GB/T 6109.5-2025Enamelled round winding wire—Part 5:Polyesterimide enamelled round copper wire;class 180 (English PDF)

Foreword

GB/T 6109 "enamelled round winding wires" is divided into 22 parts.

--- Part 1: General requirements;

--- Part 2.155 polyester enamelled round copper wire;

--- Part 3.120 acetal enamelled round copper wire;

--- Part 4.130 solderable polyurethane enamelled round copper wire;

--- Part 5.180 polyester enamelled round copper wire;

--- Part 6.220 Polyimide enamelled round copper wire;

Part --- Article 7.130L grade polyester enamelled round copper wire;

--- Part 9.130 polyamide composite solderable polyurethane enamelled round copper wire;

--- Part 10.155 solderable polyurethane enamelled round copper wire;

--- Part 11.155 polyamide composite solderable polyurethane enamelled round copper wire;

--- Part 12.180 polyester or polyamide, polyester enamelled round copper wire;

--- Part 13.180 solderable polyester-imide enamelled round copper wire;

--- Part 14: Polyamide-imide 200 enamelled round copper wire;

--- Part 15.130 self-adhesive straight welding polyurethane enamelled round copper wire;

--- Part 16.155 self-adhesive straight welding polyurethane enamelled round copper wire;

--- Part 17.180 self-adhesive Solderable polyesterimide enamelled round copper wire;

--- Part 18.180 self-adhesive polyester enamelled round copper wire;

--- Part 19.200 self-adhesive polyester or polyester-polyamide-imide enamelled round copper wire;

--- Part 20.200 polyester or polyester-polyamide imide enamelled round copper wire;

--- Part 21.200 Polyester - amide - imide enamelled round copper wire;

--- Part 22.240 aromatic polyimide enamelled round copper wire;

--- Part 23.180 straight welding polyurethane enamelled round copper wire.

This is Part 5 GB/T 6109's. This section identical with IEC 60317-8:1997 "Standard winding wires products Part 8.180 polyester enamelled round copper wire "Version 3.2 (in English).

For ease of use, this section made the following editorial changes.

--- Deleted international standards foreword;

"." --- With a decimal point instead of a comma as the decimal point, "";

--- According to IEC 60317-0-1:2005 increase the appearance requirements;

--- IEC 60317-8:1997 Edition 2.2 in pilot projects related to anti-freeze agents editorial error, cancel the revision of the IEC 60317-8:1997 version of 16.1, 16.2 and 16.3 and footnotes provisions;

--- According to IEC 60317-0-1:2005 increases the pinhole pilot projects.

Since the implementation of this section instead of GB/T 6109.5-1988.

This section compared with the GB/T 6109.5-1988, the main changes are as follows.

--- Conductor nominal diameter range increased from 0.018mm ~ 2.500mm were adjusted to 0.020mm ~ 3.150mm (1), 0.020mm ~ 5.000mm (Level 2) and 0.250mm ~ 1.600mm (level 3);

--- Thermal shock test using a predetermined diameter rod from the original by conductor nominal diameter range binning nominal diameter of eleven conductors to press correspond;

GB/T 6109.5-2008/IEC 60317-8:1997

--- Modify the resistance of refrigerant test assessment requirements;

--- Increasing the pinhole pilot projects.

This part is proposed by the China Electrical Equipment Industrial Association.

This part of the National Standardization Technical Committee Wire and Cable (SAC/TC213) centralized.

This section is responsible for drafting unit. Shanghai Electric Cable Research Institute.

Participated in the drafting of this section. the first board Electrical Equipment Co., Ltd., fine Dart Magnet Wire Co., Ltd., Jiangsu Chase Electrical and Mechanical Co., Ltd. Rong Sheng AMD wire, Donggang Wire Factory, Wuxi tin Chau Electromagnetic Wire Factory.

1 Scope

GB/T 6109 This section provides a single paint polyester resin-based imide 180 enamelled round copper wire requirements. If possible Retain the chemical properties of the original resin and meet all the requirements specified in the wire, the resin may be modified.

NOTE. chemically-modified resin is a variation of, or contain one or more additives to improve certain properties of the resin or its usage characteristics.

180 represents the thermal level, which requires a minimum temperature index of 180, the thermal shock temperature of at least 200 °C.

Corresponding to the temperature index temperature in Celsius is not recommended wire temperature, because it depends on the type of equipment used include Many factors within.

Conductor nominal diameter range specified in this standard are.

