GB/T 31474-2015Soldering fluxes for high-quality interconnections in electronics assembly (English PDF)
电子装联高质量内部互连用助焊剂
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
May 15, 2015
Implementation date
January 1, 2016
Scope
GB/T 31474-2015 is the English-translated version of 电子装联高质量内部互连用助焊剂.
GB/T 31474-2015 is the Chinese standard "Soldering fluxes for high-quality interconnections in electronics assembly".
Its scope clause reads: This standard specifies the use of high-quality electronic assembly interconnect with flux (flux abbreviation) classification, technical requirements, test methods, inspection Identification and measurement rules for products, packaging, transportation, storage.
This standard applies to electrical and electronic PCB assembly and soldering circuit contacts with flux. Its clauses include terms and definitions.
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Document preview — GB/T 31474-2015
National Standard of the People's Republic of China
- ICS
- 29.045
- Classification
- H 21
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Introduction
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- 4 Category
- 5 requires
- 6 Test Method
- 7 Inspection rules
- 8 packaging, labeling, transportation and storage
- Appendix A (normative) of the solder paste and solder flux extraction
1 Scope
This standard specifies the use of high-quality electronic assembly interconnect with flux (flux abbreviation) classification, technical requirements, test methods, inspection
Identification and measurement rules for products, packaging, transportation, storage.
This standard applies to electrical and electronic PCB assembly and soldering circuit contacts with flux.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB 190 packaging and marking of dangerous goods
GB/T 191 Packaging - Pictorial signs
GB/T 2040 copper plate
GB/T 2423.16 Environmental testing for electric and electronic products Part 2. Test methods - Test J and guidance. Mould growth
GB/T 2423.32-2008 Environmental testing for electric and electronic products Part 2. Test methods - Test Ta. the wetting balance method
Weldability
GB/T 8145 gum rosin
GB/T 21652 Copper and copper alloy wire
3 Terms and Definitions
The following terms and definitions apply to this document.
3.1 Flux type
Classified according to the main component of the flux including rosin, resin type, organic type and inorganic type. Rosin refers to the basic component
Flux from coniferous plant extract and purified natural oleoresin, the symbol for the RO; resin-type refers to the basic component is a natural addition to gum rosin and
Flux synthetic resin, the symbol for the RE; organic type refers to the basic component of organic materials in addition to rosin and resin flux, symbol
The OR; inorganic type refers to inorganic acids and inorganic salt solution, symbol IN.
3.2 Halogen content
In order to improve the content of the flux weldability and mixed or compound added to the active substance. Chloro iodo wherein bromo are for the same test, the results of
Chlorine content meter.
3.3 Wetting
Molten solder is spread on the surface of the base metal, and the formation of a smooth layer of solder, the angle between the base metal which is less than 90 °.
3.4 Wetting time
When tested using the wetting balance method, starting from the sample into contact with the surface of the molten solder to a contact angle of 90 ° at the time, in seconds (s) dollars.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 17 pages — is available in the English PDF.
Referenced standards
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