025 — Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
GB/T 4937.11-2018 — Semiconductor devices -- Mechanical and climatic test methods -- Part 11: Rapid change of temperature -- Two-fluid-bath method
GB/T 4937.12-2018 — Semiconductor devices -- Mechanical and climatic test methods -- Part 12: Vibration, variable frequency
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