--- Level 1.0.018mm and 3.150mm above and below;

--- Level 2.0.020mm and 5.000mm above and below;

--- Level 3.0.250mm and 1.600mm above and below.

Nominal press GB/T 6109.1-2008 prescribed in Chapter 4, the diameter of the conductor.

2 Normative references

The following documents contain provisions which, through reference to GB/T 6109 to the present, constitute provisions of this section. For dated reference documents Member, all subsequent amendments (not including errata content) or revisions do not apply to this section, however, encouraged to reach under this section Parties to research agreement to use the latest versions of these documents. For undated reference documents, the latest versions apply to this section.

Part 1 GB/T 6109.1-2008 enamelled round winding wire. General requirements (IEC 60317-0-1:2005, IDT)

3 Definitions, test methods and General Appearance

4 Dimensions

See GB/T 6109.1-2008 in Chapter 4.

5 Resistance

See GB/T 6109.1-2008 in Chapter 5.

6 Elongation

See GB/T 6109.1-2008 in Chapter 6.

GB/T 6109.5-2008/IEC 60317-8:1997

7 Resiliency

See GB/T 6109.1-2008 in Chapter 7.

8 Flexibility and adhesion

See GB/T 6109.1-2008 in Chapter 8, for calculating the number of revolutions of the peeling test with constant K should be 110mm.

9 Thermal Shock

See GB/T 6109.1-2008 in Chapter 9, the minimum thermal shock temperature should be 200 °C.

10 Softening

At a temperature of 300 °C should be no breakdown within 2min.

Enameled wire shall comply with the requirements in Table 1.

Table 1 scratch

Conductor nominal diameter/mm Level 1 2 3 Minimum average Scratch force/N for each test Minimum scratch force/N Minimum average Scratch force/N for each test Minimum scratch force/N Minimum average Scratch force/N for each test Minimum scratch force/N 0.250 0.280 0.315 0.355 0.400 0.450 0.500 0.560 0.630 0.710 0.800 0.900 1.000 1.120 1.250 1.400 1.600 1.800 2.000 2.240 2.500 2.85 3.10 3.35 3.60 3.85 4.15 4.45 4.75 5.10 5.45 5.85 6.30 6.75 7.35 7.90 8.50 9.20 9.95 10.6 11.7 12.8 2.45 2.60 2.80 3.05 3.25 3.50 3.75 4.05 4.35 4.65 4.95 5.35 5.75 6.20 6.70 7.20 7.80 8.40 9.00 9.90 10.8 4.70 5.05 5.45 5.85 6.25 6.75 7.20 7.70 8.25 8.85 9.50 10.2 10.9 11.6 12.5 13.3 14.3 15.4 16.4 17.5 18.6 4.00 4.30 4.60 4.95 5.30 5.70 6.10 6.50 7.00 7.50 8.05 8.60 9.20 9.80 10.5 11.3 12.1 13.0 13.9 14.8 15.8 5.80 6.25 6.70 7.20 7.70 8.25 8.85 9.50 10.2 10.9 11.7 12.5 13.3 14.2 15.2 16.4 17.6 4.90 5.30 5.70 6.10 6.50 7.00 7.50 8.05 8.65 9.25 9.90 10.6 11.3 12.0 12.9 13.9 14.9 Note. For a nominal conductor diameter of intermediate size, remove a larger conductor diameter corresponding to the nominal value.

GB/T 6109.5-2008/IEC 60317-8:1997

12 Solvent

See GB/T 6109.1-2008 in Chapter 12, but the pencil hardness shall not vary by more than three.

13 Breakdown Voltage

See GB/T 6109.1-2008 in Chapter 13, the high temperature test temperature should be 180 °C.

14 Film continuity

See GB/T 6109.1-2008 in Chapter 14.

15 Temperature index

See GB/T 6109.1-2008 in Chapter 15, the minimum temperature index of 180 should be.

16 Anti-freezing agent

Percentage extract should not exceed 0.5%. The minimum breakdown voltage shall be 75% of the specified values.

17 Solderable

Not applicable.

18 Thermal bonding

Not applicable.

19 Dielectric loss factor

Not applicable.

20 Transformer oil resistant

But does not apply to specified performance requirements.

21 Weight loss

Not applicable.

23 Pinhole test

Under consideration.

30 Packaging

See GB/T 6109.1-2008 in Chapter 30.

GB/T 6109.5-2008/IEC 60317-8:1997 ......