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GB/T 47719-2026Micro-electromechanical systems (MEMS) technology - Test methods for the performance of MEMS capacitive microphones (English PDF)

微机电系统(MEMS)技术 MEMS电容式麦克风性能试验方法

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

May 25, 2026

Implementation date

September 1, 2026

Scope

GB/T 47719-2026 is the English-translated version of 微机电系统(MEMS)技术 MEMS电容式麦克风性能试验方法.

GB/T 47719-2026 describes the test conditions and test methods for the wafer-level and device-level performance of MEMS capacitive microphones used in air over the frequency range 20 Hz to 20 kHz.

It sets the default free-field measurement condition, the atmospheric conditions (15 °C to 35 °C, 20 % to 80 % relative humidity, 86 kPa to 106 kPa), freedom from external magnetic fields and vibration, and the test system: sound source, calibrated standard microphone, DC power supply, audio analyser, voltmeter and oscilloscope, each with its own accuracy requirements.

Test methods are given for microphone chips at wafer level and, for packaged microphones, for output impedance, sensitivity, noise floor, signal-to-noise ratio, acoustic overload point (the sound pressure level at which THD reaches 10 %), dynamic range, frequency response, polarity, equivalent input noise, total harmonic distortion and power supply rejection ratio.

It is a first edition, issued on 25 May 2026 and in force since 1 September 2026. Classification: ICS 31.200, CCS L 59. The document runs to 15 pages, delivered complete in English translation.

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Document preview — GB/T 47719-2026

National Standard of the People's Republic of China

ICS
31.200
Classification
L 59

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Contents

  • Foreword
  • 1 Scope
  • 2 Normative references
  • 3 Terms and definitions
  • 4 Test conditions
  • 5 Wafer-level performance test methods for microphone chips
  • 6 Performance test methods for microphones

3 Terms and definitions

4 Test conditions

5 Wafer-level performance test methods for microphone chips

6 Performance test methods for microphones

Foreword

This document is drafted in accordance with the rules given in GB/T 1.1-2020, Directives for standardization - Part 1: Rules for the structure and drafting of standardizing documents.

Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. The issuing body of this document shall not be held responsible for identifying any or all such patent rights.

This document was proposed by the National Technical Committee on Micro-electromechanical Technology of Standardization Administration of China (SAC/TC 336).

This document is under the joint jurisdiction of the National Technical Committee on Micro-electromechanical Technology of Standardization Administration of China (SAC/TC 336) and the National Technical Committee on Integrated Circuits of Standardization Administration of China (SAC/TC 599).

Drafting organisations of this document: Peking University, Beijing Zhixin Sensing Technology Co., Ltd., United Nova Technology Co., Ltd., Sinomach Productivity Promotion Center Co., Ltd., AAC Acoustic Technologies (Shenzhen) Co., Ltd., Goertek Microelectronics Inc., MEMSensing Microsystems (Suzhou) Co., Ltd., Tianjin Xinzhi Perception Technology Co., Ltd., Nanchang Innovation Institute of Peking University, North University of China, CSMC Technologies (Wuxi) Co., Ltd., Guangzhou Zengxin Technology Co., Ltd., China Aerospace Times Electronics Co., Ltd., Sai MicroElectronics Inc. (Beijing), Anhui Aofei Acoustics Technology Co., Ltd., China Resources Microelectronics (Wuxi) Co., Ltd., University of Science and Technology Beijing, Guangdong Dingchuang Intelligent Manufacturing Technology Co., Ltd., Hunan Jielitai Technology Co., Ltd., Anhui Jingxin Sensing Technology Co., Ltd., Dongguan Ruiqin Electronics Co., Ltd. and Gettop Acoustic Co., Ltd.

Main drafters of this document: Zhang Wei, Zhang Yating, Gu Xueqiang, Li Genzi, Zhang Jinyu, Song Qinglin, Li Gang, Cao Ji, Zhao Xiaodong, Feng Yanlu, Yang Ming, Chen Demin, Huang Tianyun, Shi Yunbo, Hu Yonggang, Peng Kun, Zhang Sen, Xing Chaoyang, Li Liwei, Wei Baojie, Jin Wenchao, Wen Xiaolong, Rong Genlan, Wang Na, Fang Liang, Zhou Yuandong, Yang Shuo and Wan Jingming.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.

Referenced standards

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