GB/Z 41275.23-2023Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies (English PDF)
航空电子过程管理 含无铅焊料航空航天及国防电子系统 第23部分:无铅及混装电子产品返工/修复指南
This is a limited preview
Buy now to download the full PDF (64 pages)
Need quotation for your management?
Get a formal quotation for GB/Z 41275.23-2023 in 30 minutes.
Issued by
State Administration for Market Regulation, China National Standardization Administration
Level / Type
National · Recommended
Issue date
December 28, 2023
Implementation date
July 1, 2024
Scope
GB/Z 41275.23-2023 is the English-translated version of 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第23部分:无铅及混装电子产品返工/修复指南.
GB/Z 41275.23-2023 is the Chinese standard "Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies".
Its scope clause reads: This document provides technical background, procurement guidance, engineering procedures, and guidance to assist organizations developing aerospace and high-performance electronic systems Rework/repair, whether assembled or returned using conventional alloys (Sn-Pb or lead-free alloys) or a combination of solder and surface plating Worked/repaired system: This document contains a review of known effects and issues and rework/repair procedures, with an emphasis on service technicians performing tasks: Provide technical architecture for the service: This document provides guidelines for component removal and replacement: The term "rework/repair" in this document is as defined in 3:1:29 and 3:1:30 use: The information contained in this document is based on the current knowledge of the industry at the time of publication: Due to the rapid changes in the knowledge base, this document is for guidance only: Note 1: In this document, if the element "lead" is implied, then Pb, lead (Pb) or tin-lead will be used: If referring to component terminals or terminal "leads" such as flat package or dual in-line package, the term lead/terminal or lead-terminal will be used: Note 2: The processes identified in this document are suitable for rework or repair: This document is applicable to the aerospace and defense electronic system industries, and other high-performance and high-reliability industries can be used as a reference:.
Its clauses include normative reference documents; terms, definitions and abbreviations.
Found what you need?
Document preview — GB/Z 41275.23-2023
National Standard of the People's Republic of China
- ICS
- 49.025.01
- Classification
- V 25
Issued by: State Administration for Market Regulation, China National Standardization Administration
Contents
- Preface
- Introduction
- 1 Scope
- 2 Normative references
- 3 Terms, definitions and abbreviations
- 4 Lead-free related issues
- 5 materials
- 6 Welding equipment
- 7 Rework/Repair Considerations
- 8 Rework/repair preprocessing
- 9 Rework/Fix
- 10 Rework/Post-repair processing
- Appendix A (informative) Terminal plating
- Appendix B (informative) Tin Whisker
1 Scope
This document provides technical background, procurement guidance, engineering procedures, and guidance to assist organizations developing aerospace and high-performance electronic systems
Rework/repair, whether assembled or returned using conventional alloys (Sn-Pb or lead-free alloys) or a combination of solder and surface plating
Worked/repaired system: This document contains a review of known effects and issues and rework/repair procedures, with an emphasis on service technicians performing tasks:
Provide technical architecture for the service:
This document provides guidelines for component removal and replacement: The term "rework/repair" in this document is as defined in 3:1:29 and 3:1:30 use:
The information contained in this document is based on the current knowledge of the industry at the time of publication: Due to the rapid changes in the knowledge base, this document is for guidance only:
Note 1: In this document, if the element "lead" is implied, then Pb, lead (Pb) or tin-lead will be used: If referring to component terminals or terminal "leads" such as flat package or dual in-line package, the term lead/terminal or lead-terminal will be used:
Note 2: The processes identified in this document are suitable for rework or repair:
This document is applicable to the aerospace and defense electronic system industries, and other high-performance and high-reliability industries can be used as a reference:
2 Normative reference documents
The contents of the following documents constitute essential provisions of this document through normative references in the text: Among them, dated citations
For documents, only the version corresponding to the date applies to this document; for undated referenced documents, the latest version (including all modification orders) applies in this document:
IEC /T S62647-1:2012 Avionics process management Aerospace and defense electronic systems containing lead-free solders Part 1: None taininglead-freesolder-Part 1:Preparationforalead-freecontrolplan)
3 Terms, definitions and abbreviations
3:1 Terms and definitions
The following terms and definitions apply to this document:
3:1:1
Alloy compositionaloycomposition
The total composition of an alloy, defined by weight as a percentage:
Note: For example, 63Sn-37Pb is equivalent to a mixture of 63% tin (by weight) and 37% lead (by weight):
[Source: GB /Z 41275:22-2023,3:1:1]
GB/T 28878.10 | GB/T 28878.9 | GB/Z 41275.4 | GB/Z 41275.22 | GB/T 41275.3 | […]
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 64 pages — is available in the English PDF.
How to Download GB/Z 41275.23-2023
- 1
Add to cart
Click "Download PDF" on this page and choose "Buy this standard". You can add more standards before checkout.
- 2
Checkout
Enter your email and billing details. Payment is processed securely by Stripe (cards or bank transfer). Prefer bank details? Request a quotation (min. order $300).
- 3
Instant delivery (0–9 sec)
Delivery is automatic: within seconds of payment you'll receive an email with a secure download link. The link stays valid for 72 hours.
- 4
Invoice included
A tax invoice is attached to the confirmation email. Need a custom invoice? Contact us.
Related Standards
GB/Z 41275.22-2023 — Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
GB/Z 41275.4-2023 — Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array(BGA) re-balling
GB/Z 41275.1-2026 — Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
Secure payment via Stripe
Payments accepted
GB/Z 41275.23-2023
$455.00