GB/Z 41275.4-2023Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array(BGA) re-balling (English PDF)

Foreword

This document complies with the provisions of GB/T 1:1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents"

Drafting:

This document is Part 4 of GB/T (Z) 41275 "Aviation Electronics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder"

point: GB/T (Z)41275 has released the following parts:

---Part 2: Reducing the harmful effects of tin;

---Part 3: System performance test methods containing lead-free solder and lead-free pins;

---Part 4: Ball Grid Array Ball Planting;

---Part 21: Transition Guide to Lead-Free Electronics;

---Part 22: Technical Guidelines;

---Part 23: Guidelines for rework/repair of lead-free and mixed electronic products:

This document is equivalent to IEC TS62647-4:2018 "Aviation electronics process management containing lead-free solder for aerospace and defense electronics systems"

System Part 4: Ball Grid Array Ball Planting", the file type is adjusted from IEC 's technical specifications to my country's national standardization guiding technology

document:

This document has made the following minimal editorial changes:

---Deleted IPCJ-STD-002 and IPC/JEDECJ-STD- in the "Normative Reference Documents" that are not normatively cited later:

035, 2:3:25 in IPC-TM-650, JEDECJESD22-A101, JEDECJESD22-B101, JEDECJESD22-

B117, JEDECJESD213, MIL-STD-883, and write "References":

Please note that some content in this document may be subject to patents: The publisher of this document assumes no responsibility for identifying patents:

Introduction

GB/T (Z) 41275 specifies the management and technical requirements for lead-free aerospace, national defense and high-performance electronic systems:

Consists of 7 parts:

---Part 1: Preparation of lead-free control plan: The purpose is to provide for lead-free control of programming of aerospace, defense and high-performance electronic systems:

plan goals and requirements:

---Part 2: Reducing the harmful effects of tin: The purpose is to regulate aerospace, defense and high-performance electronic systems to reduce the harmful effects of tin:

The technical methods adopted for the impact:

---Part 3: System performance test methods containing lead-free solder and lead-free pins: The purpose is to regulate lead-free solder and lead-free tubing

Performance test methods and test procedures for aerospace, defense, and high-performance electronic systems:

---Part 4: Ball Grid Array Ball Planting: The purpose is to regulate aerospace, defense and high-performance electrical products containing lead-free solder and lead-free leads:

Requirements for subsystem replacement of ball grid array (BGA) component solder balls:

---Part 21: Transition Guide to Lead-Free Electronics: The purpose is to provide for aerospace and defense electronic system project management or system

A guide for engineering management to manage the transition to lead-free electronics:

---Part 22: Technical Guidelines: The purpose is to provide for aerospace, defense and high-performance electronic systems to ensure continued performance, quality,

Technical guidance for reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability:

---Part 23: Guidelines for rework/repair of lead-free and mixed electronic products: The purpose is to specify aerospace, defense and high performance electronics

Technical guidelines for disassembly and replacement of parts (including components) during system rework/repair:

As a result of the RoHS directive, soldering assembly processes have shifted primarily from tin-lead to lead-free, and most BGA component manufacturing

Manufacturers have switched from tin-lead solder balls to lead-free solder balls: This will introduce recordable reliability issues: In the case of lead-containing soldering processes, a

The solution is to replace the lead-free solder balls on BGA components with tin-lead solder balls, which prevents mixing of solder alloys:

This document is intended to standardize the requirements and guidelines for solder ball replacement on applicable BGA components: The requirements in this document are derived from existing lines

industry standards and collaboration documents between service providers and customers (usually avionics original equipment manufacturers):

This document is intended for use by bulbing manufacturers and customers to incorporate these requirements into their operations to provide consistent and well-controlled

process, or create a debulking/bulking management plan to enhance their existing process:

There are two main reasons for removing/reballing BGA components: alloy compatibility and replacing damaged solder balls:

Customers need to understand the potential risks during the deballing/balling process of BGA components in specific packages:

In order to avoid reliability problems, the BGA component deballing/balling process needs to be confirmed and strictly controlled to prevent BGA components from being deballed after balling:

The component fails: Generally speaking, automated processes make a positive contribution to achieving this goal and are promoted in the electronics industry:

This document does not guarantee the specific yield or reliability of BGA components that have gone through the deballing/balling process: Need to evaluate BGA components

Compatibility of the construction and materials used with the solder balling process to ensure the reliability and integrity of the BGA components are maintained:

Because the transition to lead-free (Pb-free) electronics is dynamic, this document and other similar documents are based on the best available information and expertise:

Written based on professional knowledge, this document may be considered for updates as future knowledge and data become available:

Avionics Process Management

Aerospace and defense electronic systems containing lead-free solder

Part 4: Ball Grid Array Ball Installation

1 Scope

This document specifies the requirements for replacement ball components in the context of the Electronic Component Management Program (ECMP) for aerospace, defense and high-reliability products:

Requirements for solder balls on gate array (BGA) component packages:

Note 1: IEC TS62239-1 and EIA-STD-4899 describe the Electronic Component Management Procedure (ECMP):

This document does not apply to column grid array (CGA) components or chip-scale components:

This document describes two types of bulbs: For other bulb types, please refer to Appendix A for tailoring:

---Balling type 1: BGA package, using tin-lead balls compatible with the tin-lead soldering assembly process for re-balling;

---Balling type 2: BGA package, using lead-free balls compatible with lead-free soldering assembly process for re-balling:

The purpose of this document is to provide the bulbing manufacturer with information that can be incorporated into an existing process, or to establish, implement and maintain a new process, or to create a stand-alone bulbing process:

Management requirements and technical requirements for ball technology:

This document is intended for reference by ball removal/ball replacement manufacturers and customers, especially for avionics original equipment manufacturers (OEMs); this document

The document defines requirements for ball placement manufacturers serving the aerospace, defense, high-performance and high-reliability electronics industries:

This document also contains requirements for coding validation of new BGA devices: This document confirms the creation of new

The necessity of coding covers the process and testing requirements of the ball removal/ball planting process: This document encourages the implementation of automated processes to better control removal

Balling/balling process:

In order to comply with the requirements of this document, ball planting manufacturers should have the necessary knowledge, experience and tools and customize their own methods as needed:

The customer can determine the scope of this document and whether complete replacement of existing solder balls is necessary: If some application scenarios are beyond this article

Special requirements specified in the documents may be separately specified:

This document assumes procedures and workmanship for management, quality, manufacturing, safety, calibration, training, and all tools and

The equipment is all ready, and the procedures and processes related to ball removal/ball planting equipment will no longer be described:

Note 2: In this document, if the term "BGA" is used alone, it is called "BGA component":

Note 3: This document does not specifically specify whether to replace the damaged tin lead ball with a new tin lead ball or replace the damaged lead-free ball with a new lead-free ball, but some parts of this document

A table of sub-contents and tailoring requirements (see Appendix A) can be used to guide this type of operation:

This document is applicable to aerospace, defense and high-performance electronics applications, and is a reference for other high-performance and high-reliability electronics industries:

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text: Among them, the dated quotations

For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to

this document:

IEC 61340-5-1 Electrostatics Part 5-1: General requirements for the protection of electronic equipment from electrostatic phenomena

requirements)

Note: GB/T 37977:51-2023 Electrostatics Part 5-1: General requirements for electrostatic protection of electronic devices (IEC 61340-5-1:2016, IDT)

IEC /T R61340-5-2 Electrostatics Part 5-2: User Guide for the Protection of Electronic Equipment from Electrostatic Phenomena (Electro-