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GB/T 44531-2024Micro-electromechanical systems (MEMS) technology—Technical specification of automotive grade pressure sensor based on MEMS technology (English PDF)

微机电系统（MEMS）技术基于MEMS技术的车规级压力传感器技术规范

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

September 29, 2024

Implementation date

September 29, 2024

Scope

GB/T 44531-2024 is the English-translated version of 微机电系统（MEMS）技术基于MEMS技术的车规级压力传感器技术规范.

GB/T 44531-2024 is the Chinese national standard covering the MEMS pressure sensor qualified for automotive service — the application classes, the sensing types and the functional performance status classification, the media it may be exposed to, the operating and storage temperature ranges, the supply voltage, output form and measuring range, the output impedance, insulation resistance and dielectric strength, the overload and reverse-protection voltages that decide what survives a wiring fault, and the environmental tests. First edition. In force from 29 September 2024. Issued on 29 September 2024, it has been in force since 29 September 2024.

Document preview — GB/T 44531-2024

National Standard of the People's Republic of China

ICS: 31.080.99
Classification: L 59

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

PrefaceIII
1 Scope1
2 Normative references1
3 Terms and Definitions2
4 Categories2
4.1 Application Classification of Automotive-Grade Pressure Sensors2
4.2 Classification of stress perception types4
4.3 Functional Performance Status Classification (FPSC)4
5 Basic Requirements4
5.1 Type of measured medium4
5.2 Operating temperature range4
5.3 Storage temperature range5
5.4 Signal output form5
5.5 Working voltage5
5.6 Measuring range5
6 Technical Requirements5
6.1 Appearance5
6.2 Package Outline5
6.3 Output Impedance5
6.4 Insulation resistance5
6.5 Dielectric strength6
6.6 Overload voltage6
6.7 Reverse protection voltage6
6.8 Others6
6.9 Environmental characteristics6
7 Test methods7
7.1 Environmental conditions7
7.2 Performance7

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting.

Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.

This document is proposed and coordinated by the National Micro-Electromechanical Technology Standardization Technical Committee (SAC/TC336).

This document was drafted by: Peking University, China Machinery Productivity Promotion Center Co., Ltd., Anhui Jingxin Sensing Technology Co., Ltd., Beijing Zhixin Sensor Technology Co., Ltd., Wuhan University, Suzhou Nanochip Microelectronics Co., Ltd., State Grid Smart Grid Research Institute Co., Ltd., Shenzhen Speed Tengjuchuang Technology Co., Ltd., Shenzhen Meisi Advanced Electronics Co., Ltd., Zhejiang Hanbo Automotive Sensor Co., Ltd., Southeast University, Industrial and The Fifth Electronic Research Institute of the Ministry of Information Technology, Tianjin Xinzhi Perception Technology Co., Ltd., Institute of Microelectronics of the Chinese Academy of Sciences, Kunshan Shuangqiao Sensor Measurement Control Technology Co., Ltd., Wuxi China Resources Shanghua Technology Co., Ltd., Beijing Zhixin Microelectronics Technology Co., Ltd., Shanghai Baolong Automotive Technology Co., Ltd.

Co., Ltd., Suzhou Jingfang Semiconductor Technology Co., Ltd., Midea Group Co., Ltd., Xinlian Integrated Circuit Manufacturing Co., Ltd.

China Inspection Group Southern Testing Co., Ltd., Ningbo CRRC Times Sensing Technology Co., Ltd., Beijing Jiuhao Electronic Technology Co., Ltd., China Shipbuilding Industry Corporation No. 716 Research Institute, Taiyuan Aviation Instrument Co., Ltd., Shandong Zhongkesier Technology Co., Ltd., Hebei Chu Guang Auto Parts Co., Ltd., Jiangsu Furui Micro-Nano Sensing Technology Co., Ltd., Wuhan Feien Microelectronics Co., Ltd., Shenzhen Amperon Technology Co., Ltd.

