GB/T 8750-2022Gold-based bonding wire and bandlet for semiconductor package (English PDF)

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules for Standardization Documents" drafting.

This document replaces GB/T 8750-2014 "Bonding Gold Wire for Semiconductor Packaging". Compared with GB/T 8750-2014, except for structural adjustment In addition to editorial changes, the main technical changes are as follows.

a) Deleted "LED package" in "Scope", changed the applicable object of the standard, from "bonding gold wire for semiconductor package" to "semiconductor package Gold-based bonding wires and ribbons for bulk discrete devices and integrated circuit packaging" (see Chapter 1, Chapter 1 of the 2014 edition);

b) The classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage of gold alloy wire and gold strip have been added and accompanying documents and purchase orders (or contracts) (see Chapter 4, Chapter 5, Chapter 6, Chapter 7, Chapter 8 and Chapter 9);

c) The classification of doped gold wire and alloy gold wire has been deleted (see 3.1 of the 2014 edition),

d) Change the type of gold wire and the arc height regulations in some applications (see Section 4.1, 3.1 of the 2014 edition);

e) Changed the expression form of the gold wire product mark (see 4.2, 3.2 of the 2014 edition);

f) Changed the chemical composition of the gold wire (see 5.1.1, 3.3 of the 2014 edition);

g) The diameter of the gold wire and its allowable deviation have been changed (see 5.2.1.1, 3.4 of the 2014 edition);

h) Increase the length of the gold wire and its allowable deviation (see 5.2.3);

i) Changed the wire winding requirements for gold wire, changing "wire winding requirements" to "winding requirements" (see 5.6, 6.6, 3.8, 4.6 of the 2014 edition);

j) Changed the feeding performance of gold wire (see 5.7, 6.7, 3.9, 4.7 of the 2014 edition);

k) Changed the arbitration analysis method for the chemical composition of gold wire (see 6.1, 4.1 of the 2014 edition);

l) Add the measurement method of gold wire length and its deviation (see 6.2);

m) The gold wire crimp inspection arbitration method has been added (see 6.5);

n) Changed the determination of gold wire inspection results (see 7.5.2, 7.5.3, 5.5.2, 5.5.3 of the 2014 edition), and deleted "but approved by both the supplier and the buyer agreed" (see 5.5.4 of the 2014 edition);

o) The gold wire surface quality inspection method has been changed (see Appendix G.2.4, Appendix B.1.2.4 of the 2014 edition).

1 Scope

This document specifies the classification and marking, technical requirements, test methods, inspection rules, marks, package Packing, transportation, storage and accompanying documents and purchase order (or contract) content.

This document is applicable to gold-based bonding wires and ribbons for semiconductor discrete devices and integrated circuit packaging.

2 Normative references

The contents of the following documents constitute the essential provisions of this document through normative references in the text. Among them, dated references For documents, only the version corresponding to the date is applicable to this document; for undated reference documents, the latest version (including all amendments) is applicable to this document.

GB/T 9288 Determination of gold content in gold alloy jewelry Ash blowing method (fire test gold method)

GB/T 10573 Tensile test method for non-ferrous metal filaments

GB/T 11066.5 Methods for chemical analysis of gold - Determination of silver, copper, iron, lead, antimony and bismuth - Atomic emission spectrometry

GB/T 15077 Geometric Dimensions Measurement Methods of Precious Metals and Their Alloys

YS/T 938.4 Chemical analysis methods of gold-based and palladium-based alloys for dental porcelain restorations - Part 4: Gold, platinum, palladium, copper, tin, indium, Determination of zinc, gallium, beryllium, iron, manganese, lithium content Inductively coupled plasma atomic emission spectrometry

3 Terms and Definitions

The following terms and definitions apply to this document.

4 Classification and labeling