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GB/T 6109.1-2025Enamelled round winding wire - Part 1: General requirements (English PDF)

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Issued by

State Administration for Market Regulation

Level / Type

National · Recommended

Issue date

October 5, 2025

Implementation date

May 1, 2026

Scope

GB/T 6109.1-2025 (Enamelled round winding wire - Part 1: General requirements) is available as an English-translated PDF.

GB/T 6109.1-2025 — This document specifies the general requirements for self-adhesive or non-self-adhesive enameled round windings. For the nominal diameter range of the conductor, please refer to the relevant product standards.

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Document preview — GB/T 6109.1-2025

National Standard of the People's Republic of China

ICS
29.060.01
Classification
K 12
Replacing
GB/T 6109.1-2008

Issued by: State Administration for Market Regulation

Contents

  • Preface
  • Introduction
  • 1 Scope
  • 2 Normative References
  • 3 Terms, Definitions, General Rules, and Appearance
  • 3.1 Terms and Definitions
  • 3.2 General Rules
  • 3.3 Appearance
  • 4 Size
  • 4.1 Conductor diameter
  • 4.2 Conductor out-of-roundness (conductor nominal diameter >= 0.063mm)
  • 4.3 Minimum film thickness and minimum self-adhesive layer thickness (conductor nominal diameter >= 0.063mm)
  • 4.4 Maximum outer diameter
  • 5 Resistors
  • 6 Elongation
  • 7 Resilience
  • 7.1 Conductor nominal diameter of 0.080 mm and above to 1.600 mm and below
  • 7.2 Conductor nominal diameter 1.600mm or above
  • 8 Flexibility and adhesion
  • 8.1 Round bar winding test (conductor nominal diameter 1.600 mm and below)
  • 8.2 Tensile test (conductor nominal diameter >= 1.600 mm)
  • 8.3 Sudden Break Test (Conductor nominal diameter 1.000 mm and below)
  • 8.4 Peel test (conductor nominal diameter >= 1.000 mm)
  • 9 Thermal shock
  • 9.1 Conductors with a nominal diameter of 1.600 mm and below
  • 9.2 Conductors with a nominal diameter of 1.600 mm or more
  • 10 Softening and breakdown
  • 11 Scratch-resistant
  • 12 Solvent resistant
  • 13 Breakdown voltage
  • 13.1 General Rules
  • 13.2 Conductors with a nominal diameter of 0.100 mm and below
  • 13.3 Conductors with nominal diameters from 0.100 mm to 2.500 mm and below
  • 13.4 Conductors with a nominal diameter of 2.500 mm or more
  • 14 Coating film continuity (conductor nominal diameter 1.600mm and below) 15.
  • Temperature index 15
  • 16 Refrigerant
  • 17 Direct weldability
  • 18 Thermal bonding or solvent bonding 16.
  • 19 Dielectric loss coefficient
  • 20 Transformer oil resistant
  • 21 Weightlessness
  • 23 Pinhole Test
  • 30 Packaging
  • Appendix A (Informative) Intermediate Dimensions of Nominal Conductor Diameter (R40)
  • Appendix B (Normative) Calculation Method for Linear Resistance
  • B.1 For conductors with a nominal diameter of 0.071 mm and below,
  • B.2 For conductors with a nominal diameter of 0.071 mm or more but less than 0.280 mm,
  • Appendix C (Informative) Resistor
  • Appendix NA (Informative) Table 25.Model Numbers and Comparison of Enamelled Round Winding Wires
  • NA.1 Model Example Comparison Table
  • NA.2 Symbols and codes for enameled round windings
  • Appendix NB (Informative) Comparison of Test Methods and Test Item Categories for Enamelled Round Winding Wire

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents".

Drafting.

This document is Part 1 of GB/T 6109 "Enamelled Round Winding Wire". GB/T 6109 has already published the following parts.

