GB/T 36356-2018Technical specification for power light-emitting diode chips (English PDF)
功率半导体发光二极管芯片技术规范
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
June 7, 2018
Implementation date
January 1, 2019
Scope
GB/T 36356-2018 is the English-translated version of 功率半导体发光二极管芯片技术规范.
GB/T 36356-2018 is the technical specification for power semiconductor light-emitting diode chips. It sets the requirements for the chips, starting from general rules on how this standard relates to the detailed specification of each product, and then gives the inspection methods and inspection rules.
The document closes with packaging, transport and storage. Two normative annexes cover the visual inspection of power LED chips and the electrostatic discharge sensitivity classification and marking for the human body and machine models.
The tests draw on environmental and mechanical test methods such as alternating damp heat, steady-state acceleration, temperature change, die shear strength and bond strength.
Chip manufacturers and buyers use it to check products. It was issued on 7 June 2018 and has applied since 1 January 2019.
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Document preview — GB/T 36356-2018
National Standard of the People's Republic of China
- ICS
- 31.260
- Classification
- L 53
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Preface
- 1 Scope
- 2 Normative references
- 3 Request
- 4 Inspection Method
- 5 Inspection Rules
- 6 Packaging, Transport, and Storage
- Appendix A (Normative) Visual Inspection of Power Semiconductor Light-Emitting Diode Chips
- Appendix B (Normative) Electrostatic Discharge Sensitivity Classification and Marking for Human and Machine Modes
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
1 Scope
This standard specifies the technical requirements, test methods, and inspection rules for power semiconductor light-emitting diode chip products (hereinafter abbreviated as chips). Packaging, transportation and storage.
This standard applies to power semiconductor light-emitting diode chips.
2 Normative references
The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this document. For undated references, the latest version (including all amendments) applies to this document.
GB/T 2423.4-2008 Environmental testing for electric and electronic products Part 2. Test methods Test Db. Alternating heat (12h 12h loop)
GB/T 2423.15-2008 Environmental testing for electric and electronic products Part 2. Test methods Tests Ga and Guidelines. Steady state addition speed
GB/T 2423.22-2012 Environmental tests Part 2. Test methods Test N. Temperature changes
GB/T 4589.1-2006 Semiconductor Devices Part 10. General Specification for Discrete Devices and Integrated Circuits
GB/T 4937.1-2006 Semiconductor devices - Mechanical and climatic test methods - Part 1. General
SJ/T 11394-2009 Semiconductor light-emitting diode test method
SJ/T 11399-2009 Semiconductor light-emitting diode chip test method
IEC 60749 (All Sections) Semiconductor Device Mechanical and Climatic Test Methods (Semiconductordevices-Mechanical Andclimatictestmethods)
IEC 60749-19:2010 Semiconductors - Mechanical and climatic test methods - Part 19. Chip shear strength (Semicon-ductordevices-Mechanicalandclimatictestmethods-Part 19: Dieshearstrength)
IEC 60749-22:2002 Semiconductors - Mechanical and climatic test methods - Part 22. Bonding strength (SEMICONDUCTOR devices-Mechanicalandclimatictestmethods-Part 22: Bondstrength)
3 Requirements
3.1 General rules
3.1.1 Priority
The chip should meet the requirements of this standard and related detailed specifications. When the requirements of this standard are inconsistent with the relevant detailed specifications, relevant details Fine specifications prevail.
3.1.2 Reference to Detailed Specifications
When the term "as required" is used in this standard and the referenced document is not specified, the relevant detailed specifications are used.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
Referenced standards
Normative references
- GB/T 2423.4-2008Environmental testing for electric and electronic products - Part 2: Test method - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
- GB/T 2423.15-2008Environmental testing for electric and electronic products - Part 2: Test methods - Test Ga and guidance: Acceleration, steady
- GB/T 2423.22-2012Environmental testing - Part 2: Test methods - Test N: Change of temperature
- GB/T 4589.1-2006Semiconductor devices -- Part 10: Generic specification for discrete devices and integrated circuits
- GB/T 4937.1-2006Semiconductor devices -- Mechanical and climatic test methods -- Part 1: General
- SJ/T 11394-2009Measure methods of semiconductor light emitting diodes
IEC 60749 · IEC 60749-19:2010 · IEC 60749-22:2002
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Related Standards
GB/T 2423.15-2008 — Environmental testing for electric and electronic products - Part 2: Test methods - Test Ga and guidance: Acceleration, steady
GB/T 2423.22-2012 — Environmental testing - Part 2: Test methods - Test N: Change of temperature
GB/T 2423.4-2008 — Environmental testing for electric and electronic products - Part 2: Test method - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
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