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GB/T 31476-2015Requirements for solders for high-quality interconnections in electronics assembly (English PDF)

电子装联高质量内部互连用焊料

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

May 15, 2015

Implementation date

January 1, 2016

Scope

GB/T 31476-2015 is the English-translated version of 电子装联高质量内部互连用焊料.

GB/T 31476-2015 is the Chinese standard "Requirements for solders for high-quality interconnections in electronics assembly".

Its scope clause reads: This standard specifies the standard electronic assembly interconnect with solder quality classification, technical requirements, test methods, inspection rules and product Chi, packaging, transportation, storage.

This standard applies to electronic products assembly soldered with solder, including leaded solder, lead-free solders and special solders. Its clauses include terms and definitions.

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Document preview — GB/T 31476-2015

National Standard of the People's Republic of China

ICS
29.045
Classification
H 21

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Contents

  • 1 Scope
  • 2 Normative references
  • 3 Terms and definitions
  • 4 classification and marking
  • 5 2 Technical Requirements
  • 6 Test methods
  • 7 Inspection rules
  • 8 signs, packaging, transportation and storage
  • 9 11 Quality Certificate
  • Appendix A (informative) electronic solder melting temperature of

1 Scope

This standard specifies the standard electronic assembly interconnect with solder quality classification, technical requirements, test methods, inspection rules and product

Chi, packaging, transportation, storage.

This standard applies to electronic products assembly soldered with solder, including leaded solder, lead-free solders and special solders.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein

Member. For undated references, the latest edition (including any amendments) applies to this document.

GB/T 3260 (all parts), chemical analysis of tin

GB/T 10574 (all parts), chemical analysis of tin Method

GB/T 31474 electronics assembly quality interconnect Flux

GB/T 31475 quality electronic assembly interconnect with solder paste

SJ/T 11390 Test method for lead-free solder

YS/T 746 (all parts) lead-free tin-based solders chemical analysis

ISO 9453 soft solder alloy chemical composition and morphology (Softsolderaloys-Chemicalcompositionsand forms)

3 Terms and Definitions

The following terms and definitions apply to this document.

3.1 Alloy aloy

Combination of two or more elements made of a material with metallic properties.

3.2 Solder

Melting point used for brazing alloy 450 °C lower than the connection, also known soft solder.

3.3 Leaded solder containingPbsolder

Lead content greater than 0.10% (by mass) of the solder.

3.4 Lead-free solder Pb-freesolder

Lead content of not more than 0.10% (by mass) of the solder.

3.5 Flux

In the brazing process can help promote solder flow and interfacial reaction of chemicals used.

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.

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