---Part 1: General Provisions;

---Part 2: Grade 155 Polyester Enameled Copper Round Wire;

---Part 3: Grade 120 acetal enameled copper round wire;

---Part 4: Grade 130 direct-welding polyurethane enameled copper round wire;

---Part 5: Grade 180 Polyesterimide Enameled Copper Round Wire;

---Part 6: Grade 220 polyimide enameled copper round wire;

---Part 7.130L grade polyester enameled copper round wire;

---Part 9: Grade 130 Polyamide Composite Direct Soldering Polyurethane Enameled Copper Round Wire;

---Part 10: Grade 155 direct-welding polyurethane enameled copper round wire;

---Part 11: Grade 155 Polyamide Composite Direct Soldering Polyurethane Enameled Copper Round Wire;

---Part 12: Grade 180 polyamide composite polyester or polyesterimide enameled copper round wire;

---Part 13: Grade 180 direct-welding polyesterimide enameled copper round wire;

---Part 14: Grade.200 polyamide-imide enameled copper round wire;

---Part 15: Grade 130 self-adhesive direct-soldering polyurethane enameled copper round wire;

---Part 16: Grade 155 self-adhesive direct-soldering polyurethane enameled copper round wire;

---Part 17: Grade 180 self-adhesive direct-soldering polyesterimide enameled copper round wire;

---Part 18: Grade 180 self-adhesive polyesterimide enameled copper round wire;

---Part 19: Grade.200 self-adhesive polyamide-imide composite polyester or polyesterimide enameled copper round wire;

---Part 20: Grade.200 polyamide-imide composite polyester or polyesterimide enameled copper round wire;

---Part 21: Grade.200 Polyester-Amide-Imine Enameled Copper Round Wire;

---Part 22: Grade 240 Aromatic Polyimide Enameled Copper Round Wire;

---Part 23: Grade 180 direct-welding polyurethane enameled copper round wire.

This document supersedes GB/T 6109.1-2008 "Enamelled Round Winding Wire - Part 1: General Provisions" and is consistent with GB/T 6109.1-2008.

In comparison, aside from structural adjustments and editorial changes, the main technical changes are as follows.

---Added "Method for Representing Winding Wire Products" (see 3.2.2);

---Added a minimum coating thickness requirement for the "intermediate dimension of the conductor's nominal diameter" (see 4.3.3);

---Added the standard requirements for bare copper wire used in enameled windings in the "Resistance" section, along with reference resistance nominal values (see Chapter 5);

---Added a general rule on "breakdown voltage" (see 13.1);

---Added minimum breakdown voltage values at room temperature for conductors with nominal diameter (R40) of 0.100 mm and below (see Table 9);

---The requirements for the test environment in the "Test Methods" section have been revised (see 3.2.1, 3.2 in the 2008 edition);

---The magnification requirement for the magnifying glass in "Appearance" has been changed (see 3.3, 2008 version 3.3);

---Changed the minimum enamel thickness for both non-self-adhesive enameled wire size (R20) and self-adhesive enameled wire size (R20) in "Conductor Diameter".

Maximum outer diameter requirements (see 4.1, Table 1, 2008 edition);

---The range of applicable conductor nominal diameters for "Resistors" has been changed (see Chapter 5, Chapter 5 of the 2008 edition);

---The specified value for "elongation" has been changed (see Chapter 6, Chapter 6 of the 2008 edition);

---The regulation on "breakdown voltage of conductors with nominal diameter of 0.100mm and below" has been revised, now divided into conductor nominal diameter (R20) and conductor standard...

The intermediate dimension of the diameter (R40) is referred to as 13.2, 13.1 in the 2008 edition;

---The regulation regarding "breakdown voltage of conductors with nominal diameters of 0.100mm and above to 2.500mm and below" has been revised, now divided into conductor nominal diameters...

The intermediate dimension between the diameter (R20) and the nominal conductor diameter (R40) (see 13.3, 13.2 of the 2008 edition);

---The minimum breakdown voltage at room temperature for conductors with nominal diameter (R20) of 0.100 mm and below in Table 8 has been revised (see Table 8, 2008).

Table 8 of the version);

---The maximum number of pinholes per 30m in "Table 13 Coating Film Continuity" has been changed (see Table 13, Table 11 in the 2008 edition);

---The sample requirements for the "temperature index" have been changed (see Chapter 15, Chapter 15 of the 2008 edition);

---The technical requirements for the "pinhole test" have been changed (see Chapter 23, Chapter 23 of the 2008 edition);

---The range of nominal conductor diameters and resistance ratios specified in the calculation method for linear resistance in Normative Appendix B have been revised (see Appendix B,...).

Appendix B of the 2008 edition).

