GB/T 42837-2023Microwave semiconductor integrated circuits—Amplifier (English PDF)

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents" Drafting.

1 Scope

This document stipulates the classification, technical requirements, test methods and inspection rules of amplifiers.

This document applies to the design, manufacturing, procurement and acceptance of amplifiers designed and manufactured using semiconductor integrated circuit processes.

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document.

GB/T 4589.1 Semiconductor devices Part 10: General specifications for discrete devices and integrated circuits

GB/T 4937.3 Mechanical and climatic test methods for semiconductor devices Part 3: External visual inspection

GB/T 4937.4 Mechanical and climatic test methods for semiconductor devices Part 4: Highly accelerated steady-state hot and humid test (HAST)

GB/T 4937.11 Mechanical and climatic test methods for semiconductor devices Part 11: Rapid temperature change double liquid tank method

GB/T 4937.13 Mechanical and climatic test methods for semiconductor devices Part 13: Salt spray

GB/T 4937.14 Mechanical and climatic test methods for semiconductor devices Part 14: Terminal strength (lead robustness)

GB/T 4937.15 Mechanical and climatic test methods for semiconductor devices Part 15: Soldering heat resistance of through-hole mounted devices

GB/T 4937.21 Mechanical and climatic test methods for semiconductor devices Part 21: Solderability

GB/T 4937.23 Mechanical and climatic test methods for semiconductor devices Part 23: High temperature operating life

GB/T 4937.26 Mechanical and climatic test methods for semiconductor devices Part 26: Electrostatic discharge (ESD) sensitivity test Human Body Model (HBM)

GB/T 4937.27 Mechanical and climatic test methods for semiconductor devices Part 27: Electrostatic discharge (ESD) sensitivity test Machine Model(MM)

GB/T 9178 Integrated circuit terminology

GB/T 12750 Semiconductor device integrated circuits Part 11: Specifications for semiconductor integrated circuits (excluding hybrid circuits)

GB/T 19403.1 Semiconductor device integrated circuits Part 11: Part 1: Internal visual inspection of semiconductor integrated circuits (excluding including hybrid circuits)

GB/T 20870.1-2007 Semiconductor devices Part 16-1.Microwave integrated circuit amplifiers

SJ/T 10147 Integrated circuit anti-static packaging tube

SJ/T 11587-2016 Technical requirements for anti-static packaging of electronic products

IEC 60749-9 Mechanical and climatic test methods for semiconductor devices Part 9: Marking durability (Semiconductor

IEC 60749-24 Mechanical and climatic test methods for semiconductor devices Part 24: Accelerated moisture resistance without bias and strong accelerated stress test