GB/T 14594-2014Oxygen-free copper sheets and strips for vacuum electron devices (English PDF)

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules.

This standard replaces GB/T 14594-2005 "oxygen-free copper plate and strip." This standard and GB/T 14594-2005 compared to the main changes as follows.

--- Standard name from the "oxygen-free copper plate and strip" with "power vacuum devices with oxygen-free copper plate and strip";

--- Grades increased TU00, delete TU2, later revised to TU00, TU0, TU1;

--- Increased with the grade corresponding to the code;

--- State of press plate and strip GB/T 29094-2012 "copper and copper alloy state representation" requirement has been amended accordingly;

--- Sheet length capped by "2500mm" adjusted "3000mm";

--- Strip thickness capped by "4.0mm" adjusted "6.0mm";

--- On the part of the thickness of the tranches have been adjusted;

--- Thickness tolerance has been modified to increase the width of 300mm ~ 1000mm corresponding provisions of the strip thickness tolerance of;

--- On the plate width tolerance has been modified;

--- Strip width tolerances specified increase high-precision, adding " > 2.5mm ~ 3.0mm" thick strip width tolerance provision;

--- Oxygen content of metallographic examination "should be consistent with the provisions of YS/T 335 is" to "meet the YS/T 335 standard image 1 ~ 3 together grid";

--- Increasing the hydrogen embrittlement test requirements and relevant regulations;

--- Increasing the chemical analysis method YS/T 482 "Copper and copper alloys photoemission spectroscopy analysis method";

--- Added "plate and strip dimensions measuring method according to the provisions of GB/T 26303.3 carried out" requirement;

--- Bulk of the group has been modified;

--- Test Sample No. according to GB/T 228.1 regulations were modified;

--- Added "sampling method prescribed YS/T 668 were prepared by the mechanical and technological properties of the sample by YS/T 815's Provisions "requirement.

1 Scope

This standard specifies the requirements, test methods, inspection rules oxygen-free copper plate and strip, signs, packaging, transportation, storage, quality certificate and Order Manifest (or contract) and so on.

This standard applies to the industrial sector for electronic vacuum devices with oxygen-free copper plate, strip.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document.

RT Test Method. Test Part 1 GB/T 228.1-2010 metal material tensile

GB/T 232 metallic materials - Bend test

GB/T 351 metal material resistivity measurement method

GB/T 4340.1 metallic materials - Vickers hardness test - Part 1: Test methods

GB/T 5121 (all parts) of copper and copper alloys -

GB/T 5231 and processing of copper and copper alloy grades and chemical composition

GB/T 8888 heavy non-ferrous metal processing products, packaging, labeling, transportation and storage

GB/T 23606 copper embrittlement test methods

GB/T 26303.3 copper and copper alloy processing material Dimensions detection methods - Part 3: plate and strip

YS/T 335-2009 metallographic test method oxygen free copper

YS/T 347 copper and copper alloys average grain size measurement method

YS/T 478 copper and copper alloy conductivity eddy current testing method

YS/T 482 copper and copper alloy analysis photoemission spectroscopy

YS/T 668 copper and copper alloy physical and chemical detection sampling method

YS/T 815 methods for preparing copper and copper alloy mechanical and technological properties of the sample

3 Requirements