This document is equivalent to IEC 60317-0-1:2019 "Special winding wire product standard Part 0-1.General requirements enameled copper round wire".

The following minimal editorial changes have been made to this document.

---To harmonize with existing standards, the standard title has been changed to "Enameled Round Winding Wire Part 1: General Provisions";

---Move IEC 60317 (all parts) referenced in the definitions from the References section to Chapter 2;

---Informative appendices NA and NB have been added to facilitate reading and use of this document.

Please note that some content in this document may involve patents. The issuing organization of this document assumes no responsibility for identifying patents.

This document was proposed by the China Electrical Equipment Industry Association.

This document is under the jurisdiction of the National Technical Committee on Standardization of Wires and Cables (SAC/TC213).

Introduction

Enamelled round winding wire is a major supporting raw material in the fields of power, motors, electrical appliances, home appliances, electronics, communications, transportation, power grids, and aviation.

First, it has a wide range of applications and covers many fields, and has become an important mechanical industrial product.

GB/T 6109 "Enamelled Round Winding Wire" is an important basic standard for enamelled round winding wire products, and it is proposed to consist of the following 22 parts.

---Part 1: General Requirements. This section specifies the performance requirements for self-adhesive or non-self-adhesive enameled copper round windings.

---Part 2: Grade 155 Polyester Enameled Copper Round Wire. The purpose is to specify Grade 155 enameled copper wire with a single enamel layer based on polyester resin.

Performance requirements for circular wires.

---Part 3: Grade 120 Acetal Enameled Copper Round Wire. The purpose is to specify Grade 120 for single-layer enamel coatings based on polyvinyl acetal resin.

Performance requirements for enameled copper round wire.

---Part 4: Grade 130 direct-soldering polyurethane enameled copper round wire. The purpose is to specify Grade 130 single-layer polyurethane resin-based enamel coatings.

Performance requirements for direct-welded enameled copper round wire.

---Part 5: Grade 180 Polyesterimide Enameled Copper Round Wire. The purpose is to specify Grade 180 for single-layer polyesterimide enamel coatings.

Performance requirements for enameled copper round wire.

---Part 6: Grade 220 Polyimide Enameled Copper Round Wire. The purpose is to specify Grade 220 for single-layer polyimide enamel coatings.

Performance requirements for enameled copper round wire.

---Part 7.130L Grade Polyester Enameled Copper Round Wire. The purpose is to specify 130L grade enameled wire with a single enamel coating based on polyester resin.

Performance requirements for copper round wire.

---Part 9: Grade 130 Polyamide Composite Direct Soldering Polyurethane Enameled Copper Round Wire. The purpose is to specify the Grade 130 direct soldering enamel wire with a double-layer coating.

The performance requirements for copper-clad round wires include a primer layer based on polyurethane resin and a topcoat layer based on polyamide resin.

---Part 10: Grade 155 direct-soldering polyurethane enameled copper round wire. The purpose is to specify a single-layer enamel coating based on polyurethane resin.

Performance requirements for Grade 155 direct-welding enameled copper round wire.

---Part 11: Grade 155 Polyamide Composite Direct Soldering Polyurethane Enameled Copper Round Wire. The purpose is to specify the grade 155 direct soldering enamel wire with a double-layer coating.

The performance requirements for copper-clad round wires include a primer layer based on polyurethane resin and a topcoat layer based on polyamide resin.

---Part 12: Grade 180 polyamide composite polyester or polyesterimide enameled copper round wire. The purpose is to specify a Grade 180 enameled wire with double coatings.

The performance requirements for copper-clad round wires include a primer layer based on polyester or polyesterimide resin and a topcoat layer based on polyamide resin.

---Part 13: Grade 180 direct-soldering polyesterimide enameled copper round wire. The purpose is to specify a single-layer enamel coating based on polyesterimide resin.

Performance requirements for Grade 180 direct-welding enameled copper round wire.

---Part 14: Grade.200 polyamide-imide enameled copper round wire. The purpose is to specify single-component polyamide-imide resin-based...

Performance requirements for.200-grade enameled copper round wire.

---Part 15: Grade 130 Self-adhesive Direct Soldering Polyurethane Enamelled Copper Round Wire. The purpose is to specify Grade 130 self-adhesive direct soldering wire with double coating.

