GB/T 17472-2022Specification for pastes of precious metal used for microelectronics (English PDF)

1 Scope

GB/T 17472-2022 is the Chinese national standard on specification for pastes of precious metal used for microelectronics, in the field of metallurgy. The /T suffix marks it as a recommended standard: it is not compulsory by itself, but it becomes binding as soon as a contract, a tender or a customer specification calls it up - which in practice is how most foreign buyers meet it. It was issued on 14 October 2022 by the State Administration for Market Regulation; Standardization Administration of China, and has been in force since 1 May 2023. Classification: ICS 77.150.99, CCS H68. This page is published from the official record of the standard held by the Chinese standards administration: the identification, the dates, the classification and the issuing body are taken from there. The clause text, the tables and the numeric limits are in the document itself, which is delivered complete in English translation.

This document specifies the classification, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, accompanying documents, and order form content of precious metal pastes for microelectronics technology. This document applies to sintering pastes and curable pastes of precious metal for microelectronics technology (hereinafter referred to as "pastes"). This document can also be a reference to the application of non-precious metal pastes.

2 Normative references

The following documents contain the provisions which, through normative reference in this document, constitute the essential provisions of this document. For the dated referenced documents, only the versions with the indicated dates are applicable to this document; for the undated referenced documents, only the latest version (including all the amendments) is applicable to this document.

GB/T 6739 Paints and varnishes - Determination of film hardness by pencil test

GB/T 13452.2 Paints and varnishes - Determination of film thickness

GB/T 17473.1 Test methods of precious metals pastes used for microelectronics - Determination of solids content

GB/T 17473.2 Test methods of precious metals pastes used for microelectronics - Determination of fineness

GB/T 17473.3 Test methods of precious metals pastes used for microelectronics - Determination of sheet resistance

GB/T 17473.4 Test methods of precious metals pastes used for microelectronics - Determination of adhesion

GB/T 17473.5 Test methods of pastes used for microelectronics - Determination of viscosity

GB/T 17473.6 Test methods of precious metal pastes used for microelectronics - Determination of resolution

GB/T 17473.7 Test methods of precious metals pastes used for microelectronics - Part 7: Determination of solderability and solder leaching resistance

3 Terms and definitions

The following terms and definitions apply to this document.

3.1 sintering pastes of precious metal A slurry or paste that is suitable for printing or coating and consists of powders of precious metals or their compounds, additives, and organic vehicles.

Note: At a certain temperature (400 °C~1600 °C), it can be sintered with the substrate to form an inorganic functional phase.

3.2 curable pastes of precious metal A slurry or paste that is suitable for printing or coating and consists of powder, flake powder of precious metals or their compounds, inorganic additives, organic additives, organic resins, and organic solvents.

Note: It can be cured and adhere to a substrate at a certain temperature (25 °C~400 °C) or under the irradiation of ultraviolet light (electromagnetic waves with a wavelength of 100 nm~400 nm) or under the irradiation of electron beam radiation (the energy of electrons is 30 keV~300 keV) to form a functional phase.

3.3 solids content After the paste is burned at 750 °C, the ratio of the mass of the remaining substance to the mass of the sample, which is expressed in mass fraction. (It is applicable to sintering pastes.) After the paste is heated at a certain temperature (25 °C~400 °C) or irradiated under ultraviolet light (electromagnetic waves with a wavelength of 100 nm~400 nm) or the electron beam radiation (the energy of electrons is 30 keV~300 keV) to become constant in weight, the ratio of the mass of the remaining substance to the mass of the sample, which is expressed in mass fraction. (It is applicable to curable pastes.) represented by C. c

--- Usages of the paste. C means the conductive paste; R means the resistive paste. d

--- Metal phase composition. The chemical element symbol is used to indicate the metal name, and the number after the element symbol indicates the mass fraction of the metal in the metal phase. e

--- Product number. Each manufacturer defines the product number by itself according to actual needs. Example: PSC-Ag80Pd20-0120 represents the sintering silver-palladium conductive paste that contains 80% silver and 20% palladium, and its product number is 0120.

5 Technical requirements

5.1 Appearance quality The paste shall be a slurry or paste of uniform color.

5.2 Performance indicators The main technical indicators of the paste include solids content, fineness, sheet resistance, adhesion, viscosity, resolution, solderability, soldering resistance, hardness and thickness of the cured film, and both the supplier and the buyer shall reach an agreement on other acceptable technical indicators.

6 Test methods

6.1 The inspection of various indicators of the paste shall be carried out in an environment with a temperature of 15 °C~35 °C, relative humidity of 45%~75%, and an atmospheric pressure of 86 kPa~106 kPa.

6.2 Visual inspection is used for appearance quality.

6.3 The solids content test shall be carried out according to the provisions of GB/T 17473.1.

6.4 The fineness test shall be carried out according to the provisions of GB/T 17473.2.

6.5 The sheet resistance test shall be carried out according to the provisions of GB/T 17473.3.

6.6 The adhesion test shall be carried out according to the provisions of GB/T 17473.4.

6.7 The viscosity test shall be carried out according to the provisions of GB/T 17473.5.

6.8 The resolution test shall be carried out according to the provisions of GB/T 17473.6.

6.9 The solderability and soldering resistance tests shall be carried out in accordance with the provisions of GB/T 17473.7.

6.10 The hardness test of the cured film shall be carried out in accordance with the provisions of GB/T 6739.

6.11 The thickness test of the cured film shall be carried out according to the provisions of GB/T 13452.2.

6.12 Other testing contents and testing methods shall be agreed upon by the supplier and the buyer.

8 Marking, packaging, transportation, storage, and accompanying documents...