GB/T 42191-2023Test methods of the performances for MEMS piezoresistive pressure-sensitive device (English PDF)
MEMS压阻式压力敏感器件性能试验方法
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
May 23, 2023
Implementation date
September 1, 2023
Scope
GB/T 42191-2023 is the English-translated version of MEMS压阻式压力敏感器件性能试验方法.
GB/T 42191-2023 is the Chinese national standard for testing the performance of MEMS piezoresistive pressure-sensitive devices, that is, packaged devices built around a MEMS piezoresistive pressure-sensitive chip.
It first fixes the test conditions: a standard atmosphere of 15 °C to 35 °C, 20% to 80% relative humidity and 86 kPa to 106 kPa, and a standard reference atmosphere of 20 °C, 65% and 101.3 kPa, together with other environmental conditions and the test equipment.
Its contents list then covers the test items and the test methods. Among the standards it quotes are GB/T 2423.1 and GB/T 2423.2 for low and high temperature, GB/T 2423.5 for shock, GB/T 2423.22 for temperature change and GB/T 4937.12 for sweep vibration. Issued on 23 May 2023, it has applied since 1 September 2023.
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Document preview — GB/T 42191-2023
National Standard of the People's Republic of China
- ICS
- 31.080.99
- Classification
- L 59
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Preface
- 1 Scope
- 2 Normative references
- 3 Terms and Definitions
- 4 Test conditions and regulations
- 4.1 Atmospheric conditions
- 4.2 Other environmental conditions
- 4.3 Test equipment
- 5 Test items and methods
- 5.1 Test item
- 5.2 Test method
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules for Standardization Documents" drafting.
1 Scope
This document describes the test conditions and test methods for MEMS piezoresistive pressure sensitive devices.
This document applies to MEMS piezoresistive pressure sensitive devices.
2 Normative references
The contents of the following documents constitute the essential provisions of this document through normative references in the text. Among them, dated references For documents, only the version corresponding to the date is applicable to this document; for undated reference documents, the latest version (including all amendments) is applicable to this document.
GB/T 2423.1-2008 Environmental testing for electrical and electronic products - Part 2: Test methods Test A. Low temperature
GB/T 2423.2-2008 Environmental testing for electrical and electronic products - Part 2: Test methods Test B. High temperature
GB/T 2423.5 Environmental testing - Part 2: Test methods Test Ea and guidelines. Shock
GB/T 2423.22 Environmental testing - Part 2: Test methods Test N. Temperature change
GB/T 4937.12 Mechanical and climatic test methods for semiconductor devices Part 12: Frequency sweep vibration
GB/T 26111 microelectromechanical system (MEMS) technical terms
GB/T 33922 Wafer-level test method for the performance of MEMS piezoresistive pressure-sensitive chips
3 Terms and Definitions
GB/T 26111, GB/T 33922 and the following terms and definitions apply to this document.
3.1 MEMS piezoresistive pressure sensitive chip packaged device
4 Test conditions and regulations
4.1 Atmospheric conditions
Unless otherwise specified, all tests shall be carried out under the following atmospheric conditions.
a) Standard atmospheric conditions.
---Temperature. 15°C~35°C;
--- Relative humidity. 20%~80%;
---Atmospheric pressure. 86kPa~106kPa.
b) Standard reference atmospheric conditions.
---Temperature. 20°C;
--- Relative humidity. 65%;
--- Atmospheric pressure. 101.3kPa.
Note: The reference atmospheric conditions of this document are the atmospheric conditions for which the values measured under any other atmospheric conditions are corrected by calculation. Usually in most cases, no
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
Referenced standards
Normative references
- GB/T 2423.1-2008Environmental testing for electric and electronic products - Part 2: Test methods - Tests A: Cold
- GB/T 2423.2-2008Environmental testing for electric and electronic products - Part 2: Test methods - Tests B: Dry heat
- GB/T 2423.5Environmental testing - Part 2: Test methods - Test Ea and guidance: Shock
- GB/T 2423.22Environmental testing - Part 2: Test methods - Test N: Change of temperature
- GB/T 4937.12Semiconductor devices -- Mechanical and climatic test methods -- Part 12: Vibration, variable frequency
- GB/T 26111Micro-electromechanical system technology - Terms
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Related Standards
GB/T 2423.1-2008 — Environmental testing for electric and electronic products - Part 2: Test methods - Tests A: Cold
GB/T 2423.2-2008 — Environmental testing for electric and electronic products - Part 2: Test methods - Tests B: Dry heat
GB/T 2423.22-2012 — Environmental testing - Part 2: Test methods - Test N: Change of temperature
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