Co., Ltd., Nanjing Gaohua Technology Co., Ltd., Nanjing Wotian Technology Co., Ltd., Songnuomo Technology Co., Ltd., Guangdong Run Yu Sensor Co., Ltd., Zhengzhou Weisheng Electronic Technology Co., Ltd., Shenzhen Xinwei Technology Development Co., Ltd., Wuxi Xinganzhi Semiconductor Co., Ltd., East China Institute of Optoelectronic Integrated Devices, Chongqing Wantai Electric Power Technology Co., Ltd., Henan Xinrui Electronic Technology Co., Ltd., Jiangsu Pronov Electronics Co., Ltd., Hunan Qitai Sensing Technology Co., Ltd., Jiangxi Wardell Technology Co., Ltd., Beijing Yandong Microelectronics Technology Co., Ltd.

Technology Co., Ltd., Shanghai Yingsi Sensing Technology Co., Ltd., Huajing Sensing Technology (Wuxi) Co., Ltd., Mingshi Innovation (Yantai) Micro-Nano Sensing Technology Technology Research Institute Co., Ltd., Suzhou Minxin Microelectronics Technology Co., Ltd., and Bengbu Sun and Moon Instrument Research Institute Co., Ltd.

The main drafters of this document are: Chen Demin, Li Genzi, Zhang Wei, Chen Guangzhong, Zhang Yating, Liu Sheng, Zhao Jia, Liang Xianfeng, Yang Yang, Wu Bin, Ye Xinqi, Zhou Zaifa, Dong Xianshan, Wang Shuaiyu, Zhou Weihu, Wang Bing, Zhang Xinwei, Fang Dongming, Duan Hongjun, Yang Jianhong, Xiong Guilin, Ding Huan, Lü Yang, Chai Hong, Li Hui, Yang Zhen, Chen Zhiwen, Zhao Ren, Shang Yanlong, Yao Minqiang, Wang Guanying, Huang Xinlong, Hou Xiaowei, Qian Feng, Liu Xuanjie, Chen Jinjin, Yuan Changzuo, Zhong Shengli, Liu Rui, Cao Wan, Huang Zongbo, Li Weiping, Gao Feng, Lei Weiwu, Luo Xiaoyong, Gao Shengguo, Lü Zonghan, Hua Tiankai, Wang Wenjing, Tian Yongchao, Zheng Dongming, Lu Minchen, Wang Guoqiu, Huang Liuxiao, Zhang Yanxiu, Ke Youxin, Miao Jianmin, Gao Feng, Li Gang, and Wang Rui.

Micro-electromechanical systems (MEMS) technology is based on MEMS Technical specifications for automotive-grade pressure sensors

1 Scope

This document specifies the classification, basic requirements, technical requirements and test methods for automotive-grade pressure sensors based on MEMS technology.

This document is applicable to automotive-grade pressure sensors based on MEMS technology, and other pressure sensors may refer to it.

2 Normative references

GB/T 2423.22

GB/T 2423.33

GB/T 2423.51

GB/T 4937.4

GB/T 4937.12

GB/T 4937.13

GB/T 7665

GB/T 18655

GB/T 19951

GB/T 21437.3

GB/T 26111

GB/T 28046.5

GB/T 33014.2

GB/T 33014.4

GB/T 33014.9

JJG624-2005

IEC 60749

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.

Referenced standards

Normative references

GB/T 2423.51 · GB/T 4937.4 · GB/T 4937.12 · GB/T 4937.13 · GB/T 18655 · GB/T 21437.3 · GB/T 28046.5 · GB/T 33014.2 · GB/T 33014.4 · GB/T 33014.9 · JJG624-2005 · IEC 60749

Editions of GB/T 44531

Edition	Title	Revision	Status
GB/T 44531-2024	Micro-electromechanical systems (MEMS) technology - Technical specification of automotive grade pressure sensor based on MEMS technology	current edition	Current

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