GB/T 17473.1-2008Test methods of precious metals pastes used for microelectronics -- Determination of solids content (English PDF)

Foreword

This standard is an integrated revision of GB/T 17473-1998 " Test methods of

precious metal pastes used for thick film microelectronics" (all parts). It is

divided into 7 parts:

- GB/T 17473.1-2008 Test methods of precious metals pastes used for

microelectronics - Determination of solids content;

- GB/T 17473.2-2008 Test methods of precious metals pastes used for

microelectronics - Determination of fineness;

- GB/T 17473.3-2008 Test methods of precious metals pastes used for

microelectronics - Determination of sheet resistance;

- GB/T 174743.4-2008 Test methods of precious metals pastes used for

microelectronics - Determination of adhesion;

- GB/T 174743.5-2008 Test methods of pastes used for microelectronics -

Determination of viscosity;

- GB/T 174743.6-2008 Test methods of precious metal pastes used for

microelectronics - Determination of resolution;

- GB/T 174743.7-2008 Test methods of precious metals pastes used for

microelectronics - Determination of solderability and solderleaching

resistance.

This Part is Part 1 of GB/T 17473-2008.

This part replaces GB/T 17473.1-1998 "Test methods of precious metal pastes

used for thick film microelectronics - Determination of solids content".

Compared with GB/T 17473.1-1998, this Part mainly has the following changes:

- CHANGE the original standard name into "Test methods of precious metals

pastes used for microelectronics - Determination of solids content";

- DELETE the reference document GB/T 2421-1989;

- ADD the determination of solid content of polymer low-temperature curing

paste;

- For polymer low-temperature solidification paste, DETERMINE the

temperature for detected solid content, according to the different use

temperature of the paste;

Test methods of precious metals pastes used for

microelectronics - Determination of solids content

1 Scope

This Part specifies the test method for the solid content in the precious metal

paste, for microelectronics technology.

This Part applies to the determination of the solid content of precious metal

pastes, for various sintered and solidified microelectronics technologies.

2 Normative references

The provisions in following documents become the provisions of this Part

through reference in this Part. For the dated references, the subsequent

amendments (excluding corrections) or revisions do not apply to this Part;

however, parties who reach an agreement based on this Part are encouraged

to study if the latest versions of these documents are applicable. For undated

references, the latest edition of the referenced document applies.

GB/T 8170 Rules of rounding off for numerical values & expression and

judgement of limiting values

3 Method principle

The precious metal paste is heated at a certain temperature, for a certain period

of time. The solid content is determined, according to the mass difference,

before and after heating.

4 Instruments and equipment