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GB/Z 41275.22-2023Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines (English PDF)

航空电子过程管理含无铅焊料航空航天及国防电子系统第22部分：技术指南

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Issued by

State Administration for Market Regulation, China National Standardization Administration

Level / Type

National · Recommended

Issue date

December 28, 2023

Implementation date

July 1, 2024

Scope

GB/Z 41275.22-2023 is the English-translated version of 航空电子过程管理含无铅焊料航空航天及国防电子系统第22部分：技术指南.

GB/Z 41275.22-2023 is the Chinese standard "Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines".

Its scope clause reads: This document provides technical guidance for the transition to lead-free electronic products, mainly including technical paths, general performance of lead-free solder, system-level Operating environment, high-performance electronic product testing, solder joint reliability, components, printed circuit boards, printed circuit boards (PCB)/printed circuit boards (PWB) assembly, module assembly, wire/cable assembly, rework/repair, general product life test, similarity analysis, etc: This document is applicable to aerospace, defense and high-performance electronics applications and other high-performance and high-reliability industries for reference use:.

Its clauses include normative reference documents; terms, definitions and abbreviations.

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Document preview — GB/Z 41275.22-2023

National Standard of the People's Republic of China

ICS: 49.025.01
Classification: V 25

Issued by: State Administration for Market Regulation, China National Standardization Administration

Preface
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technical Path
5 General properties of lead-free solder
6 System-level usage environment
7 High performance electronic product testing
8 Solder joint reliability
9 parts
10 Printed circuit board
11 Printed Circuit Board (PCB)/Printed Wiring Board (PWB) Assembly
12 Module Assembly
13 Wire/Cable Assembly
14 Rework/Fix
15 General product life test
16 Similarity analysis
Appendix A (informative) Structural changes of this document compared with IEC /T S62647-22:201
Appendix B (informative) Technical differences and reasons between this document and IEC /T S62647-22:2013
Appendix C (informative) Equipment usage environment definition

1 Scope

This document provides technical guidance for the transition to lead-free electronic products, mainly including technical paths, general performance of lead-free solder, system-level

Operating environment, high-performance electronic product testing, solder joint reliability, components, printed circuit boards, printed circuit boards (PCB)/printed circuit boards (PWB) assembly, module assembly, wire/cable assembly, rework/repair, general product life test, similarity analysis, etc:

This document is applicable to aerospace, defense and high-performance electronics applications and other high-performance and high-reliability industries for reference use:

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text: Among them, dated citations

For documents, only the version corresponding to the date applies to this document; for undated referenced documents, the latest version (including all modification orders) applies in this document:

GB/T 41275:2-2022 Avionics process management Aerospace and defense electronic systems containing lead-free solder Part 2: Reduction

Harmful effects of less tin (IEC /T S62647-2:2012, MOD)

GB/T 41275:3-2022 Avionics process management Aerospace and defense electronic systems containing lead-free solder Part 3: Including

System performance test method for lead-free solders and lead-free pins (IEC TS62647-3:2014, MOD)

IEC /T S62647-1:2012 Avionics process management Aerospace and defense electronic systems containing lead-free solders Part 1: None taininglead-freesolder-Part 1:Preparationforalead-freecontrolplan)

GEIA-HB-0005-4 Guidelines for Reliability Assessment of Lead-Free Assemblies for Aerospace and High-Performance Electronics Applications (Guidelinesfor

PracticesGuideline)

3 Terms, definitions and abbreviations

3:1 Terms and definitions

The following terms and definitions apply to this document:

3:1:1

Alloy compositionaloycomposition

The total composition of an alloy, defined by weight as a percentage:

Note: For example, 63Sn-37Pb is equivalent to a mixture of 63% (by weight) tin and 37% (by weight) lead:

GB/T 28878.10 | GB/T 28878.9 | GB/Z 41275.4 | GB/Z 41275.23 | GB/T 41275.2 | […]

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 104 pages — is available in the English PDF.

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