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SJ/T 11399-2009Measurement methods for chips of light emitting diodes (English PDF)

半导体发光二极管芯片测试方法

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Issued by

Ministry of Industry and Information Technology

Level / Type

National · Recommended

Issue date

November 17, 2009

Implementation date

January 1, 2010

Scope

SJ/T 11399-2009 is the English-translated version of 半导体发光二极管芯片测试方法.

SJ/T 11399-2009 — This standard specifies the semiconductor light-emitting diode chip (hereinafter referred to as chips) of radiometry, photometry, colorimetry, electrical, thermal, parameters and electromagnetic compatibility testing methods. This standard applies to visible light semiconductor light-emitting diode chip.

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Document preview — SJ/T 11399-2009

National Standard of the People's Republic of China

ICS: 31.260
Classification: L 45

Issued by: Ministry of Industry and Information Technology

What this standard covers1
Document data2
Standards quoted by this document3

What this standard covers

This standard specifies the semiconductor light-emitting diode chip (hereinafter referred to as chips) of radiometry, photometry, colorimetry, electrical, thermal, parameters and electromagnetic compatibility testing methods. This standard applies to visible light semiconductor light-emitting diode chip. Ultraviolet and infrared light emitting diode chip and wafer reference tests performed.

Document data

International classification (ICS): 31.260.

Chinese classification (CCS): L45.

Estimated length of the Chinese original: 12,139 words.

Standards quoted by this document

GB/T 5698-2001; GB/T 11499-2001; GB/T 15651-1995; SJ/T 11394-2009

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 8 pages — is available in the English PDF.

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