GB/T 14844-2018Designations of semiconductor materials (English PDF)
半导体材料牌号表示方法
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Issued by
State Administration for Market Regulation; Standardization Administration of China
Level / Type
National · Recommended
Issue date
December 28, 2018
Implementation date
November 1, 2019
Scope
GB/T 14844-2018 is the English-translated version of 半导体材料牌号表示方法.
GB/T 14844-2018 is the Chinese national standard on designations of semiconductor materials, in the field of electrical engineering. The /T suffix marks it as a recommended standard: it is not compulsory by itself, but it becomes binding as soon as a contract, a tender or a customer specification calls it up - which in practice is how most foreign buyers meet it. It was issued on 28 December 2018 by the State Administration for Market Regulation; Standardization Administration of China, and has been in force since 1 November 2019. Classification: ICS 29.045, CCS H80. This page is published from the official record of the standard held by the Chinese standards administration: the identification, the dates, the classification and the issuing body are taken from there. The clause text, the tables and the numeric limits are in the document itself, which is delivered complete in English translation.
Document preview — GB/T 14844-2018
National Standard of the People's Republic of China
- ICS
- 29.045
- Classification
- H80
Issued by: State Administration for Market Regulation; Standardization Administration of China
Contents
- 1 Scope
- 2 Brand classification
- 3 Brand representation
- 3.1 Polycrystalline brand
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard replaces GB/T 14844-1993 "Semiconductor material grade indication method", compared with GB/T 14844-1993 main technology The changes are as follows:
--- Revised the description of the applicability of this standard in the scope (see Chapter 1, Chapter 1 of the.1993 edition);
--- Divide the production method and use of the original
3.1.1 into two, and adjust the order of the brand representation method. The name is the first item. The production method is the second item (see 3.1.1,.1993 edition 3.1);
--- Removed the "casting method" in the polycrystalline production method, adding "T for trichlorosilane method", "S for silane method", "F fluidized bed" "" and "other forms of production methods are referred to the above methods" (see 3.1.3,
3.1.1 of the.1993 edition);
--- Modified "N for block" to "C for block" and added "G for granular" and "Other polymorphic shape representations" Refer to the above method" (see 3.1.4,
3.1.3 of the.1993 edition);
--- Added "E for electronic grade use" and "S for solar grade use" (see 3.1.6);
--- Adjusted the ordering of single-crystal grade representations (see 3.2.1,
3.2 of the.1993 edition);
--- Added examples such as silicon single crystal Si, gallium arsenide single crystal GaAs, silicon carbide single crystal SiC, germanium single crystal Ge, indium telluride single crystal InSb, phosphorus Gallium single crystal GaP and indium phosphide single crystal InP, etc." (see 3.2.2);
--- Added "C for ingot casting method" (see 3.2.3);
--- Added conductivity type example "For example, N-type conductivity type doping elements are phosphorus P, Sb, arsenic As, P-type conductivity type doping elements It is known as boron B, and the region is melted by gas phase doping with FGD (see 3.2.4);
1 Scope
GB/T 14844-2018 is the Chinese national standard on designations of semiconductor materials, in the field of electrical engineering. The /T suffix marks it as a recommended standard: it is not compulsory by itself, but it becomes binding as soon as a contract, a tender or a customer specification calls it up - which in practice is how most foreign buyers meet it. It was issued on 28 December 2018 by the State Administration for Market Regulation; Standardization Administration of China, and has been in force since 1 November 2019. Classification: ICS 29.045, CCS H80. This page is published from the official record of the standard held by the Chinese standards administration: the identification, the dates, the classification and the issuing body are taken from there. The clause text, the tables and the numeric limits are in the document itself, which is delivered complete in English translation.
This standard specifies the brand representation of semiconductor polycrystalline, single crystal, wafer, epitaxial wafers and other products. This standard applies to the grades of semiconductor polycrystalline, single crystal, wafer, epitaxial wafers, etc., other semiconductor material grades can refer to carried out.
2 Brand classification
According to the crystal structure and product shape, the semiconductor material grades are divided into four types. polycrystalline, single crystal, wafer and epitaxial wafer. See Appendix A for the meaning.
3.1 Polycrystalline brand
3.1.1 Polycrystalline grades are expressed as. P - among them. 1, 2, 3, 4, and 5 represent the first to fifth items of the brand, respectively.
3.1.2 The first P in the first term of the grade indicates polycrystalline, and the latter digits represent the polycrystalline name by molecular formula, such as silicon Si, Ge, and the like.
3.1.3 The second term of the grade indicates the production method of polycrystal, expressed in capitalized form of the first letter of English, where.
a) T represents the trichlorosilane method;
b) S represents a silane method;
c) R represents a reduction method;
d) Z represents the zone melting method;
e) F represents the fluidized bed method;
f) Other production method representations are carried out with reference to the above methods.
3.1.4 The third term of the grade indicates the shape of the polycrystal, represented by the capital letter of the first letter of the English, where.
a) I indicates a rod shape;
b) C means blocky;
c) G means granular;
d) Other polymorphic shape representations are made with reference to the above methods.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 17 pages — is available in the English PDF.
Referenced standards
Cited by
- GB/T 35305-2026Gallium arsenide monocrystals and polished wafers for solar cells
- GB/T 30856-2025GaAs substrates for LED epitaxial chips
- GB/T 35307-2023Granular polysilicon produced by the fluidized bed method
- GB/T 11094-2020Gallium arsenide single crystal and cutting wafer grown by horizontal bridgman method
- GB/T 12964-2018Monocrystalline silicon polished wafers
- GB/T 12965-2018Monocrystalline silicon as cut wafers and lapped wafers
Similar standards
Editions of GB/T 14844
| Edition | Title | Revision | Status |
|---|---|---|---|
| GB/T 14844-2018 | Designations of semiconductor materials | current edition | Current |
| GB/T 14844-1993 | of semiconductor materials | previous edition | Superseded |
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