GB/T 14112-2015Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP (English PDF)

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules.

This standard replaces GB/T 14112-1993 "Plastic Dual semiconductor integrated circuit package stamped leadframe norms." This standard and GB/T 14112-1993 compared to the main changes are as follows.

--- About Normative references. increase the introductory phrase; sampling standards set by GB/T 2828.1-2012 instead of IEC 410; increase the reference Document GB/T 2423.60-2008, SJ20129;

--- Increasing the terms and definitions, and an increase in the nominal length, refined nip coplanarity, chip bonding subsidence zone definition;

--- Standard "4.2 leadframe shape and position tolerances", increasing the flatness of the die attach area leadframe internal position tolerances Relevant requirements;

--- Revised standard for "scoliosis" requirements (see 4.2.1). the original standard only defines scoliosis less than 0.05mm/150mm, this standard Quasi predetermined nominal over the entire length;

--- Revised standard on the "curl" requirements (see 4.2.2). the original standard specifies only texturized less than 0.5mm/150mm, According to the provisions of this standard material thickness;

--- Revised standard on the "strip twisted" requirements (see 4.2.4). the original standard only provides a framework for distortion of less than 0.5mm, the present standard Brigadier framework modified to strip twisted twist, and according to a predetermined thickness of the material;

--- Revised standard on the "twisted wire" requirements (see 4.2.5). the original standard specifies the lead angle and twisted inner lead ends Point of maximum distortion value, this standard removed within the specified maximum distortion leads endpoint values;

--- Revised standard on the "depth coined" requirements (see 4.2.6). In the original standard, based on the increase of the maximum depth and the coining Small lead spacing requirements;

--- Revised standard on the "insulating gap" requirements (see 4.2.7). insulation gap original standard is 0.15mm, this standard Revised to 0.1mm;

--- Revised standard on the "fine nip coplanarity" requirements (see 4.2.8). the original standards set forth in the leadframe strip wide 50.8mm, coining region coplanarity of ± 0.25mm, this revised standard is ± 0.2mm;

--- Revised standard on the "die attach area slope" requirements (see 4.2.9). the original standard were provided for pressure and non-pressure situation Under the slope of the standard uniform provisions for the maximum inclination in the length or width of each size 2.54mm 0.05mm;

--- Of the standard "4.3 leadframe appearance" in the corresponding provisions have been adjusted, the original appearance of the standard required by the lead frame "feature Area, other areas "represent; This standard" glitches, pits, dents and scratches "are described, and the original standard" scratch "in Requires appropriate tightening, that is, in any area, "scratch" shall not be more than one;

--- Revised standard on the "silver local" requirements (see 4.4.1.2). the original standards set forth in silver layer thickness not less than 3.5µm (flat Mean), this revised standard is not less than 3µm;

--- Revised standard on the "appearance of the coating" requirements (see 4.4.2). In the original standard, based on the appearance of the coating increases the relevance Claim;

--- Added "copper peel test," the relevant requirements (see 4.6);

--- Added "Silver peeling test" the relevant requirements (see 4.7);

--- Revised standard on the "inspection requirements" requirements. Modify the original standard A1a, A1b, A2 packet detection level and AQL, And A1a, A1b, B2a, B2b packet merge; the original standard group B LTPD sampling plans, this standard will B1, B2, B3 revised to AQL sampling plan, and increased C3, C4 sampling inspection requirements;

--- Amend the relevant requirements of the standard for "storage". the original standard silver-plated lead frame storage period of three months, the provisions of this standard is 6 Month (see 7.2).

1 Scope

This standard specifies the semiconductor integrated circuit packaging plastic dual punching type lead frame (hereinafter referred to as the lead frame) of technical requirements and inspection Inspection rules.

This standard applies to double row (DIP) type lead frame punching. Single stamped leadframe may also refer to use.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version applies to this document. For undated references, the latest edition (including any amendments) applies to this document.

GB/T 2423.60-2008 Environmental testing for electric and electronic products Part 2: Test methods - Test U. Robustness of terminations and integral security Attachments strength

GB/T 2828.1-2012 Sampling procedures for inspection - Part 1. by acceptance quality limit (AQL) retrieval batch test sample plan

GB/T 7092 semiconductor integrated circuit Dimensions

GB/T 14113 semiconductor integrated circuit package terminology

SJ 20129 metal plating layer thickness measurement method

3 Terms and Definitions

GB/T 14113 and as defined in the following terms and definitions apply to this document.

4 Technical Requirements