The performance requirements for enameled copper round wires include a primer layer based on polyurethane resin and a topcoat layer based on thermoplastic resin, which is a self-adhesive layer.

---Part 16: Grade 155 Self-Adhesive Straight Soldering Polyurethane Enameled Copper Round Wire. The purpose is to specify Grade 155 self-adhesive straight soldering wire with double coating.

The performance requirements for enameled copper round wires include a primer layer based on polyurethane resin and a topcoat layer based on thermoplastic resin, which is a self-adhesive layer.

---Part 17: Grade 180 Self-adhesive Straight Solderable Polyesterimide Enameled Copper Round Wire. The purpose is to specify Grade 180 self-adhesive straight solderable wire with double coating.

The performance requirements for soldering enameled copper round wires, wherein the primer layer is based on polyesterimide resin and the topcoat layer is based on thermoplastic resin.

Adhesive layer.

---Part 18: Grade 180 self-adhesive polyesterimide enameled copper round wire. The purpose is to specify the grade 180 self-adhesive enameled copper wire with double coating.

The performance requirements for round wires include a primer layer based on polyesterimide resin and a topcoat layer based on thermoplastic resin, which is a self-adhesive layer.

---Part 19: Grade.200 self-adhesive polyamide-imide composite polyester or polyesterimide enameled copper round wire. The purpose is to specify the three-layer coating.

The performance requirements for grade.200 enameled copper round wires include a primer layer based on polyester or polyesterimide resin, and an intermediate layer based on polyamide.

A self-adhesive layer with an imide resin base and a topcoat layer based on a thermoplastic or thermosetting resin.

---Part 20: Grade.200 polyamide-imide composite polyester or polyesterimide enameled copper round wire. The purpose is to specify double-layer enameling.

The performance requirements for Grade.200 enameled copper round wire include a primer layer based on polyester or polyesterimide resin, and a topcoat layer based on polyamide-imide resin.

It is based on amine resin.

---Part 21: Grade.200 Polyester-Amide-Imine Enameled Copper Round Wire. The purpose is to specify the type of polyester-amide-imide resin-based...

Performance requirements for a single-layer,.200-grade enameled copper round wire.

---Part 22: Grade 240 Aromatic Polyimide Enameled Copper Round Wire. The purpose is to specify single-component aromatic polyimide resin-based...

Performance requirements for 240-grade enameled copper round wire.

---Part 23: Grade 180 direct-soldering polyurethane enameled copper round wire. The purpose is to specify a single-layer enamel coating based on polyurethane resin.

Performance requirements for Grade 180 direct-welding enameled copper round wire.

This document is used in conjunction with IEC 60851 (all parts), and the chapter and clause numbers in this document correspond to the relevant test in IEC 60851 (all parts).

The serial numbers match.

Enameled round winding wire Part 1: General Provisions

1 Scope

This document specifies the general requirements for self-adhesive or non-self-adhesive enameled round windings.

For the nominal diameter range of the conductor, please refer to the relevant product standards.

2 Normative references

The contents of the following documents, through normative references within the text, constitute essential provisions of this document. Dated citations are not included.

For references to documents, only the version corresponding to that date applies to this document; for undated references, the latest version (including all amendments) applies.

This document.

Note. GB/T 321-2005 Preferred Numbers and Preferred Number Systems (ISO 3:1973, IDT) IEC 60172 Test procedure for determining the temperature index of enameled and film-wrapped wires.

Note. GB/T 4074.7-2024 Test methods for windings – Part 7: Test methods for determining the temperature index of enameled windings (IEC 60172.

2020, IDT)

IEC 60851 (All Parts) Winding Wire Test Methods Note. The degree of conformity between the relevant parts of GB/T 4074 and the various parts of IEC 60851 (all parts) is given in Appendix NB.

poses)

(wirerod)]

3 Terms, Definitions, General Rules and Appearance

3.1 Terms and Definitions

The following terms and definitions apply to this document.

3.1.1

self-adhesive bonding layer the material coated on the surface of enameled wire has a specific function of making the enameled wires stick together.

3.1.2

Hot class

Thermal properties of winding wire, expressed in terms of temperature index and thermal shock temperature.

3.1.3

Coating

The material is coated onto the conductor or insulation wire using an appropriate method, and then dried and/or cured.

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 29 pages — is available in the English PDF.

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