GB/T 14113-1993Terminology of packages for semiconductor inte-grated circuits (English PDF)
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Issued by
State Bureau of Technical Supervision
Level / Type
National · Recommended
Issue date
January 21, 1993
Implementation date
August 1, 1993
Scope
GB/T 14113-1993 (Terminology of packages for semiconductor inte-grated circuits) is available as an English-translated PDF.
GB/T 14113-1993 — Terminology of packages for semiconductor inte-grated circuits
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Document preview — GB/T 14113-1993
National Standard of the People's Republic of China
- ICS
- 31.2
- Classification
- L 56
Issued by: State Bureau of Technical Supervision
Contents
- What this standard covers1
- Document data2
- Standards quoted by this document3
What this standard covers
This standard specifies the basic terms in the semiconductor integrated circuit packaging manufacturing, engineering and product inspection and other aspects of use. This standard applies to the production, research, teaching, and trade and other aspects of the application associated with the semiconductor integrated circuit package.
Document data
International classification (ICS): 31.2.
Chinese classification (CCS): L56.
Estimated length of the Chinese original: 14,136 words.
Standards quoted by this document
GB 9178
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 9 pages — is available in the English PDF.
Referenced standards
Cited by
- GB/T 46280.1-2025Specification for chiplet interconnection interface — Part 1: General principles
- GB/T 43863-2024Format for LSI - Package - Board interoperable design
- GB/T 36479-2018Integrated circuits—Test methods for column grid array
- GB/T 36636-2018Identification cards - Specification for dual-interface integrated circuit card modules
- GB/T 14112-2015Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP
- GB/T 15876-2015Semiconductor integrated circuits - Specification of leadframes for plastic quad flat package
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