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GB/T 42836-2023Microwave semiconductor integrated circuits—Frequency mixer (English PDF)

微波半导体集成电路 混频器

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

August 6, 2023

Implementation date

December 1, 2023

Scope

GB/T 42836-2023 is the English-translated version of 微波半导体集成电路 混频器.

This document specifies the classification of frequency mixers, the technical requirements they have to meet, the methods of testing their electrical characteristics and the inspection rules.

The document applies to the design, manufacture, procurement and acceptance of mixers designed and made by semiconductor integrated circuit processes.

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Document preview — GB/T 42836-2023

National Standard of the People's Republic of China

ICS
31.200
Classification
L 56

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Contents

  • Foreword
  • 1 Scope
  • 2 Normative reference documents

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents" Drafting.

1 Scope

This document stipulates the classification, technical requirements, electrical characteristics test methods and inspection rules of mixers.

This document applies to the design, manufacturing, procurement and acceptance of mixers designed and manufactured using semiconductor integrated circuit processes.

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document.

GB/T 4589.1 Semiconductor devices Part 10: General specifications for discrete devices and integrated circuits

GB/T 4937.3 Mechanical and climatic test methods for semiconductor devices Part 3: External visual inspection

GB/T 4937.4 Mechanical and climatic test methods for semiconductor devices Part 4: Highly accelerated steady-state hot and humid test (HAST)

GB/T 4937.11 Mechanical and climatic test methods for semiconductor devices Part 11: Rapid temperature change double liquid tank method

GB/T 4937.13 Mechanical and climatic test methods for semiconductor devices Part 13: Salt spray

GB/T 4937.14 Mechanical and climatic test methods for semiconductor devices Part 14: Terminal strength (lead robustness)

GB/T 4937.15 Mechanical and climatic test methods for semiconductor devices Part 15: Soldering heat resistance of through-hole mounted devices

GB/T 4937.21 Mechanical and climatic test methods for semiconductor devices Part 21: Solderability

GB/T 4937.23 Mechanical and climatic test methods for semiconductor devices Part 23: High temperature operating life

GB/T 4937.24 Mechanical and climatic test methods for semiconductor devices Part 24: Accelerated moisture resistance - Unbiased HAST

GB/T 4937.26 Mechanical and climatic test methods for semiconductor devices Part 26: Electrostatic discharge (ESD) sensitivity tester Body model (HBM)

GB/T 4937.27 Mechanical and climatic test methods for semiconductor devices Part 27: Electrostatic discharge (ESD) sensitivity testing machine Machine Model (MM)

GB/T 9178 Integrated circuit terminology

GB/T 12750 Semiconductor device integrated circuits Part 11: Specifications for semiconductor integrated circuits (excluding hybrid circuits)

GB/T 17573-1998 Semiconductor devices Discrete devices and integrated circuits Part 1: General principles

GB/T 19403.1 Semiconductor device integrated circuits Part 11: Part 1: Internal visual inspection of semiconductor integrated circuits (excluding including hybrid circuits)

QB/T 3811 plastic packing tape

SJ/T 10147 Integrated circuit anti-static packaging tube

SJ/T 11587 Technical requirements for anti-static packaging of electronic products

IEC 60749-9 Mechanical and climatic test methods for semiconductor devices Part 9: Marking durability (Semiconductor

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 27 pages — is available in the English PDF.

Referenced standards

Normative references

QB/T 3811 · SJ/T 10147 · IEC 60749-9

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