JB/T 6175-2020Process specification for lead forming of electronic components (English PDF)
电子元器件引线成型工艺规范
This is a limited preview
Buy now to download the full PDF (15 pages)
Need quotation for your management?
Get a formal quotation for JB/T 6175-2020 in 30 minutes.
Issued by
MIIT
Level / Type
Industry · Recommended
Issue date
December 9, 2020
Implementation date
April 1, 2021
Scope
JB/T 6175-2020 is the English-translated version of 电子元器件引线成型工艺规范.
JB/T 6175-2020 is a recommended machinery industry standard of China governing the lead forming process for electronic components.
It gives terms and definitions, the purpose of the process, the environmental conditions and the preliminary preparation, then the requirements for the forming technical parameters, for the forming of the component leads, for the forming operations themselves and for the inspection carried out once the components have been formed.
It applies to the lead forming of components, and components belonging to integrated circuits are left outside its field. It is filed under Chinese classification N06 and ICS 19, and it quotes GB 50169-2016. It replaces JB/T 6175-1992.
Found what you need?
Document preview — JB/T 6175-2020
National Standard of the People's Republic of China
- Replacing
- JB/T 6175-1992
Issued by: Ministry of Industry and Information Technology of the People's Republic of China
1 Foreword
JB/T 6175-2020 was issued by Ministry of Industry and Information Technology of the People's Republic of China on 9 December 2020 and has been in force since 1 April 2021.
2 Scope
This standard is a recommended machinery industry standard of China governing the lead forming process for electronic components. It gives terms and definitions, the purpose of the process, the environmental conditions and the preliminary preparation, then the requirements for the forming technical parameters, for the forming of the component leads, for the forming operations themselves and for the inspection carried out once the components have been formed. It applies to the lead forming of components, and components belonging to integrated circuits are left outside its field. It is filed under Chinese classification N06 and ICS 19, and it quotes GB 50169-2016. It replaces JB/T 6175-1992.
3 Normative references
JB/T 6175-2020 cites the following standards, which apply in full or in part through the references made to them in its clauses.
GB 50169-2016 — Code for construction and acceptance of grounding connection electric equipment installation engineering
4 About this standard
Issued by: Ministry of Industry and Information Technology of the People's Republic of China
English translation: about 15 pages
5 Classification and status
Prefix JB/T: recommended standard.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
Referenced standards
Similar standards
Editions of JB/T 6175
| Edition | Title | Revision | Status |
|---|---|---|---|
| JB/T 6175-2020 | Process specification for lead forming of electronic components | current edition | Current |
| JB/T 6175-1992 | Process specification for lead forming of electronic components | previous edition | Superseded |
This page sells the current edition, JB/T 6175-2020. Earlier editions are listed for reference only.
How to Download JB/T 6175-2020
- 1
Add to cart
Click "Download PDF" on this page and choose "Buy this standard". You can add more standards before checkout.
- 2
Checkout
Enter your email and billing details. Payment is processed securely by Stripe (cards or bank transfer). Prefer bank details? Request a quotation (min. order $300).
- 3
Instant delivery (0–9 sec)
Delivery is automatic: within seconds of payment you'll receive an email with a secure download link. The link stays valid for 72 hours.
- 4
Invoice included
A tax invoice is attached to the confirmation email. Need a custom invoice? Contact us.
Related Standards
GB 50169-2016 — Code for construction and acceptance of grounding connection electric equipment installation engineering
JB/T 10062-2026 — Probes used in ultrasonic flaw detection - Testing methods for performance
JB/T 10096-2026 — Cases for power semiconductor devices - Selection guidance
Secure payment via Stripe
Payments accepted
JB/T 6175-2020
$270.00