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GB/T 43021-2023Workmanship requirements for rework, modification and repair of soldered electronic assemblies (English PDF)

电子组装件焊接的返工、改装和返修工艺要求

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

September 7, 2023

Implementation date

February 1, 2024

Scope

GB/T 43021-2023 is the English-translated version of 电子组装件焊接的返工、改装和返修工艺要求.

This document specifies the workmanship requirements - what is covered and the process to follow - for the rework, modification and repair of soldered electronic assemblies.

The document applies to the rework, modification and repair of the soldered electronic assemblies that connect components to printed boards, and of the related parts of the finished product; it also applies to the corresponding work on products built with mixed mounting technology, and includes guidance on the design aspects that bear on rework.

Where no confusion arises the term "rework operations" covers rework, modification and repair alike; what applies only to rework is marked as such.

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Document preview — GB/T 43021-2023

National Standard of the People's Republic of China

ICS: 31.190
Classification: L 94

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

PrefaceI
1 Scope
2 Normative reference documents
3 Terms, definitions and abbreviations
4 Rework operation
5 Rework before welding
6 Factors affecting rework after welding
7 Preparation for rework and repair after welding
8 Rework after welding
9 Selection of rework equipment, tools and methods
10 Manual rework tools and methods
11 Mechanized and programmable rework devices and methods
12 Auxiliary tools and equipment
13 Rework records
14 Training of operators and inspection personnel
15 Rework on site
Reference

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents" Drafting.

1 Scope

This document specifies the content and process requirements applicable to rework, modification and repair of electronic assembly soldering.

This document applies to rework, soldering and manufacturing of electronic assemblies that connect components to printed boards and related parts of the final product.

Modification and rework are also applicable to related work activities in the assembly of hybrid installation technology products.

This document also includes guidance on design content related to rework.

Note: Without causing confusion, the term "rework operations" in this document applies to rework, modification and rework. Operations that are only applicable to rework are marked with "Rework Operation" (Applicable to rework only)" means.

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document.

GB/T 2036 Printed circuit terminology

GB/T 4725 Copper-clad epoxy glass cloth laminates for printed circuits

GB/T 19247.1-2003 Printed board assembly Part 1: General specification for electronics using surface mounting and related assembly techniques and electrical welding assembly requirements

GB/T 19247.2-2003 Printed board assembly Part 2: Sub-specification assembly requirements for surface mount welding

GB/T 19247.3-2003 Printed board assembly Part 3: Specification requirements for through-hole mounting and welding assembly

GB/T 19247.4-2003 Printed board assembly Part 4: Requirements for lead-out soldering assembly in sub-standard specifications

GB/T 31474 Flux for high-quality internal interconnection in electronic assembly

GB/T 31475 Solder paste for high-quality internal interconnection in electronic assembly

GB/T 31476 Solder for high-quality internal interconnection in electronic assembly

GB/T 33772.1 Quality Evaluation System Part 1: Statistics and Analysis of Defects on Printed Board Assemblies

3 Terms, definitions and abbreviations

3.1 Terms and definitions

The terms and definitions defined in GB/T 2036 and below apply to this document.

3.1.1 Rework

Operations that make unqualified products comply with applicable drawing requirements or technical specifications by using the original process or changing equivalent processes.

3.1.2 Repair

The operation of restoring defective product to conform to applicable drawing requirements or specifications.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 26 pages — is available in the English PDF.

Referenced standards

Normative references

Similar standards

GB/T 47326-2026|GB/T 43059-2023

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