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GB/T 23611-2023Gold and gold alloy targets (English PDF)

金及金合金靶材

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

August 6, 2023

Implementation date

March 1, 2024

Scope

GB/T 23611-2023 is the English-translated version of 金及金合金靶材.

GB/T 23611-2023 covers gold and gold alloy targets used in the sputter deposition of semiconductor electronic devices. It sets the product classification, technical requirements, test methods, inspection rules, marking, packaging, transport and storage, the accompanying documents and the order form content.

Over the 2009 edition it adds the AuGe and AuGeNi alloy varieties with their requirements and test methods, the structural forms and supply states, a chemical composition table for gold targets, the welding quality, and rectangular target dimensions and deviations.

It defines target, target blank and backing plate, and cites GB/T 6394 for grain size, GB/T 8651 for ultrasonic plate wave inspection, the GB/T 11066 and GB/T 25934 analysis methods, GB/T 15077 for dimensions and YS/T 837 for the bond quality.

It replaces GB/T 23611-2009, was issued on 6 August 2023 and has applied since 1 March 2024.

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Document preview — GB/T 23611-2023

National Standard of the People's Republic of China

ICS
77.150.99
Classification
H 68
Replacing
GB/T 23611-2009

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Contents

  • Foreword
  • 1 Scope
  • 2 Normative reference documents
  • 3 Terms and definitions

Foreword

This document complies with the regulations of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents" Custom drafting.

This document replaces GB/T 23611-2009 "Gold Target". Compared with GB/T 23611-2009, except for structural adjustments and editorial changes In addition, the main technical changes are as follows:

a) Added a "Terms and Definitions" chapter (see Chapter 3);

b) Added AuGe and AuGeNi alloy target varieties (see 4.1.2);

c) Added structural form and supply status (see 4.1.4, 4.1.5);

d) Added technical requirements and test methods for AuGe and AuGeNi alloy targets (see 5.1 and 6.1);

e) Added the chemical composition list of gold targets (see 5.1);

f) Added target welding quality requirements (see 5.5);

g) The outer dimensions and allowable deviations of the gold target have been changed (see 5.6, 3.4 of the 2009 edition);

h) Added rectangular target dimensions and allowable deviation requirements (see 5.6).

1 Scope

This document stipulates the product classification, technical requirements, test methods, inspection rules and marking, packaging, transportation and storage of gold and gold alloy targets, and accompanying documents and order form contents.

This document applies to gold and gold alloy targets for semiconductor electronic devices (hereinafter referred to as "targets").

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document.

GB/T 6394 Method for determination of average grain size of metals

GB/T 8651 Ultrasonic plate wave flaw detection method for metal sheets

GB/T 11066.1 Methods for chemical analysis of gold - Determination of gold content Fire assay

GB/T 11066.10 Methods for chemical analysis of gold - Determination of silicon content Molybdenum blue spectrophotometry

GB/T 11066.11 Methods for chemical analysis of gold - Part 11: Magnesium, chromium, manganese, iron, nickel, copper, palladium, silver, tin, antimony, lead and bismuth content Determination by inductively coupled plasma mass spectrometry

GB/T 15077 Methods for measuring geometric dimensions of precious metals and their alloy materials

GB/T 25934 (all parts) Chemical analysis methods for high purity gold

YS/T 837 Ultrasonic inspection method for sputtering target-back plate bonding quality

3 Terms and definitions

The following terms and definitions apply to this document.

3.1 Target

In the cathode portion of sputter deposition technology, the cathode material is bombarded with positively charged cations in the form of molecules, atoms, or ions separated from the cathode and deposited on the anode surface.

Note: The target material consists of target blank and backing plate.

3.2 Target blank

The material used as sputter material on the cathode.

3.3 Backing plate

Material used to support or secure the target.

Note: The target blank and the backing plate can be connected by welding (such as brazing, electron beam welding, diffusion welding, etc.), mechanical compounding, bonding, etc.

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.

Referenced standards

Similar standards

Editions of GB/T 23611

EditionTitleRevisionStatus
GB/T 23611-2023Gold and gold alloy targetscurrent editionCurrent
GB/T 23611-2009Gold and gold alloy targetsprevious editionSuperseded

This page sells the current edition, GB/T 23611-2023. Earlier editions are listed for reference only.

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