GB/T 42835-2023Semiconductor integrated circuits—System on chip(SoC) (English PDF)

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents" Drafting.

1 Scope

This document specifies the technical requirements, electrical test methods and inspection rules for systems on a chip (SoC).

This document applies to the design, manufacturing, procurement, and acceptance of system-on-chip (SoC).

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document.

GB/T 191 Packaging, storage and transportation pictorial mark

GB/T 4937.3 Mechanical and climatic test methods for semiconductor devices Part 3: External visual inspection

GB/T 4937.4 Mechanical and climatic test methods for semiconductor devices Part 4: Highly accelerated steady-state hot and humid test (HAST)

GB/T 4937.11 Mechanical and climatic test methods for semiconductor devices Part 11: Rapid temperature change double liquid tank method

GB/T 4937.13 Mechanical and climatic test methods for semiconductor devices Part 13: Salt spray

GB/T 4937.14 Mechanical and climatic test methods for semiconductor devices Part 14: Terminal strength (lead robustness)

GB/T 4937.15 Mechanical and climatic test methods for semiconductor devices Part 15: Soldering heat resistance of through-hole mounted devices

GB/T 4937.21 Mechanical and climatic test methods for semiconductor devices Part 21: Solderability

GB/T 4937.23 Mechanical and climatic test methods for semiconductor devices Part 23: High temperature operating life

GB/T 4937.26 Mechanical and climatic test methods for semiconductor devices Part 26: Electrostatic discharge (ESD) sensitivity tester Body model (HBM)

GB/T 4937.27 Mechanical and climatic test methods for semiconductor devices Part 27: Electrostatic discharge (ESD) sensitivity testing machine Machine Model (MM)

GB/T 9178 Integrated circuit terminology

GB/T 12750 Semiconductor device integrated circuits Part 11: Specifications for semiconductor integrated circuits (excluding hybrid circuits)

GB/T 17574-1998 Semiconductor devices integrated circuits Part 2: Digital integrated circuits

GB/T 17626.2-2018 Electromagnetic compatibility testing and measurement technology electrostatic discharge immunity test

GB/T 17626.4-2018 Electromagnetic compatibility test and measurement technology Electrical fast transient burst immunity test

IEC 60749-9 Mechanical and climatic test methods for semiconductor devices Part 9: Marking durability (Semiconductor

IEC 60749-24 Mechanical and climatic test methods for semiconductor devices Part 24: Accelerated moisture resistance - unbiased strongly accelerated stress test sistance-UnbiasedHAST)

IEC 60749-28 Mechanical and climatic test methods for semiconductor devices Part 28: Electrostatic discharge (ESD) susceptibility test strips