GB/T 31985-2015Tin-coated copper ribbon for photovoltaic application (English PDF)
光伏涂锡焊带
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Issued by
General Administration of Quality Supervision, Inspection and Quarantine; Standardization Administration of the PRC
Level / Type
National · Recommended
Issue date
September 11, 2015
Implementation date
May 1, 2016
Scope
GB/T 31985-2015 is the English-translated version of 光伏涂锡焊带.
China's national product standard for the tin-coated copper ribbon used in photovoltaic modules. It specifies the terms and symbols, the requirements, the test methods, the inspection rules and the marking, packaging, transport and storage, and it applies to the soldering ribbon used in terrestrial crystalline silicon photovoltaic modules. The ribbon is the conductor that carries the current out of a solar cell. A flat copper strip, coated with a tin-based solder alloy, is soldered along the busbars on the front of one cell and onto the back of the next, connecting the cells into a string and the strings into a module. It is a component of very few parts and enormous consequence, because every one of the module's electrical joints is made with it and every one of those joints has to survive twenty-five years of daily thermal cycling under glass. Two properties dominate. The first is the copper's softness: the ribbon must yield readily, because a silicon cell is a brittle wafer under 200 micrometres thick and a ribbon stiffer than the cell will crack it as the laminate expands and contracts. That is why the standard specifies elongation and tensile strength as tightly as it specifies resistivity, and why fully annealed copper is used. The second is the solder coating: its alloy, its thickness and its uniformity determine whether the joint wets properly at the soldering temperature and how it ages, and a coating that is uneven produces cold joints that pass the factory test and fail years later as a hot spot. Issued on 11 September 2015 and in force since 1 May 2016.
Document preview — GB/T 31985-2015
National Standard of the People's Republic of China
- ICS
- 31.030
- Classification
- L 90
Issued by: General Administration of Quality Supervision, Inspection and Quarantine; Standardization Administration of the PRC
Contents
- 1 Scope1
- 2 Normative references1
- 3 Terms and Symbols1
- 3.1 Terms1
- 2 Products labeled 3 4 5 requires3
- 5.1 Appearance3
- 5.2 coating thickness3
- 5.6 Mechanical Properties of3
- 5.7 Electrical Properties4
- 5.8 corrosion resistance4
- 5.9 aging resistance4
- 5.10 weldability4
- 6 Test Method4
- 6.1 Test Environment4
- 6.2 Visual inspection 45
- 5 Scoliosis measuring 6.55
- 6.6 Analysis of chemical constituents6
- 6.7 Mechanical Properties Test6
- 6.8 Electrical Performance Test6
- 6.9 Corrosion Resistance Test7
- 6.10 aging resistance test7
- 6.11 solderability test8
- 7.2 Inspection classification8
- 7.3 Batch9
- 7.4 Type inspection9
- 7.5 factory inspection 10 8 signs, packaging, transportation and storage10
- 8.1 Marking10
- 8.2 Packaging11
- 8.3 Transport11
- 8.4 Storage11
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules. Please note that some of the content of this document may involve patents. Release mechanism of the present document does not assume responsibility for the identification of these patents. The standard equipment by the National Standardization Technical Committee and the semiconductor material (SAC/TC203) and focal points. This standard was drafted. Jiangsu Sun Group Co., Ltd., Wuxi City Brunswick Technology Co., Ltd., Jiangyin Yan billion New Materials Co., Suzhou-State New Materials Co., National Solar PV Product Quality Supervision and Inspection Center, Three Little Kunming Technology Co., Ltd., Suzhou Calendar New Material Technology Co., Ltd., Jiangsu Wei Electrical Technology Co., Ltd. Jiang Yin Aikang PV ribbon, Suntech Power Co., Ltd., China Electronics Standardization Institute. The main drafters of this standard. wide process, cold pine, Wu Jianguo, Bao Jun, monogenic Yan, Wang Wei, Pei Xuefeng, with Dong Bao, Xiao Feng, Liu Yazhou, Hu Yunzong square veneration, strong history, Zhu Jingbing Indian ice Fengya Bin. PV Tin coated copper ribbon
1 Scope
