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GB/T 14113-2026Terminology for packages of semiconductor integrated circuits (English PDF)

半导体集成电路封装术语

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

September 28, 2026

Implementation date

April 1, 2027

Scope

GB/T 14113-2026 is the English-translated version of 半导体集成电路封装术语.

GB/T 14113-2026 is the Chinese standard "Terminology for packages of semiconductor integrated circuits". Issued on 2026-09-28, in force from 2027-04-01.

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Document preview — GB/T 14113-2026

Document data

1 Document data

Sector: National Recommended.

Standard type: recommended.

Date of issue: 2026-09-28.

Date of implementation: 2027-04-01.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.

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