GB/Z 41275.4-2023Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array(BGA) re-balling (English PDF)

GB/Z 41275.4-2023 is the English-translated version of 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第4部分：球栅阵列植球.

GB/Z 41275.4-2023 is the Chinese standard "Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array(BGA) re-balling".

Its scope clause reads: This document specifies the requirements for replacement ball components in the context of the Electronic Component Management Program (ECMP) for aerospace, defense and high-reliability products: Requirements for solder balls on gate array (BGA) component packages: Note 1: IEC TS62239-1 and EIA-STD-4899 describe the Electronic Component Management Procedure (ECMP): This document does not apply to column grid array (CGA) components or chip-scale components: This document describes two types of bulbs: For other bulb types, please refer to Appendix A for tailoring: ---Balling type 1: BGA package, using tin-lead balls compatible with the tin-lead soldering assembly process for re-balling; ---Balling type 2: BGA package, using lead-free balls compatible with lead-free soldering assembly process for re-balling: The purpose of this document is to provide the bulbing manufacturer with information that can be incorporated into an existing process, or to establish, implement and maintain a new process, or to create a stand-alone bulbing process: Management requirements and technical requirements for ball technology: This document is intended for reference by ball removal/ball replacement manufacturers and customers, especially for avionics original equipment manufacturers (OEMs); this document The document defines requirements for ball placement manufacturers serving the aerospace, defense, high-performance and high-reliability electronics industries: This document also contains requirements for coding validation of new BGA devices: This document confirms the creation of new The necessity of coding covers the process and testing requirements of the ball removal/ball planting process: This document encourages the implementation of automated processes to better control removal Balling/balling process: In order to comply with the requirements of this document, ball planting manufacturers should have the necessary knowledge, experience and tools and customize their own methods as needed: The customer can determine the scope of this document and whether complete replacement of existing solder balls is necessary: If some application scenarios are beyond this article Special requirements specified in the documents may be separately specified: This document assumes procedures and workmanship for management, quality, manufacturing, safety, calibration, training, and all tools and The equipment is all ready, and the procedures and processes related to ball removal/ball planting equipment will no longer be described: Note 2: In this document, if the term "BGA" is used alone, it is called "BGA component": Note 3: This document does not specifically specify whether to replace the damaged tin lead ball with a new tin lead ball or replace the damaged lead-free ball with a new lead-free ball, but some parts of this document A table of sub-contents and tailoring requirements (see Appendix A) can be used to guide this type of operation: This document is applicable to aerospace, defense and high-performance electronics applications, and is a reference for other high-performance and high-reliability electronics industries:. Its clauses include normative reference documents.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 71 pages — is available in the English PDF.

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