GB/T 19247.3-2003Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies (English PDF)
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Issued by
General Administration of Quality Supervision, Inspection and Quarantine of the People Republic of China
Level / Type
National · Recommended
Issue date
November 24, 2003
Implementation date
August 1, 2004
Scope
GB/T 19247.3-2003 (Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies) is available as an English-translated PDF.
GB/T 19247.3-2003 — Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies
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Document preview — GB/T 19247.3-2003
National Standard of the People's Republic of China
- ICS
- 31.240
- Classification
- L 94
Issued by: General Administration of Quality Supervision, Inspection and Quarantine of the People Republic of China
Contents
- What this standard covers1
- Document data2
What this standard covers
This standard specifies the lead and the through-hole soldered assemblies. This section applies to a through-hole mounting method (THT) for the overall lead with hole assembly, also applies to the use of other methods (ie: surface mount, chip assembly, termination assembly) of THT assembly parts.
Document data
International classification (ICS): 31.240.
Chinese classification (CCS): L94.
Estimated length of the Chinese original: 10,175 words.
Adopted international standard: IEC 61191-3-1998, IDT.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 7 pages — is available in the English PDF.
Referenced standards
Cited by
- GB/T 19405.3-2025Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow(THR) soldering
- GB/T 43021-2023Workmanship requirements for rework, modification and repair of soldered electronic assemblies
- GB/T 33772.1-2017Quality assessment systems -- Part 1: Registration and analysis of defects on printed board assemblies
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Related Standards
GB/T 19247.1-2003 — Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
GB/T 19247.2-2003 — Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies
GB/T 19247.4-2003 — Printed board assemblies -- Part 4: Sectional specification -- Requirements for terminal soldered assemblies
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GB/T 19247.3-2003
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