China's national product standard for the tin-coated copper ribbon used in photovoltaic modules. It specifies the terms and symbols, the requirements, the test methods, the inspection rules and the marking, packaging, transport and storage, and it applies to the soldering ribbon used in terrestrial crystalline silicon photovoltaic modules. The ribbon is the conductor that carries the current out of a solar cell. A flat copper strip, coated with a tin-based solder alloy, is soldered along the busbars on the front of one cell and onto the back of the next, connecting the cells into a string and the strings into a module. It is a component of very few parts and enormous consequence, because every one of the module's electrical joints is made with it and every one of those joints has to survive twenty-five years of daily thermal cycling under glass. Two properties dominate. The first is the copper's softness: the ribbon must yield readily, because a silicon cell is a brittle wafer under 200 micrometres thick and a ribbon stiffer than the cell will crack it as the laminate expands and contracts. That is why the standard specifies elongation and tensile strength as tightly as it specifies resistivity, and why fully annealed copper is used. The second is the solder coating: its alloy, its thickness and its uniformity determine whether the joint wets properly at the soldering temperature and how it ages, and a coating that is uneven produces cold joints that pass the factory test and fail years later as a hot spot. Issued on 11 September 2015 and in force since 1 May 2016.
This standard specifies the terms and symbols PV modules coated with solder, requirements, test methods, inspection rules, marking, packaging, transport and Storage. This standard applies to ground crystalline silicon photovoltaic module with a solder-coated tape.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. RT Test Method. Test Part 1
GB/T 228.1 metallic materials tensile
GB/T 1216 outside micrometer
GB/T 2828.1 Sampling procedures for inspection - Part 1. batch inspection sampling plan by acceptance quality (AQL) retrieval
GB/T 3048.2 wire and cable electrical performance test methods - Part 2. Metal resistivity test
GB/T 5121 copper and copper alloy chemical analysis method (all parts)
GB/T 5231 and processing of copper and copper alloy grades and chemical composition
GB/T 6461 on the metal base metals and other inorganic coatings by etching after the test specimens and ratings
GB/T 6462 and the metal oxide coating layer thickness measurement microscope method
GB/T 8012 casting Xiqianhanliao GB/T 9056 metal ruler
GB/T 10125 artificial atmosphere corrosion test salt spray test GB/T 10574.1 ~
GB/T 10574.13 chemical analysis of tin Method
GB/T 14594 oxygen-free copper plate and strip
GB/T 16921 Metallic coatings - Measurement of coating thickness X-ray spectroscopy
3 Terms and symbols
3.1 Terms The following terms and definitions apply to this document.
3.1.1 Tin coated with tin-coatedcopperribbon In certain size copper tape coated with a tin-based solder certain thickness to form a composite conductive material.
3.1.2 Interconnection with interconnectingribbon Interconnect Article For connecting the photovoltaic cells to collect, transport current photovoltaic cells is coated with a tin solder.
5 Scoliosis measuring 6.5
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
Referenced standards
Normative references
- GB/T 228.1Metallic Materials — Tensile Testing — Part 1: Method of Test at Room Temperature
- GB/T 1216External micrometer
- GB/T 2828.1Sampling procedures for inspection by attributes - Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection
- GB/T 5231Designation and chemical composition of wrought copper and copper alloys
- GB/T 9056Metal ruler
- GB/T 10574.1Methods for chemical analysis of tin-lead solders--Determination of tin content
GB/T 3048.2 · GB/T 5121 · GB/T 6461 · GB/T 6462 · GB/T 8012 · GB/T 10125 · GB/T 16921
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Related Standards
GB/T 10574.1-2003 — Methods for chemical analysis of tin-lead solders--Determination of tin content
GB/T 10574.10-2017 — Methods for chemical analysis of tin-lead solders - Part 10: Determination of cadmium content - Flame atomic absorption spectrometry and Na2EDTA titration method
GB/T 10574.11-2017 — Methods for chemical analysis of tin-lead solders - Part 11: Determination of phosphorus content - Crystal violet phosphorus-vanadium-molybdeum heteropoly acid spectrophotometry
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