GB/T 36479-2018Integrated circuits—Test methods for column grid array (English PDF)
集成电路 焊柱阵列试验方法
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
June 7, 2018
Implementation date
January 1, 2019
Scope
GB/T 36479-2018 is the English-translated version of 集成电路 焊柱阵列试验方法.
GB/T 36479-2018 gives the test methods for integrated circuits in column grid array (CGA) packages. The solder columns covered include high-lead columns, micro-coil columns, copper-tape wound columns, substrate-enhanced columns and copper-plated columns.
General requirements deal with sample processing, device orientation, the test environment and test results, while the detailed methods cover column array coplanarity, column position, solderability of the columns, pull-off, solder shear and column fatigue.
Terms such as datum plane, coplanarity deviation, position tolerance, pull force and clamping fixture are defined, and the standard refers to GB/T 9178, GB/T 14113 and GJB 548B-2005. It was issued on 7 June 2018 and has applied since 1 January 2019.
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Document preview — GB/T 36479-2018
National Standard of the People's Republic of China
- ICS
- 31.200
- Classification
- L 55
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Preface
- 1 Scope
- 2 Normative references
- 3 Terms and Definitions
- 4 General requirements
- 4.1 General Rule
- 4.2 Sample Processing
- 4.3 Device Orientation
- 4.4 Test Environment
- 4.5 Test result
- 5 Detailed Request
- 5.1 Welded pillar array coplanarity
- 5.2 Solder column array position
- 5.3 Weldability of Solder Post
- 5.4 Pullout
- 5.5 Welding shear
- 5.6 Post fatigue
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
1 Scope
This standard specifies the test method for the welding column array (CGA).
This standard applies to integrated circuits (hereinafter referred to as devices) in the form of a CGA package. Solder posts include high-lead solder posts and micro Coil welding column, copper tape wound type, substrate-enhanced welding column, copper-plated welding column, etc.
2 Normative references
The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this document. For undated references, the latest version (including all amendments) applies to this document.
GB/T 9178 Integrated Circuit Terminology
GB/T 14113 Semiconductor Integrated Circuit Package Terminology
GJB548B-2005 Microelectronic Device Test Methods and Procedures
3 Terms and Definitions
The definitions of GB/T 9178, GB/T 14113 and the following terms and definitions apply to this document.
3.1 Welding column array; CGA
A slender pin is used as an external pin and is soldered to the substrate/ceramic pad in a longitudinal and horizontal manner at a certain pitch to realize the next level of the device The physical connection (including electrical connections) to the printed circuit board (PCB) when assembled.
3.2 Datum plane
The plane formed by the apexes of the three welding pillars, the three welding pillars have the largest vertical distance from the top surface of the pillar, and the three vertices form three The angular projection contains the device's center of gravity.
3.3 Coplanarity
The difference between the highest apex of the weld and the lowest apex of the weld.
3.4 Location degree
In the centrally symmetrical region of the theoretical position of the device's welding column, the center point of the welding column allows a different amount of change from the center of the theoretical position.
3.5 Pull force
Applied to the force of the solder column that is axially perpendicular to the plane of the device's implant and leaves it away from the plane.
3.6 Fixing fixture
The device holding the device fixed during the test.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 18 pages — is available in the English PDF.
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Related Standards
GB/T 14113-1993 — Terminology of packages for semiconductor inte-grated circuits
GB/T 14113-2026 — Terminology for packages of semiconductor integrated circuits
GB/T 9178-1988 — Terminology for integrated circuits
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